Module Development Engineer Jobs
Module Development Engineer jobs are open from new-grad to senior and principal levels across semiconductor, automotive, and industrial automation, with specializations in FPGA design, power module engineering, and embedded systems integration. Scan the live roles below and apply to whichever ones fit.
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Showing 5 of 23+ Module Development Engineer jobs
Job Details:
Job Description:
At Intel, we create world-changing technology that improves the life of every person on the planet. Join Intel's Substrate Packaging Technology Development (SPTD) organization, a global leader in developing advanced substrate and packaging solutions. Our team is dedicated to enabling Intel's roadmap of innovative packaging technologies, focusing on materials development, process optimization and simulation, and process equipment advancements. SPTD supports Intel's mission of delivering high-performance, cost-effective products that power the future of computing.
We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a key part in advancing Intel's IC substrate and packaging technologies. You will develop, optimize, and implement innovative processes, materials, and equipment configurations to enable next-generation packaging solutions. Combining physical experimentation with statistical data analytics and process modeling, your work will directly impact manufacturing efficiency, product quality, and reliability across Intel's advanced packaging portfolio.
Key Responsibilities:
- Process & Material Optimization: Develop and refine packaging processes and materials to meet stringent quality, reliability, yield, and cost targets.
- Workflow & Equipment Definition: Define and establish equipment configurations, process parameters, and integrated workflows for advanced IC substrate and packaging technologies.
- Experimental Characterization (DOE): Design and execute experimental plans using Design of Experiments (DOE) principles to characterize process windows and analyze complex material and equipment interactions.
- Data Analytics & Process Modeling: Apply statistical methods, deep data analytics, and engineering scripting tools to optimize manufacturing processes, drive material enhancements, and resolve IC substrate development challenges.
- Continuous Improvement: Implement continuous process improvements to enhance tool stability, product quality, and manufacturing productivity.
- Cross-Functional Problem Solving: Partner with cross-functional engineering, materials, and equipment teams to drive process development and root-cause troubleshooting initiatives.
- Technical Documentation & Transfer: Author technical documentation, including white papers and process specifications, to enable seamless technology transfer and knowledge sharing across global teams.
As a Successful Candidate, You Will Bring:
- Technical Leadership & Influence: Strong leadership skills to guide cross-functional engineering efforts and drive technical alignment across diverse teams.
- Analytical Problem Solving: Deep analytical mindset with a passion for combining empirical data and theoretical modeling to solve complex materials and processing challenges.
- Clear Technical Communication: Concise written and verbal communication style to author specifications, publish internal white papers, and present findings to stakeholders. Adaptability & Ownership: Self-directed engineer who thrives in a dynamic R&D environment and takes full accountability for project milestones.
Apply today to join Intel Arizona's Substrate Packaging Technology Development team. Take ownership of next-generation materials and processes, collaborate with world-class scientists, and build a rewarding engineering career.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.
Minimum Qualifications:
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or a related field, with 6+ years of related experience; OR
- Master's degree in the above fields, with 4+ years of related experience; OR
- PhD in the above fields, with 2+ years of related experience.
- Relevant experience can be any of the following:
- Design of Experiments (DOE), statistical data analysis, and process control tools.
- Understanding of IC substrate and/or advanced packaging processing principles. Engineering programming tools like JMP, Python, MATLAB, or similar software for process modeling and/or data analysis.
Preferred Qualifications
- 3+ years of experience in:
- Dielectric materials formulation (structure/property relations expertise) and/or processing.
- Finite Element Analysis (FEA) modeling tools such as COMSOL, Ansys, etc.
- Machine learning or artificial intelligence applications for engineering scenarios. Designing experimental setups to validate modeling and simulation outputs.
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Arizona, PhoenixAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.Job Details:
Job Description:
At Intel, we create world-changing technology that improves the life of every person on the planet. Join Intel's Substrate Packaging Technology Development (SPTD) organization, a global leader in developing advanced substrate and packaging solutions. Our team is dedicated to enabling Intel's roadmap of innovative packaging technologies, focusing on materials development, process optimization and simulation, and process equipment advancements. SPTD supports Intel's mission of delivering high-performance, cost-effective products that power the future of computing.
We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a key part in advancing Intel's IC substrate and packaging technologies. You will develop, optimize, and implement innovative processes, materials, and equipment configurations to enable next-generation packaging solutions. Combining physical experimentation with statistical data analytics and process modeling, your work will directly impact manufacturing efficiency, product quality, and reliability across Intel's advanced packaging portfolio.
Key Responsibilities:
- Process & Material Optimization: Develop and refine packaging processes and materials to meet stringent quality, reliability, yield, and cost targets.
- Workflow & Equipment Definition: Define and establish equipment configurations, process parameters, and integrated workflows for advanced IC substrate and packaging technologies.
- Experimental Characterization (DOE): Design and execute experimental plans using Design of Experiments (DOE) principles to characterize process windows and analyze complex material and equipment interactions.
- Data Analytics & Process Modeling: Apply statistical methods, deep data analytics, and engineering scripting tools to optimize manufacturing processes, drive material enhancements, and resolve IC substrate development challenges.
- Continuous Improvement: Implement continuous process improvements to enhance tool stability, product quality, and manufacturing productivity.
- Cross-Functional Problem Solving: Partner with cross-functional engineering, materials, and equipment teams to drive process development and root-cause troubleshooting initiatives.
- Technical Documentation & Transfer: Author technical documentation, including white papers and process specifications, to enable seamless technology transfer and knowledge sharing across global teams.
As a Successful Candidate, You Will Bring:
- Technical Leadership & Influence: Strong leadership skills to guide cross-functional engineering efforts and drive technical alignment across diverse teams.
- Analytical Problem Solving: Deep analytical mindset with a passion for combining empirical data and theoretical modeling to solve complex materials and processing challenges.
- Clear Technical Communication: Concise written and verbal communication style to author specifications, publish internal white papers, and present findings to stakeholders. Adaptability & Ownership: Self-directed engineer who thrives in a dynamic R&D environment and takes full accountability for project milestones.
Apply today to join Intel Arizona's Substrate Packaging Technology Development team. Take ownership of next-generation materials and processes, collaborate with world-class scientists, and build a rewarding engineering career.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.
Minimum Qualifications:
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or a related field, with 6+ years of related experience; OR
- Master's degree in the above fields, with 4+ years of related experience; OR
- PhD in the above fields, with 2+ years of related experience.
- Relevant experience can be any of the following:
- Design of Experiments (DOE), statistical data analysis, and process control tools.
- Understanding of IC substrate and/or advanced packaging processing principles. Engineering programming tools like JMP, Python, MATLAB, or similar software for process modeling and/or data analysis.
Preferred Qualifications
- 3+ years of experience in:
- Dielectric materials formulation (structure/property relations expertise) and/or processing.
- Finite Element Analysis (FEA) modeling tools such as COMSOL, Ansys, etc.
- Machine learning or artificial intelligence applications for engineering scenarios. Designing experimental setups to validate modeling and simulation outputs.
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Arizona, PhoenixAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.Module Development Engineer Jobs by Experience Level
See All 23 Module Development Engineer Jobs
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Who's Hiring
- Intel Corporation20
- Nokia1
- LG Electronics1
- Monolithic Power Systems1
What Employers Look For
The qualifications that appear most often in module development engineer jobs.
- Bachelor's degree in electrical engineering, electronics engineering, or a closely related field
- Experience with schematic capture and PCB layout tools such as Altium or Cadence
- Proficiency in circuit simulation using SPICE-based tools or MATLAB
- Hands-on experience with module characterization, testing, and validation
- Familiarity with industry standards such as IPC, ISO 26262, or IEC 61508
- Strong documentation skills for design reviews, test reports, and release packages
Tips for Your Module Development Engineer Job Search
Tailor your resume to module specifications
Highlight the specific module types you've designed or tested, such as power converters, RF modules, or FPGA boards. Recruiters scan for exact hardware experience, so generic 'hardware engineering' descriptions will get passed over for candidates who name their deliverables precisely.
List your simulation and design tools explicitly
Job postings for this role almost always filter by tools. Call out SPICE variants, Cadence, Altium, Mentor Graphics, or MATLAB by name in a dedicated skills section so automated screening doesn't filter you out before a human reviews your application.
Apply early to roles that fit
Migrate Mate lists module development engineer openings from across the United States in one place, so you can find roles that match and apply directly to each listing.
Target postings that match your module lifecycle stage
Some teams need engineers for early-stage schematic capture and prototyping, others for characterization, qualification, and release. Read postings carefully and apply to roles that match where you have the most depth, since interviewers will probe that stage intensively.
Prepare a sample failure analysis walkthrough
Technical interviews for this role routinely include a failure mode and effects analysis scenario. Walk through a real module failure you diagnosed, what root cause you identified, and how the design was corrected. Concrete examples close offers that generic answers lose.
Negotiate around tape-out or prototype milestones
Start date flexibility matters here because teams often need engineers available before a critical build cycle. If you have competing offers, use milestone timing as a negotiation lever alongside compensation, since managers frequently have more schedule flexibility than budget flexibility.
Module Development Engineer Jobs: Frequently Asked Questions
Which companies are hiring the most module development engineers?
The most active employers for module development engineers right now are Intel Corporation, Nokia, and LG Electronics, and the most openings are in Oregon, Arizona, and Michigan, based on current listings on Migrate Mate as of November 2026. Semiconductor manufacturers, automotive Tier 1 suppliers, and industrial automation companies account for the largest share of postings.
How many module development engineer jobs are remote?
About 88% of module development engineer openings are fully remote or hybrid as of November 2026, which is lower than many engineering disciplines because the role often requires hands-on lab access and physical prototyping. Software-adjacent work such as firmware integration, simulation modeling, and documentation review tends to be the most remote-friendly portion of the role.
How do you become a module development engineer?
Start with a bachelor's degree in electrical or electronics engineering, then build hands-on experience through internships or entry-level roles focused on PCB design, circuit simulation, or hardware validation. Develop proficiency in at least one industry-standard design tool and one simulation environment. Working on a full module lifecycle from schematic through characterization and release is the experience most hiring managers look for before moving a candidate to a senior title.
Can you get a module development engineer job with little experience?
Yes, entry-level module development engineer roles exist, but they almost always require demonstrated hands-on hardware work. A senior capstone project involving PCB design, a personal electronics build with documented test results, or a lab internship where you ran characterization tests all carry weight. Applying to roles labeled 'associate' or 'junior' and emphasizing any direct component-level or prototype experience you have gives you the strongest starting position.
What does the module development engineer interview process look like?
The process typically starts with a recruiter screen focused on tool experience and module types you've worked on, followed by a technical phone or video interview covering circuit fundamentals, design tradeoffs, and failure analysis. Final rounds usually include a panel with the hardware team, a practical design exercise or take-home schematic review, and a conversation with the hiring manager about your approach to validation and documentation before a module reaches release.
Where can I find and apply to module development engineer jobs?
You can find and apply to module development engineer jobs on Migrate Mate, which lists current openings from across the United States. Search for roles that match your hardware background and seniority level, then apply directly to each listing that fits your experience.
See All 23 Module Development Engineer Jobs
Find roles that match your experience and apply in just a few clicks.
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