Packaging Engineer Jobs in Austin, TX
Packaging Engineer jobs in Austin, Texas are available now at employers like Apple, Tesla, and Amazon and other local employers, from entry level to senior. See the openings below and apply to the ones that match your experience.
Find Packaging Engineer JobsOverview
Open roles18
Top employerApple
Work type100% On-site
Top credentialBachelor's
Companies hiring5
Showing 5 of 18+ Packaging Engineer jobs
Integrated Circuit Packaging Architect
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Added 3d ago
AMD
Integrated Circuit Packaging Architect
Austin, Texas
Added 3d ago
Sr. Packaging Engineer
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Added 1w ago
Tesla
Sr. Packaging Engineer
Austin, Texas
Added 1w ago
Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs
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Added 1w ago
Amazon Web Services
Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs
Austin, Texas
Added 1w ago
Mechanical Engineer, Packaging Engineering
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Added 2w ago
Tesla
Mechanical Engineer, Packaging Engineering
Austin, Texas
Added 2w ago
Project Manager, WWGS Marketing Operations - Packaging
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Added 1mo ago
Amazon.com
Project Manager, WWGS Marketing Operations - Packaging
Austin, Texas
Added 1mo ago
Added 3d ago
Integrated Circuit Packaging Architect
AMD·Austin, Texas
Bachelor's
5,001-10,000 employees
Job Description
Overview:
This role is not eligible for visa sponsorship.
#LI-HYBRID
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
Responsibilities:
The Role:
Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications. Successful candidate would lead cross functional teams across geos in designing and developing novel package architectures and processes. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze and identify solutions.
The Person:
The candidate should have a proven track record of driving technology development in semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management
Responsibilities:
- Work with product architects in early definition stage to understand and define package architectures, roadmap
- Lead new package technology development initiatives from concept to full technology qualification
- Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines
- Establish Yield roadmap and lead implementation of yield, data analytic tools as need
Preferred Experience:
- Experience in semiconductor technology development role
- Experience working with manufacturing partners such as suppliers, OSATs and foundry partners.
- In-depth knowledge in material science, thin film process development, and/or packaging
- Experience in a leadership role driving cross-functional teams
- Proven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment
Education:
BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent
This role is not eligible for visa sponsorship.
#LI-HYBRID
#LI-AP1
Qualifications:
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
AMD
Integrated Circuit Packaging Architect
Austin, Texas
Added 3d ago5,001-10,000 employees
Bachelor's
Job Description
Overview:
This role is not eligible for visa sponsorship.
#LI-HYBRID
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
Responsibilities:
The Role:
Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications. Successful candidate would lead cross functional teams across geos in designing and developing novel package architectures and processes. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze and identify solutions.
The Person:
The candidate should have a proven track record of driving technology development in semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management
Responsibilities:
- Work with product architects in early definition stage to understand and define package architectures, roadmap
- Lead new package technology development initiatives from concept to full technology qualification
- Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines
- Establish Yield roadmap and lead implementation of yield, data analytic tools as need
Preferred Experience:
- Experience in semiconductor technology development role
- Experience working with manufacturing partners such as suppliers, OSATs and foundry partners.
- In-depth knowledge in material science, thin film process development, and/or packaging
- Experience in a leadership role driving cross-functional teams
- Proven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment
Education:
BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent
This role is not eligible for visa sponsorship.
#LI-HYBRID
#LI-AP1
Qualifications:
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
See All 18 Packaging Engineer Jobs in Austin
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Find Packaging Engineer JobsPackaging Engineer Job Market in Austin
Who's Hiring
- Apple12
- Tesla2
- Amazon2
- AMD1
- Amazon Web Services1
Top Industries Hiring
- Electronics & Hardware13
- Retail2
- Manufacturing2
- Technology & Software2
- E-Commerce & Online Marketplaces2
Packaging Engineer Jobs in Austin: Frequently Asked Questions
How many packaging engineer jobs are there in Austin?
There are 18+ packaging engineer openings in Austin, Texas on Migrate Mate as of June 2026. New positions post regularly as Austin employers hire.
Which companies hire packaging engineers in Austin?
Companies currently hiring packaging engineers in Austin include Apple, Tesla, and Amazon, per current listings on Migrate Mate as of June 2026.
Are there remote packaging engineer jobs in Austin?
Yes. About 0% of packaging engineer openings tied to Austin are remote or hybrid as of June 2026. The rest are on-site roles based in and around Austin.
Which industries hire the most packaging engineers in Austin?
The sectors hiring the most packaging engineers in Austin are Electronics & Hardware, Retail, and Manufacturing, based on current listings on Migrate Mate as of June 2026.
See All 18 Packaging Engineer Jobs in Austin
Find roles in Austin that match your experience and apply in just a few clicks.
Find Packaging Engineer Jobs