Principal Technologist Jobs
Principal Technologist jobs are open across defense, enterprise software, telecommunications, and healthcare technology, from senior engineer to distinguished fellow level, with specializations in cloud architecture, AI/ML systems, and embedded platforms. Find a role that fits below and apply directly.
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Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.
We are looking for a Principal Packaging Integration Engineer who can do two things exceptionally well: drive technically sound packaging architecture decisions and be the trusted engineering partner our customers rely on to bring those decisions to life.
This is not a support role. You will own your programs — technically and commercially — from architecture through qualification, pulling together design, process, quality, test, and supply chain into decisions that are smart, manufacturable, and on schedule.
If you are a seasoned packaging engineer who has outgrown pure technical execution and wants a role where your judgment, relationships, and technical depth all matter equally — this was written for you.
Key Responsibilities
- Drive packaging architecture decisions and IC-PKG-PCB co-design for FPGA, embedded SoC, and custom ASIC programs spanning 2.5D/3D, OPC, and MOP technologies.
- Lead DFM and DFMEA reviews and packaging supply qualification, partnering with OSAT/substrate suppliers on manufacturable, reliable, application-ready solutions.
- Serve as the primary customer-facing contact for assigned programs — representing the packaging organization and translating customer requirements into internal technical direction.
- Organize and lead cross-functional task forces across silicon design, packaging, SI/PI, thermal-mechanical, quality and reliability test, and supply chain to resolve issues, align decisions, and keep programs on schedule.
- Proactively fill gaps between functional groups and track commitments to genuine closure.
- Build durable, trusted relationships with customers and internal partners through responsive, patient, detail-oriented follow-through.
Qualifications
- Expert-level experience in semiconductor packaging technology integration, with working knowledge of 2.5D/3D integration, OPC, MOP, and IC-PKG-PCB co-design and co-development.
- Strong experience with DFM/DFMEA/PFMEA and packaging supply qualification (OSAT/substrate/materials partners).
- Demonstrated experience engaging customers directly and coordinating cross-functional task forces to closure.
- Fluent, confident communicator with both engineering teams and customers; detail-oriented, patient, and customer-driven.
- Willing to step out to fill gaps between functional groups and drive issues to closure.
- Bachelor's or Master's degree in Electrical, Materials, Mechanical, or Semiconductor Engineering, or a related field.
Preferred Skills
- Strong knowledge of SoC architecture and critical IP blocks (SerDes, PHYs, memory controllers, I/O subsystems) and how they drive packaging and interconnect requirements.
- Familiarity with IC-package-PCB co-design and analysis tools (e.g., Cadence, Synopsys, Ansys, or equivalent EDA platforms).
- Familiarity with UCIe (Universal Chiplet Interconnect Express) and other die-to-die/chiplet interconnect standards.
- Experience with signal integrity and power integrity (SI/PI) analysis across the package and board interconnect.
- Understanding of high-speed I/O interface design considerations at the package level.
- Familiarity with DDR/memory interface routing, timing, and packaging constraints.
- Experience with power plane and PDN (power delivery network) optimization across silicon, package, and board.
- Ability to evaluate design considerations and trade-offs (performance, cost, manufacturability, reliability, schedule) and communicate them clearly to both engineering and customer stakeholders.
#LI-BW2
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.
We are looking for a Principal Packaging Integration Engineer who can do two things exceptionally well: drive technically sound packaging architecture decisions and be the trusted engineering partner our customers rely on to bring those decisions to life.
This is not a support role. You will own your programs — technically and commercially — from architecture through qualification, pulling together design, process, quality, test, and supply chain into decisions that are smart, manufacturable, and on schedule.
If you are a seasoned packaging engineer who has outgrown pure technical execution and wants a role where your judgment, relationships, and technical depth all matter equally — this was written for you.
Key Responsibilities
- Drive packaging architecture decisions and IC-PKG-PCB co-design for FPGA, embedded SoC, and custom ASIC programs spanning 2.5D/3D, OPC, and MOP technologies.
- Lead DFM and DFMEA reviews and packaging supply qualification, partnering with OSAT/substrate suppliers on manufacturable, reliable, application-ready solutions.
- Serve as the primary customer-facing contact for assigned programs — representing the packaging organization and translating customer requirements into internal technical direction.
- Organize and lead cross-functional task forces across silicon design, packaging, SI/PI, thermal-mechanical, quality and reliability test, and supply chain to resolve issues, align decisions, and keep programs on schedule.
- Proactively fill gaps between functional groups and track commitments to genuine closure.
- Build durable, trusted relationships with customers and internal partners through responsive, patient, detail-oriented follow-through.
Qualifications
- Expert-level experience in semiconductor packaging technology integration, with working knowledge of 2.5D/3D integration, OPC, MOP, and IC-PKG-PCB co-design and co-development.
- Strong experience with DFM/DFMEA/PFMEA and packaging supply qualification (OSAT/substrate/materials partners).
- Demonstrated experience engaging customers directly and coordinating cross-functional task forces to closure.
- Fluent, confident communicator with both engineering teams and customers; detail-oriented, patient, and customer-driven.
- Willing to step out to fill gaps between functional groups and drive issues to closure.
- Bachelor's or Master's degree in Electrical, Materials, Mechanical, or Semiconductor Engineering, or a related field.
Preferred Skills
- Strong knowledge of SoC architecture and critical IP blocks (SerDes, PHYs, memory controllers, I/O subsystems) and how they drive packaging and interconnect requirements.
- Familiarity with IC-package-PCB co-design and analysis tools (e.g., Cadence, Synopsys, Ansys, or equivalent EDA platforms).
- Familiarity with UCIe (Universal Chiplet Interconnect Express) and other die-to-die/chiplet interconnect standards.
- Experience with signal integrity and power integrity (SI/PI) analysis across the package and board interconnect.
- Understanding of high-speed I/O interface design considerations at the package level.
- Familiarity with DDR/memory interface routing, timing, and packaging constraints.
- Experience with power plane and PDN (power delivery network) optimization across silicon, package, and board.
- Ability to evaluate design considerations and trade-offs (performance, cost, manufacturability, reliability, schedule) and communicate them clearly to both engineering and customer stakeholders.
#LI-BW2
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
Principal Technologist Jobs by Experience Level
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Find Principal Technologist JobsPrincipal Technologist Job Market
Who's Hiring
Top Industries Hiring
- Technology & Software
- Electronics & Hardware
- Education
- Hospitality & Tourism
What Employers Look For
The qualifications that appear most often in principal technologist jobs.
- 10 or more years of progressive software engineering or systems architecture experience
- Demonstrated experience defining and driving organization-wide technical strategy
- Deep expertise in cloud platforms such as AWS, Azure, or Google Cloud
- Proven ability to mentor and develop senior and staff-level engineers
- Experience leading cross-functional technical initiatives from conception through production
- Bachelor's or master's degree in computer science, electrical engineering, or a related field
Tips for Your Principal Technologist Job Search
Align your resume to technical roadmaps
Principal technologist roles expect you to have shaped product or platform direction, not just delivered features. Reframe your resume bullets around architectural decisions you owned, technical strategies you defined, and the measurable outcomes those choices produced.
Apply early to roles that fit
Migrate Mate lists principal technologist openings from across the United States in one place, so you can find roles that match and apply directly to each listing.
Distinguish your scope from staff engineers
Many hiring committees confuse principal technologist and staff engineer. Make it explicit on your resume and in cover letters that your influence is cross-team or org-wide, not confined to a single product area or engineering group.
Target companies with active platform bets
Job postings for this level tend to open when a company is rebuilding a core platform or entering a new technical domain. Search for employers announcing major infrastructure investments or cloud migrations, then apply before those openings close quickly.
Prepare a system design narrative, not slides
Interviews for principal technologist roles often include an open-ended architecture session. Practice walking through a past system design decision aloud, covering trade-offs you rejected, constraints you worked within, and how you aligned stakeholders on the final direction.
Negotiate scope before you negotiate compensation
At this level, your reporting line, decision-making authority, and budget ownership vary dramatically between companies. Before discussing offer details, clarify what technical domains you will own and whether the role carries executive visibility.
Principal Technologist Jobs: Frequently Asked Questions
Which companies are hiring the most principal technologists?
UCLA Health, Dell Technologies, and Drivenets are hiring the most principal technologists right now, with openings concentrated in California, Texas, and Idaho, based on current listings on Migrate Mate as of November 2026. Demand is highest in organizations scaling cloud infrastructure or building out AI-driven product lines.
How many principal technologist jobs are remote?
About 69% of principal technologist openings are fully remote or hybrid as of November 2026, reflecting the seniority and independence the role carries. Sub-areas focused on cloud architecture, developer tooling, and AI platform development tend to have the highest remote availability, while embedded systems and hardware-adjacent roles more often require on-site presence.
How do you become a principal technologist?
Most principal technologists move up from staff or senior engineer roles by consistently taking on work that crosses team boundaries. Build a record of architectural decisions with documented outcomes, grow your influence with non-engineering stakeholders, and lead at least one initiative that changes how your organization builds or operates at scale. Publishing technical writing or speaking at conferences accelerates recognition of your expertise.
Can you get hired as a principal technologist without prior principal-level experience?
Yes, but you need to demonstrate principal-level impact even if the title was different. Focus your application on projects where you set technical direction for multiple teams, resolved critical architectural trade-offs with significant cost or reliability implications, or introduced a platform capability the organization now depends on. Titles matter less to experienced hiring managers than the scope of decisions you have already made.
What does the principal technologist interview process look like?
The process typically runs four to six rounds and includes a recruiter screen, a hiring manager conversation focused on your technical vision and leadership philosophy, one or more deep-dive architecture or system design sessions, a cross-functional loop with product and engineering leaders, and a final executive interview. Some companies add a written case study or ask you to present a past technical strategy to a panel.
Where can I find and apply to principal technologist jobs?
You can find and apply to principal technologist jobs on Migrate Mate, which lists current openings from across the United States. Find roles that match your background and apply directly to each listing from the page.
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