Photonics Engineer Visa Sponsorship Jobs in New York
New York is one of the leading states for photonics engineer roles, with major employers concentrated in the Hudson Valley, Rochester, and Long Island corridors. Companies like II-VI Incorporated, Corning, and defense contractors along the I-90 corridor regularly hire photonics engineers and have established H-1B visa and O-1 visa sponsorship histories.
Find Photonics Engineer JobsOverview
Showing 5 of 20+ Photonics Engineer Jobs in New York with Visa Sponsorship
See all Photonics Engineer Jobs in New York with Visa Sponsorship
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Photonics Engineer Jobs in New York with Visa Sponsorship.
Get Access To All JobsJob Description
Number of Positions: 2
Duration: 4 months
Date: Sept 2026 - Dec 2026
Location: Onsite in Sunnyvale, CA, or New York, NY
Education Recommendations
Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.
How You Will Contribute And What You Will Learn
We are searching for a Silicon Photonics Packaging Co-op for our Fall 2026 Term to engage in the research and development of silicon photonics transceiver modules.
- Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
- Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
- Own Design Rules documents and ensure Design for Manufacturing specifications are met.
- Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
- Drive package debug activities during product validation and qualification.
- Plan and Drive prototype assembly builds to enable deliveries for early design validation.
- Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.
Key Skills And Experience
- Experience with package and process design/development from design to production.
- Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
- Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/3D packages.
- Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
- Experience in high-speed electronics package design and/or laser package design.
- Experience with thermo-mechanical simulations using ANSYS or similar software.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
- Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
About us
Advancing connectivity to secure a brighter world.
Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.
Our recruitment process
We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect. If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity. The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates.
About The Team
Some of our benefits for students in the US:
- Flexible and hybrid working schemes to balance study, work, and life
- Professional development events and networking opportunities
- Well-being programs, including Personal Support Service 24/7 - a confidential support channel open to all Nokia employees and their families in challenging situations
- Opportunities to join Nokia Employee Resource Groups (NERGs) and build connections across the organization
- Employee Growth Solutions, mentorship programs, and coaching support for your career development
- A learning environment that fosters both personal growth and professional development – for your role and beyond
Disclaimer for US/Canada
Nokia maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.
All North America job posts will post for a minimum of 3 calendar days and up to 180 days or until candidate/s identified.
Job Description
Number of Positions: 2
Duration: 4 months
Date: Sept 2026 - Dec 2026
Location: Onsite in Sunnyvale, CA, or New York, NY
Education Recommendations
Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.
How You Will Contribute And What You Will Learn
We are searching for a Silicon Photonics Packaging Co-op for our Fall 2026 Term to engage in the research and development of silicon photonics transceiver modules.
- Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
- Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
- Own Design Rules documents and ensure Design for Manufacturing specifications are met.
- Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
- Drive package debug activities during product validation and qualification.
- Plan and Drive prototype assembly builds to enable deliveries for early design validation.
- Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.
Key Skills And Experience
- Experience with package and process design/development from design to production.
- Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
- Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/3D packages.
- Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
- Experience in high-speed electronics package design and/or laser package design.
- Experience with thermo-mechanical simulations using ANSYS or similar software.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
- Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
About us
Advancing connectivity to secure a brighter world.
Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.
Our recruitment process
We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect. If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity. The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates.
About The Team
Some of our benefits for students in the US:
- Flexible and hybrid working schemes to balance study, work, and life
- Professional development events and networking opportunities
- Well-being programs, including Personal Support Service 24/7 - a confidential support channel open to all Nokia employees and their families in challenging situations
- Opportunities to join Nokia Employee Resource Groups (NERGs) and build connections across the organization
- Employee Growth Solutions, mentorship programs, and coaching support for your career development
- A learning environment that fosters both personal growth and professional development – for your role and beyond
Disclaimer for US/Canada
Nokia maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.
All North America job posts will post for a minimum of 3 calendar days and up to 180 days or until candidate/s identified.
Photonics Engineer Job Roles in New York
See all Photonics Engineer Jobs in New York
Sign up for free to filter by visa type, set job alerts, and find employers with verified sponsorship history.
Search Photonics Engineer Jobs in New YorkPhotonics Engineer Jobs in New York: Frequently Asked Questions
Which companies sponsor visas for photonics engineers in New York?
New York has a strong base of photonics and optical technology employers with documented H-1B sponsorship histories. Corning Incorporated in Corning, II-VI Incorporated facilities in the Hudson Valley, and defense contractors such as Raytheon and Northrop Grumman on Long Island regularly file LCAs for photonics engineer roles. Research institutions affiliated with universities like Columbia and RPI also sponsor international engineers through H-1B and O-1 visa pathways.
Which visa types are most common for photonics engineer roles in New York?
The H-1B is the most common visa for photonics engineers in New York, as the role qualifies as a specialty occupation requiring at least a bachelor's degree in optical engineering, physics, or a related field. The O-1A is an alternative for engineers with published research, patents, or significant industry recognition. Some defense-sector roles may also support employment-based green card sponsorship through the PERM process.
How to find photonics engineer visa sponsorship jobs in New York?
Migrate Mate lets you filter photonics engineer roles specifically to New York and surfaces employers with active or historical visa sponsorship records. Because sponsorship availability is not always stated in standard job postings, using Migrate Mate to identify companies that have filed LCAs for photonics or optical engineering positions in New York saves significant research time and helps you prioritize applications strategically.
Which cities in New York have the most photonics engineer sponsorship jobs?
Rochester is the most concentrated hub for photonics engineering employment in New York, historically rooted in the optical industry through companies like Corning and legacy Kodak-affiliated spinoffs. The Hudson Valley corridor, including companies near Albany and Kingston, also has notable photonics activity. Long Island, particularly around Melville and Hauppauge, hosts defense and aerospace employers that hire photonics engineers with active sponsorship programs.
Are there state-specific considerations for photonics engineers seeking visa sponsorship in New York?
New York employers sponsoring H-1B workers must meet DOL prevailing wage requirements specific to the New York metropolitan area or upstate regions, which differ from national averages. Photonics engineers in research-heavy roles affiliated with universities such as Stony Brook or Cornell may access cap-exempt H-1B filings. New York's strong university pipeline, particularly through RPI and the University of Rochester's Institute of Optics, also means employers are accustomed to hiring and sponsoring international graduates in this discipline.
What is the prevailing wage for sponsored photonics engineer jobs in New York?
U.S. employers sponsoring a visa must pay at least the prevailing wage, which is what workers in the same role, area, and experience level typically earn. The Department of Labor sets this rate to make sure companies aren't hiring foreign workers simply because they'd accept lower pay than a U.S. worker. It varies by job title, location, and experience. You can look up current prevailing wage rates for any occupation and location using the OFLC Wage Search page.