Engineering Jobs at TSMC with Visa Sponsorship
TSMC's engineering roles span process integration, equipment engineering, and advanced semiconductor R&D. The company has a consistent track record of sponsoring international engineers across multiple visa categories, making it a realistic target for skilled candidates who need work authorization to build a career in U.S. chip manufacturing.
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Get Access To All JobsModule Engineering Managers
TSMC is looking for managers in the following modules: CMP, CVD, Diffusion, Epitaxy, Etch (Dry), Etch (Wet), Lithography, Metrology, and PVD. At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. If you believe in building a future together with us and have the same passion to pursue excellence, you will find your fit here. TSMC Arizona is looking for Module Engineering Manager(s) to join our 4-nanometer fab, located in sunny Phoenix, Arizona. As a Module Engineering Manager, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.
Chemical Mechanical Polishing (CMP), Senior Engineering Manager
Responsibilities Include:
- Module process and equipment fundamental improvements
- Work with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery.
CVD Manager (ASM Equipment Manager)
Responsibilities Include:
- Elevate engineering and manufacturing excellence in the Chemical Vapor Deposition department.
Diffusion Engineering Manager
Responsibilities Include:
- Elevate engineering and manufacturing excellence in the Diffusion department
- Module process and equipment fundamental improvements
- Innovate and seize opportunities for wafer quality and productivity improvement
- Work with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery
- Proactively identify talent and continuously develop team members with a deliberate road map
Dry Etch Equipment Manager
Responsibilities Include:
- Work with mother Fab ETC team to fingerprint all ETC tools to ensure seamless technology transfers.
- New production line set up and maintenance.
- Equipment troubleshooting.
- Resource planning, task prioritization, and related cross-function management work to move-in, install and qualify tools.
Wet Etch & Clean Manager
Responsibilities Include:
- Work with the mother Fab WET team to fingerprint all WET processes and/or tools to ensure seamless technology transfers.
- Plan resources, prioritize tasks, and perform in a cross-function team to move-in, install and qualify tools/processes.
- Monitor process/equipment performance indices and establish good controls to maintain HMV wafer output.
- Establish workflow, corrective action and prevention plans for HVM process/equipment issues.
- Improve productivity through rigorous SOP system control, and process/equipment optimization.
Lithography EUV Process Manager
Responsibilities Include:
- Ensure that production line is operating 7x24 and meets all quality standards
- Hire/Manage a team of engineers/technicians
- Establish effective defense mechanisms to ensure EUV/DUV photomask quality, including defectivity and pattern performance.
- Develop and implement process improvements to increase yield and reduce costs.
- Collaborate with equipment suppliers to ensure equipment performance meets process requirements.
Lithography EUV Hardware Manager - Scanner
Responsibilities Include:
- Ensure that the EUV Scanner is operating 7x24 at peak performance and meets all quality and safety standards
- Hire/Manage a team of engineers/technicians
- Collaborate with other departments to ensure that EUV scanner is integrated into the overall manufacturing process
- Manage budgets and resource allocation for EUV scanner team
- Establish clear expectations and encourage continuous improvement to tool vendors
Metrology Manager
Responsibilities Include:
- Accountable for the execution of the instrumentation/calibrations and metrology services and activities in the site
- Leads the execution of Metrology activities in accordance to stipulated production schedule and compliance requirements
- Accountable of the Instrumentation/Calibrations group to assure that required process, laboratories, utilities and facilities equipment calibrations are performed in compliance with NIST, cGMP regulations, company policies and procedures and meet Federal and local governmental regulation (e.g. FDA, EQB, OSHA, etc.)
- Defect/yield match activity to mother fab
- During ramp and manufacturing, own driving defect, yield, and productivity improvements to meet business goals
PVD Manager
Responsibilities Include:
- Elevate engineering and manufacturing excellence in the Physical Vapor Deposition department
- Innovate and seize opportunities for wafer quality and productivity improvement
- Work with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery
- Equipment troubleshooting
Requirements For All Module Managers Are:
- 2 years of experience in people management & development
- 8 years of overall experience in semiconductor industry
- BS degree in an engineering field
- Weekend on-duty and phone availability during off-work hours
Please Note: Applicants must be legally eligible to work in the United States. This position is located on-site at our Phoenix, AZ Fab21: 5088 W Innovation Cir. Phoenix, AZ. This position will require training both in Arizona and overseas in Taiwan for a short period of time.
Module Engineering Managers
TSMC is looking for managers in the following modules: CMP, CVD, Diffusion, Epitaxy, Etch (Dry), Etch (Wet), Lithography, Metrology, and PVD. At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. If you believe in building a future together with us and have the same passion to pursue excellence, you will find your fit here. TSMC Arizona is looking for Module Engineering Manager(s) to join our 4-nanometer fab, located in sunny Phoenix, Arizona. As a Module Engineering Manager, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.
Chemical Mechanical Polishing (CMP), Senior Engineering Manager
Responsibilities Include:
- Module process and equipment fundamental improvements
- Work with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery.
CVD Manager (ASM Equipment Manager)
Responsibilities Include:
- Elevate engineering and manufacturing excellence in the Chemical Vapor Deposition department.
Diffusion Engineering Manager
Responsibilities Include:
- Elevate engineering and manufacturing excellence in the Diffusion department
- Module process and equipment fundamental improvements
- Innovate and seize opportunities for wafer quality and productivity improvement
- Work with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery
- Proactively identify talent and continuously develop team members with a deliberate road map
Dry Etch Equipment Manager
Responsibilities Include:
- Work with mother Fab ETC team to fingerprint all ETC tools to ensure seamless technology transfers.
- New production line set up and maintenance.
- Equipment troubleshooting.
- Resource planning, task prioritization, and related cross-function management work to move-in, install and qualify tools.
Wet Etch & Clean Manager
Responsibilities Include:
- Work with the mother Fab WET team to fingerprint all WET processes and/or tools to ensure seamless technology transfers.
- Plan resources, prioritize tasks, and perform in a cross-function team to move-in, install and qualify tools/processes.
- Monitor process/equipment performance indices and establish good controls to maintain HMV wafer output.
- Establish workflow, corrective action and prevention plans for HVM process/equipment issues.
- Improve productivity through rigorous SOP system control, and process/equipment optimization.
Lithography EUV Process Manager
Responsibilities Include:
- Ensure that production line is operating 7x24 and meets all quality standards
- Hire/Manage a team of engineers/technicians
- Establish effective defense mechanisms to ensure EUV/DUV photomask quality, including defectivity and pattern performance.
- Develop and implement process improvements to increase yield and reduce costs.
- Collaborate with equipment suppliers to ensure equipment performance meets process requirements.
Lithography EUV Hardware Manager - Scanner
Responsibilities Include:
- Ensure that the EUV Scanner is operating 7x24 at peak performance and meets all quality and safety standards
- Hire/Manage a team of engineers/technicians
- Collaborate with other departments to ensure that EUV scanner is integrated into the overall manufacturing process
- Manage budgets and resource allocation for EUV scanner team
- Establish clear expectations and encourage continuous improvement to tool vendors
Metrology Manager
Responsibilities Include:
- Accountable for the execution of the instrumentation/calibrations and metrology services and activities in the site
- Leads the execution of Metrology activities in accordance to stipulated production schedule and compliance requirements
- Accountable of the Instrumentation/Calibrations group to assure that required process, laboratories, utilities and facilities equipment calibrations are performed in compliance with NIST, cGMP regulations, company policies and procedures and meet Federal and local governmental regulation (e.g. FDA, EQB, OSHA, etc.)
- Defect/yield match activity to mother fab
- During ramp and manufacturing, own driving defect, yield, and productivity improvements to meet business goals
PVD Manager
Responsibilities Include:
- Elevate engineering and manufacturing excellence in the Physical Vapor Deposition department
- Innovate and seize opportunities for wafer quality and productivity improvement
- Work with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery
- Equipment troubleshooting
Requirements For All Module Managers Are:
- 2 years of experience in people management & development
- 8 years of overall experience in semiconductor industry
- BS degree in an engineering field
- Weekend on-duty and phone availability during off-work hours
Please Note: Applicants must be legally eligible to work in the United States. This position is located on-site at our Phoenix, AZ Fab21: 5088 W Innovation Cir. Phoenix, AZ. This position will require training both in Arizona and overseas in Taiwan for a short period of time.
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Get Access To All JobsTips for Finding Engineering Jobs at TSMC Jobs
Align your degree to TSMC's process requirements
TSMC's engineering roles require a degree in electrical engineering, materials science, chemical engineering, or a closely related field. A general engineering degree without semiconductor coursework weakens your specialty occupation case for H-1B sponsorship, so frame your academic background around process-relevant disciplines.
Target fab-specific roles over general engineering openings
TSMC's Arizona fab prioritizes process integration, yield engineering, and equipment roles tied to advanced node production. These positions have clearer specialty occupation footprints than generalist titles, which makes LCA filing and H-1B approval more straightforward for both you and the employer.
Use Migrate Mate to filter TSMC engineering jobs by visa type
TSMC posts engineering openings across multiple sites, and not every role is flagged for sponsorship. Use Migrate Mate to filter TSMC positions by the specific visa categories you qualify for, so you apply only where sponsorship is already on the table.
Confirm your LCA wage tier before negotiating salary
Before accepting an offer, verify the prevailing wage level DOL assigns to your job title and location. TSMC must certify your offered salary meets at least that threshold on the LCA, so knowing your wage tier ahead of negotiation prevents surprises after the offer stage.
Apply before your OPT STEM extension deadline
If you're on F-1 OPT, TSMC can file your H-1B petition before the April lottery deadline for an October 1 start. Missing the cap-subject window while on OPT means a 12-month gap in authorization, so time your application cycle around USCIS's registration period, typically opening in March.
Understand TSMC's EB-2 and EB-3 pathways for long-term planning
TSMC sponsors both EB-2 and EB-3 Green Card categories for engineering staff, with most cases going through PERM labor certification. Engineers from India and China face significant priority date backlogs in these categories, so start the conversation with your hiring manager early rather than waiting until after you're onboarded.
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Find Engineering at TSMC JobsFrequently Asked Questions
Does TSMC sponsor H-1B visas for Engineers?
Yes. TSMC regularly sponsors H-1B visas for engineering roles, particularly in process integration, equipment engineering, and advanced semiconductor development. Sponsorship is most common for roles requiring a degree in electrical engineering, materials science, or chemical engineering. If you're already in the U.S. on OPT, TSMC can initiate the H-1B cap filing on your behalf ahead of the annual USCIS registration window.
How do I apply for Engineering jobs at TSMC?
Apply directly through TSMC's careers portal or through Migrate Mate, which lets you filter TSMC's engineering openings by the visa categories you qualify for. Tailor your resume to the specific engineering function you're targeting, such as process, equipment, or yield engineering, since TSMC's hiring teams are technical and screen closely for domain alignment with their fab operations.
Which visa types does TSMC sponsor for Engineering roles?
TSMC sponsors H-1B visas for cap-subject candidates and E-3 visas for Australian citizens in qualifying engineering roles. For longer-term immigration, TSMC also supports EB-2 and EB-3 Green Card sponsorship through PERM labor certification. The right category depends on your nationality, degree level, and the specific role you're hired into, so confirm the pathway with your recruiter during the offer stage.
What qualifications does TSMC expect for sponsored Engineering positions?
Most sponsored engineering roles at TSMC require at minimum a bachelor's degree in a directly related field such as electrical engineering, materials science, physics, or chemical engineering. Advanced node process roles often prefer a master's degree or relevant fab internship experience. TSMC's specialty occupation filings require a tight match between your degree field and the job duties, so a generalist background without semiconductor coursework is harder to sponsor.
How long does the visa sponsorship process take for a TSMC Engineering role?
For H-1B sponsorship, TSMC must complete DOL labor condition application certification before filing with USCIS, which typically adds two to four weeks before the petition is submitted. Standard USCIS processing runs three to six months, though premium processing can reduce that to roughly two to three weeks. For Green Card sponsorship through PERM, the full EB-2 or EB-3 process from labor certification to approval commonly takes one to three years before accounting for any priority date backlog.
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