OPT Packaging Engineer Jobs
Packaging Engineer jobs are a strong fit for OPT work authorization, with roles spanning consumer goods, pharmaceuticals, medical devices, and food manufacturing. Most positions require a degree in packaging science, mechanical engineering, or materials science, and STEM OPT extension eligibility is common given the technical nature of the work.
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WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
Responsibilities:
Job Role and Responsibility: AMD, Inc., is hiring MTS Packaging Engineer to evaluate materials and components and processes for use in advanced semiconductor products that must meet specialized design and performance specifications in high volume semiconductor manufacturing. Drive for supplier engagement on continuous improvement and new capabilities ahead of need. Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders. Drive external manufacturer on issue resolution and issue prevention. Plan and execute change management from internal or external parties. Involved in regional supplier management – drive to meet Key Performance Indices. Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio. Prepare and present Executive Summary of projects and supplier’s performance. Coordination of activities within/external team to deliver critical metrics. Develop packaging technology to support performance in high-speed interfaces along with high thermo-mechanical, quality and reliability requirements, including bumping/CPI, package, substrate and assembly. Manage product, components, and materials from conceptual phase to high volume manufacturing on various aspects of packaging work with package and board level (system level) signal integrity (SI) simulation using multiple high-speed interfaces. Enhance package and board level performance with SI simulation tools, and integrate SI/PI guidelines and requirements. Define package technology from conceptual phase with tradeoffs between product electrical performance (SI/PI), cost quality, reliability and manufacturability. Work on package reliability (1st and 2nd level interconnect) requirements, manufacturability, failure analysis and thermal/mechanical stress interactions. Utilize knowledge of Flip Chip Packaging (bumping process, substrate manufacturing, Assembly manufacturing, lid & stiffener manufacturing process).
Multiple openings. Qualified applicants click “APPLY NOW” button to apply online. Travel required: NO
QUALIFICATIONS
Degree required
Master’s degree or foreign equivalent in Mechanical Engineering, Computer Engineering, Electrical Engineering, or related field.
Qualifications: Amount and type of experience required: None.
Specific skills required: The following skills are required:
- Flip Chip Packaging
- Operational experience in bumping process, substrate manufacturing, Assembly manufacturing, and lid and stiffener manufacturing process
- Development work leading to volume production in Semiconductor manufacturing
- JMP and minitab tools
- Failure analysis
- Package reliability
- Industry standard (ESD, Jedec, Automotive)
Experience may be gained through graduate-level coursework, research, internship, and/or work experience.
PREFERRED SKILLS: N/A
BENEFITS:
AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
Overview:
WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
Responsibilities:
Job Role and Responsibility: AMD, Inc., is hiring MTS Packaging Engineer to evaluate materials and components and processes for use in advanced semiconductor products that must meet specialized design and performance specifications in high volume semiconductor manufacturing. Drive for supplier engagement on continuous improvement and new capabilities ahead of need. Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders. Drive external manufacturer on issue resolution and issue prevention. Plan and execute change management from internal or external parties. Involved in regional supplier management – drive to meet Key Performance Indices. Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio. Prepare and present Executive Summary of projects and supplier’s performance. Coordination of activities within/external team to deliver critical metrics. Develop packaging technology to support performance in high-speed interfaces along with high thermo-mechanical, quality and reliability requirements, including bumping/CPI, package, substrate and assembly. Manage product, components, and materials from conceptual phase to high volume manufacturing on various aspects of packaging work with package and board level (system level) signal integrity (SI) simulation using multiple high-speed interfaces. Enhance package and board level performance with SI simulation tools, and integrate SI/PI guidelines and requirements. Define package technology from conceptual phase with tradeoffs between product electrical performance (SI/PI), cost quality, reliability and manufacturability. Work on package reliability (1st and 2nd level interconnect) requirements, manufacturability, failure analysis and thermal/mechanical stress interactions. Utilize knowledge of Flip Chip Packaging (bumping process, substrate manufacturing, Assembly manufacturing, lid & stiffener manufacturing process).
Multiple openings. Qualified applicants click “APPLY NOW” button to apply online. Travel required: NO
QUALIFICATIONS
Degree required
Master’s degree or foreign equivalent in Mechanical Engineering, Computer Engineering, Electrical Engineering, or related field.
Qualifications: Amount and type of experience required: None.
Specific skills required: The following skills are required:
- Flip Chip Packaging
- Operational experience in bumping process, substrate manufacturing, Assembly manufacturing, and lid and stiffener manufacturing process
- Development work leading to volume production in Semiconductor manufacturing
- JMP and minitab tools
- Failure analysis
- Package reliability
- Industry standard (ESD, Jedec, Automotive)
Experience may be gained through graduate-level coursework, research, internship, and/or work experience.
PREFERRED SKILLS: N/A
BENEFITS:
AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
See all 85+ OPT Packaging Engineer Jobs
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Get Access To All JobsTips for Finding OPT Sponsorship as a Packaging Engineer
Target STEM-designated programs first
Packaging engineering roles often qualify for the 24-month STEM OPT extension. Confirm your degree program's CIP code is STEM-designated before applying, so you can honestly communicate your full three-year authorization window to employers.
Lead with your technical specialization
Employers hiring packaging engineers want specifics. Mention materials experience (rigid plastics, flexible films, corrugated), software proficiency (CAPE, ArtiosCAD, SolidWorks), and any sustainability or lightweighting projects. Generic resumes get filtered out quickly in this field.
Focus on industries with high sponsorship history
Consumer packaged goods companies, pharmaceutical manufacturers, and medical device firms sponsor OPT and H-1B visa workers regularly. Research company size and hiring patterns before applying to prioritize employers likely to support future visa sponsorship.
Highlight compliance and regulatory knowledge
Packaging engineers in pharma and medical devices work within FDA and ISO regulatory frameworks. Calling out familiarity with 21 CFR Part 11, ISTA testing standards, or GMP environments signals specialized value that justifies the OPT hiring process for employers.
Address OPT timing proactively in applications
Packaging engineering roles often involve multi-month product launch cycles. Reassure employers early that your OPT timeline accommodates a full project contribution, and clarify your STEM extension eligibility to remove uncertainty about authorization duration.
Build your portfolio around measurable outcomes
Packaging engineers are evaluated on cost reduction, material waste, line efficiency, and product protection results. Quantify your contributions from internships or capstone projects, as concrete numbers make OPT candidates significantly more competitive against domestic applicants.
Packaging Engineer OPT: Frequently Asked Questions
Can I work as a Packaging Engineer on OPT?
Yes, packaging engineering is a qualifying field for OPT work authorization as long as the role is directly related to your degree in packaging science, mechanical engineering, materials science, or a closely related discipline. Most full-time packaging engineer positions at manufacturers, CPG companies, and contract packagers meet this standard. If your degree is STEM-designated, you may also qualify for the 24-month STEM OPT extension, giving you up to three years of total work authorization.
Does a Packaging Engineer role qualify for the STEM OPT extension?
It depends on your specific degree program's CIP code, not the job title itself. Degrees in packaging science, mechanical engineering, industrial engineering, materials science, and chemical engineering are frequently STEM-designated and support the extension. Your Designated School Official can confirm whether your program qualifies. If it does, you can work for up to three years on OPT total, which makes you a significantly more attractive hire for employers evaluating long-term sponsorship options.
What types of employers hire Packaging Engineers on OPT?
The broadest opportunities are in consumer packaged goods, pharmaceutical and biotech manufacturing, medical device companies, food and beverage producers, and contract packaging firms. Large CPG companies like those in personal care, household products, and food processing hire packaging engineers regularly and have established immigration compliance processes. Migrate Mate is a good starting point for finding packaging engineer roles at employers who actively consider OPT candidates.
What does a Packaging Engineer actually do day-to-day?
Packaging engineers design, test, and optimize packaging systems for physical protection, regulatory compliance, manufacturing efficiency, and sustainability goals. Day-to-day work typically involves materials selection, prototype development, ISTA or ASTM performance testing, supplier coordination, and cross-functional collaboration with product development and operations teams. In regulated industries like pharma and medical devices, engineers also maintain documentation for FDA submissions and ensure packaging meets GMP and ISO standards.
Do Packaging Engineer employers typically sponsor H-1B visas after OPT?
Sponsorship rates vary significantly by employer size and industry. Large pharmaceutical companies, major CPG brands, and medical device manufacturers tend to have more established sponsorship processes and HR infrastructure to support H-1B petitions. Smaller contract packagers or regional manufacturers may be less familiar with the process. Starting your OPT in a role at a large employer with documented sponsorship history gives you the best odds of transitioning from OPT to H-1B when your authorization period ends.