Package Engineer Jobs
Package Engineer jobs are open from entry-level to senior across consumer goods, pharmaceuticals, food and beverage, and industrial manufacturing, with specializations in structural design, sustainable materials, and regulatory compliance. See the openings below and apply to the ones that match your experience.
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Showing 5 of 47+ Package Engineer jobs
Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.
The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more.
As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.
We are looking for a Senior Package Design Engineer to join the team.
#SCHIE #CSME #SMPE
Responsibilities
The Senior Package Design Engineer will be responsible for providing expertise, insight, and support to the Silicon development team through the entire life cycle of the product. In this role, you will be responsible for the design and implementation of new custom Silicon devices, in particular substrate, interposer, and bridge design. In addition, you will work with product architects, package technologists, and systems platform team on co-design and optimization of the silicon devices, through the whole product life cycle.
Specific responsibilities to include:
- Own 2.5D/3D package designs (substrate, interposer and bridge) for Azure datacenter silicon from definition to tapeout.
- Develop package architecture and floorplans for chiplet-based designs using advanced packaging technologies such as CoWoS and HBM integration.
- Drive package and PCB co-design: define BGA ballout and bump plans and optimize floorplans with SI/PI, silicon PD/RTL, PCB, DFT and ATE teams to meet system-level specs.
- Do package layout and routing in industry-standard EDA tools (e.g., Cadence APD/Allegro), and develop scripts and automation to improve design efficiency.
- Run package design signoff (DRC, LVS, LEC and DFM) and drive closure of all issues before tapeout.
- Define and maintain package design requirements and specs, and keep design data, versions and documentation complete and traceable.
- Work with silicon and platform architects, board designers, and thermal, power and performance engineers to balance trade-offs and close on design decisions.
- Work with package technologists on the evaluation and recommendation of new packaging technology, device/package qualification and supplier assessment
- Work with external partners (OSATs, substrate and interposer suppliers, design-service partners) on design rules, design reviews and tapeout deliverables.
- Help design test vehicles that validate new package technologies and design rules.
- Identify design risks in new technologies and tool flows early, propose mitigations, and report status and issues to program leadership.
- Manage die-to-interposer-to-substrate connectivity and netlists across multi-die designs, and keep them in sync through design changes (ECOs).
- Design the package power delivery network (planes, layer stack-up, decoupling capacitor placement) with PI engineers to meet power integrity targets.
- Generate and deliver package design data and extracted models to SI/PI, thermal and board teams for system-level analysis, and drive design iterations from the results.
- Evaluate and improve package design flows and methods, review designs, and mentor engineers.
Qualifications
Required Qualifications:
- Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience.
Other Requirements
- Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
- This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Preferred Qualifications:
- Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
- Master’s Degree in Engineering or Hard Science areas related to Semiconductor Packaging
- Specific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)
- Master’s Degree with 15 years of experience in semiconductor package product development
- 10+ years hands-on experience in Semiconductor Package design, development, manufacturing, supplier management or quality management
- Specific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)
- Foundation in advanced packaging technologies, manufacturing and supplier management
- Proficient in IC package or PCB board layout CAD tools Cadence Allegro*
- Working knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs.
- Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis
- Experience with OSAT, Supplier & Foundry technologies.
- Experience in physical failure analysis
- Experience in subcontract supplier management.
Silicon Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process.
Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.
The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more.
As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.
We are looking for a Senior Package Design Engineer to join the team.
#SCHIE #CSME #SMPE
Responsibilities
The Senior Package Design Engineer will be responsible for providing expertise, insight, and support to the Silicon development team through the entire life cycle of the product. In this role, you will be responsible for the design and implementation of new custom Silicon devices, in particular substrate, interposer, and bridge design. In addition, you will work with product architects, package technologists, and systems platform team on co-design and optimization of the silicon devices, through the whole product life cycle.
Specific responsibilities to include:
- Own 2.5D/3D package designs (substrate, interposer and bridge) for Azure datacenter silicon from definition to tapeout.
- Develop package architecture and floorplans for chiplet-based designs using advanced packaging technologies such as CoWoS and HBM integration.
- Drive package and PCB co-design: define BGA ballout and bump plans and optimize floorplans with SI/PI, silicon PD/RTL, PCB, DFT and ATE teams to meet system-level specs.
- Do package layout and routing in industry-standard EDA tools (e.g., Cadence APD/Allegro), and develop scripts and automation to improve design efficiency.
- Run package design signoff (DRC, LVS, LEC and DFM) and drive closure of all issues before tapeout.
- Define and maintain package design requirements and specs, and keep design data, versions and documentation complete and traceable.
- Work with silicon and platform architects, board designers, and thermal, power and performance engineers to balance trade-offs and close on design decisions.
- Work with package technologists on the evaluation and recommendation of new packaging technology, device/package qualification and supplier assessment
- Work with external partners (OSATs, substrate and interposer suppliers, design-service partners) on design rules, design reviews and tapeout deliverables.
- Help design test vehicles that validate new package technologies and design rules.
- Identify design risks in new technologies and tool flows early, propose mitigations, and report status and issues to program leadership.
- Manage die-to-interposer-to-substrate connectivity and netlists across multi-die designs, and keep them in sync through design changes (ECOs).
- Design the package power delivery network (planes, layer stack-up, decoupling capacitor placement) with PI engineers to meet power integrity targets.
- Generate and deliver package design data and extracted models to SI/PI, thermal and board teams for system-level analysis, and drive design iterations from the results.
- Evaluate and improve package design flows and methods, review designs, and mentor engineers.
Qualifications
Required Qualifications:
- Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience.
Other Requirements
- Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
- This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Preferred Qualifications:
- Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
- Master’s Degree in Engineering or Hard Science areas related to Semiconductor Packaging
- Specific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)
- Master’s Degree with 15 years of experience in semiconductor package product development
- 10+ years hands-on experience in Semiconductor Package design, development, manufacturing, supplier management or quality management
- Specific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)
- Foundation in advanced packaging technologies, manufacturing and supplier management
- Proficient in IC package or PCB board layout CAD tools Cadence Allegro*
- Working knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs.
- Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis
- Experience with OSAT, Supplier & Foundry technologies.
- Experience in physical failure analysis
- Experience in subcontract supplier management.
Silicon Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process.
See All 47 Package Engineer Jobs
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Find Package Engineer JobsPackage Engineer Job Market
Who's Hiring
Top Industries Hiring
- Electronics & Hardware
- Consulting & Professional Services
What Employers Look For
The qualifications that appear most often in package engineer jobs.
- Bachelor's degree in packaging science, engineering, or a related technical field
- Proficiency in structural design software such as ArtiosCAD or SolidWorks
- Experience with ISTA, ASTM, or related packaging test standards
- Knowledge of materials including corrugated, flexible film, rigid plastics, and paperboard
- Familiarity with regulatory requirements for food, pharmaceutical, or consumer product packaging
- Experience managing packaging projects from concept through production launch
Tips for Your Package Engineer Job Search
Tailor your resume to material type
Many listings specify corrugated, flexible, rigid, or blister packaging. Pull the exact material categories from each job description and match your resume's skills section to them so ATS scans register the right keywords.
Show dieline and CAD proficiency upfront
Employers expect fluency in structural design software. Name the specific tools you've used, ArtiosCAD, SolidWorks, or similar, and pair each with a shipped project outcome so hiring managers see applied experience, not just software familiarity.
Apply early to roles that fit
Migrate Mate lists package engineer openings from across the United States in one place, so you can find roles that match and apply directly to each listing.
Target listings by regulatory environment
Pharma and medical device employers expect ISTA, ASTM, or FDA packaging compliance experience. If your background is in regulated industries, filter your search to those sectors and address compliance experience in your cover letter directly.
Prepare a portfolio of cost-reduction projects
Interviewers frequently ask about lightweighting, material substitutions, or source reduction wins. Bring two or three concrete examples with measurable outcomes, weight saved, cost per unit reduced, or waste eliminated, so your answers land with specifics.
Negotiate by citing sustainability deliverables
Package engineers with hands-on experience in recyclable or renewable material transitions are increasingly in demand. When negotiating, frame that background as a business asset tied to current corporate sustainability commitments rather than a general credentials argument.
Package Engineer Jobs: Frequently Asked Questions
Which companies are hiring the most package engineers?
The most active employers for package engineers right now are Amazon Web Services, Renesas, and Qualcomm, and the most openings are in California, Arizona, and Texas, based on current listings on Migrate Mate as of November 2026. Consumer goods, pharmaceutical, and food and beverage companies consistently drive the highest volume of open roles.
How many package engineer jobs are remote?
About 67% of package engineer openings are fully remote or hybrid as of November 2026, reflecting the hands-on nature of most packaging roles. Sub-specializations in regulatory compliance, documentation, and supplier qualification tend to offer the most remote flexibility, while structural design and testing roles typically require on-site lab or production access.
How do you become a package engineer?
Most package engineers start with a bachelor's degree in packaging science, mechanical engineering, materials science, or a closely related field. From there, gaining hands-on experience through internships or entry-level roles in manufacturing or consumer goods builds the applied skills employers want. Familiarity with structural design software, packaging test standards, and material properties accelerates your path to more senior positions.
Can you get hired as a package engineer without direct experience?
Yes, entry-level package engineer roles exist for candidates who can demonstrate relevant technical foundations even without full-cycle packaging experience. Coursework in materials science or mechanical engineering, internships involving product or industrial design, lab testing experience, and personal projects using dieline software all signal readiness. Targeting companies with structured new-graduate programs in consumer goods or food and beverage gives you the best footing.
What does the package engineer interview process look like?
Package engineer interviews typically begin with a phone or video screen focused on your technical background and software experience. A hiring manager interview follows, often covering past projects, material decisions, and test protocol familiarity. Many companies then ask for a portfolio review or a take-home design exercise. Final rounds may include a panel with cross-functional stakeholders from supply chain, marketing, or quality assurance.
Where can I find and apply to package engineer jobs?
You can find and apply to package engineer jobs on Migrate Mate, which lists current openings from across the United States. Search for roles that match your experience level, industry background, and material specialization, then apply directly to each listing that fits.
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