Packaging Engineer Jobs in Massachusetts
Packaging Engineer jobs in Massachusetts are in steady demand across the state's strong life sciences, food and beverage, and consumer goods sectors, with openings at every level from entry-level technologist through senior packaging development engineer. The most active hiring concentrates in the Greater Boston area, Worcester, and the Route 128 corridor, where established employers such as Thermo Fisher Scientific, Bose, and Ocean Spray have long maintained packaging engineering functions. The most sought-after specialties in Massachusetts include pharmaceutical and medical device packaging compliance, sustainable materials development, and packaging validation for regulated industries. Find a role that fits below and apply directly.
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Showing 5 of 13+ Packaging Engineer jobs
About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X .
Senior Systems Semiconductor Packaging Engineer
About the Role
As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications. You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions.
This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market.
Key Responsibilities
- Packaging Development: - Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
- Manufacturability and Reliability: - Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
- Root Cause and Yield Improvement: - Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
- Engineering Analysis: - Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
- Process and Quality Methods: - Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
- Customer Requirements Translation: - Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
- OSAT Collaboration: - Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
- Vendor and Assembly Readiness: - Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
- Cross-Functional Leadership: - Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases
Required Skills
- Semiconductor Packaging Expertise: - Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
- Materials Knowledge: - Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
- Design for Reliability: - Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
- Simulation and Analysis Tools: - Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
- Structured Problem Solving: - Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
- Cross-Functional Collaboration: - Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
- Technical Communication: - Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders
Preferred Education and Experience
- Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
- 5+ years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
- Experience supporting MEMS, sensor, or advanced package development is a plus
- Experience working with OSAT partners and external manufacturing vendors is preferred
We recognize that candidates may not meet every listed requirement. If you bring relevant experience and a willingness to learn, we encourage you to apply.
#LI-PG1
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law .
Job Req Type: ExperiencedRequired Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days The expected wage range for a new hire into this position is $110,385 to $151,808.
Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors.
This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.
About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X .
Senior Systems Semiconductor Packaging Engineer
About the Role
As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications. You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions.
This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market.
Key Responsibilities
- Packaging Development: - Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
- Manufacturability and Reliability: - Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
- Root Cause and Yield Improvement: - Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
- Engineering Analysis: - Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
- Process and Quality Methods: - Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
- Customer Requirements Translation: - Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
- OSAT Collaboration: - Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
- Vendor and Assembly Readiness: - Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
- Cross-Functional Leadership: - Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases
Required Skills
- Semiconductor Packaging Expertise: - Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
- Materials Knowledge: - Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
- Design for Reliability: - Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
- Simulation and Analysis Tools: - Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
- Structured Problem Solving: - Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
- Cross-Functional Collaboration: - Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
- Technical Communication: - Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders
Preferred Education and Experience
- Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
- 5+ years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
- Experience supporting MEMS, sensor, or advanced package development is a plus
- Experience working with OSAT partners and external manufacturing vendors is preferred
We recognize that candidates may not meet every listed requirement. If you bring relevant experience and a willingness to learn, we encourage you to apply.
#LI-PG1
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law .
Job Req Type: ExperiencedRequired Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days The expected wage range for a new hire into this position is $110,385 to $151,808.
Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors.
This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.
See All 13 Packaging Engineer Jobs in Massachusetts
Find roles in Massachusetts that match your experience and apply in just a few clicks.
Find Packaging Engineer JobsPackaging Engineer Jobs by City in Massachusetts
Where Massachusetts roles are concentrated, by current openings.
Packaging Engineer Job Market in Massachusetts
A snapshot from current Massachusetts openings, updated as new roles post.
Who's Hiring
Top Industries Hiring
- Food & Beverage
- Retail
- Science & Research
- Technology & Software
- E-Commerce & Online Marketplaces
What Massachusetts Employers Look For
The qualifications that appear most often in packaging engineer jobs across Massachusetts.
- Bachelor's degree in packaging science, mechanical engineering, or a related technical field
- Experience with packaging validation protocols and regulatory compliance documentation
- Proficiency in CAD software for structural packaging design and prototype development
- Knowledge of sustainable packaging materials and Massachusetts environmental regulations
- Familiarity with FDA packaging requirements for pharmaceutical or medical device products
- Strong project management skills coordinating with suppliers, manufacturing, and quality teams
Packaging Engineer Jobs in Massachusetts: Frequently Asked Questions
How do you become a packaging engineer in Massachusetts?
Becoming a packaging engineer in Massachusetts typically starts with a bachelor's degree in packaging science, mechanical engineering, chemical engineering, or materials science. Massachusetts does not require a state-issued license specifically for packaging engineers, but those working in pharmaceutical or medical device packaging must demonstrate familiarity with FDA regulations and industry standards such as ASTM and ISTA. Professional certification from the Institute of Packaging Professionals can strengthen a candidate's profile significantly with Massachusetts employers.
Which companies hire packaging engineers in Massachusetts?
Employers hiring packaging engineers in Massachusetts right now include Analog Devices, Dennis, and Qnity, based on current listings on Migrate Mate as of August 2026. Massachusetts's dense concentration of life sciences, consumer goods, and food manufacturing companies means consistent openings across both large corporations and mid-size specialty producers throughout the state.
Which Massachusetts cities have the most packaging engineer jobs?
The Massachusetts cities with the most packaging engineer openings are Wilmington, Springfield, and Reading. Greater Boston dominates because of its concentration of pharmaceutical, biotech, and consumer goods headquarters along the Route 128 corridor, while Worcester and surrounding areas reflect the region's established food processing and contract manufacturing base that drives steady packaging engineering demand outside the main metro.
Are there remote packaging engineer jobs in Massachusetts?
Yes, but they're rare. Packaging engineering is a largely hands-on role involving physical prototyping, lab testing, and production line coordination, so fully remote positions are uncommon. About 0% of packaging engineer openings tied to Massachusetts are remote or hybrid as of August 2026, and those arrangements tend to apply to documentation-heavy roles in packaging compliance, specifications writing, or project management rather than development or validation work.
How can I get hired as a packaging engineer in Massachusetts with little or no experience?
The most realistic entry path is applying to co-op or internship programs at Massachusetts life sciences and consumer goods companies, which routinely recruit through universities like UMass Lowell, Northeastern, and MIT. New graduates often enter through packaging technologist or junior packaging engineer titles at employers in the pharmaceutical and food sectors. Earning a Certified Packaging Professional credential from the Institute of Packaging Professionals or building a portfolio of materials projects gives candidates without direct experience a measurable edge.
Where can I find and apply to packaging engineer jobs in Massachusetts?
You can find and apply to packaging engineer jobs in Massachusetts on Migrate Mate, which lists current Massachusetts openings from employers actively hiring. Find roles that fit your experience and specialty, then apply directly to the ones that match.
See All 13 Packaging Engineer Jobs in Massachusetts
Find roles in Massachusetts that match your experience and apply in just a few clicks.
Find Packaging Engineer Jobs