Product Engineer Jobs in Santa Clara, CA
Product Engineer jobs in Santa Clara are concentrated in Silicon Valley's core, with heavy demand from semiconductor, enterprise hardware, and cloud infrastructure companies clustered near the Convention Center district, Central Expressway corridor, and the Lawrence Expressway tech campuses. Employers hiring right now include Marvell Technology, NVIDIA, and Applied Materials. Scan the live roles below and apply to whichever ones fit.
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Showing 5 of 551+ Product Engineer jobs
Job Description
Silitronics takes pride in delivering Vertically Integrated Design and Assembly Services for next-generation products in AI/ML, Silicon Photonics, High Performance Computing, IoT Sensors, Medical, Defense, LiDAR, RF, and Commercial Applications. Our team brings over 100 years of combined domain expertise in Complex Assembly, Substrate and Board Design, Silicon Assembly, and automated Photonics Active Alignment. Silitronics specializes in advanced Semiconductor IC and Photonics PIC assembly, complemented by value-added design engineering services.
We are seeking an experienced New Product Introduction (NPI) Engineer – Advanced Semiconductor Packaging to lead the development, qualification, and transfer of advanced semiconductor packaging technologies into manufacturing.
This role will support complex packaging solutions for AI/ML, hyperscale computing, HPC, photonics, RF, quantum computing, defense/aerospace, and emerging technology applications. The engineer will work closely with customers, suppliers, equipment manufacturers, and cross-functional teams to develop robust, scalable processes from RFQ and prototype through qualification and production release.
Responsibilities
- Lead NPI activities from customer engagement/RFQ through prototype builds, qualification, production release, and ramp.
- Develop, optimize, and qualify advanced packaging processes including flip chip, die attach, thermocompression bonding, wire bonding, SMT/BGA, reflow, underfill, and encapsulation.
- Develop process windows using DOE, SPC, statistical analysis, and engineering characterization.
- Create and maintain process flows, assembly travelers, work instructions, PFMEAs, control plans, process specifications, and qualification reports.
- Define equipment, tooling, fixtures, materials, process parameters, and inspection requirements for new technologies.
- Review customer package designs for DFM, assembly feasibility, tolerances, and process integration.
- Support RFQs and proposals by developing process flows, manufacturing requirements, technical risks, and cost considerations.
- Collaborate with substrate suppliers, wafer foundries, material suppliers, and equipment manufacturers during product development.
- Support prototype, engineering, first-article, qualification, and production builds.
- Investigate process and yield issues, perform root-cause analysis, and implement corrective actions.
- Drive improvements in yield, process capability, cycle time, manufacturability, reliability, and cost.
- Support customer technical reviews and provide engineering leadership throughout the product lifecycle.
- Introduce and qualify new manufacturing equipment and technologies.
- Train and mentor technicians, operators, and engineering team members on new processes.
- Contribute to process innovation, patents, and intellectual property development.
Required Qualifications
- BS or MS in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Manufacturing Engineering, or related discipline.
- 5+ years of experience in semiconductor packaging, advanced electronics assembly, or semiconductor process development.
- Strong understanding of advanced substrate-based semiconductor packaging.
- Demonstrated experience developing and qualifying new manufacturing processes/products, not solely sustaining high-volume production.
- Hands-on experience with several of the following: flip chip, copper pillar/micro-bumps, fine-pitch SMT/BGA, die attach, wire bonding, thermocompression bonding, reflow, underfill, X-ray, AOI, and cross-section analysis.
- Experience with DOE, SPC, PFMEA, control plans, process capability, and structured problem solving.
- Familiarity with IPC, JEDEC, and semiconductor packaging reliability standards.
- Strong analytical, troubleshooting, communication, and project management skills.
- US Citizen or GC Permanent Resident.
Preferred (Nice to Have)
- Experience with advanced packaging for AI, HPC, hyperscale computing, photonics, RF, quantum computing, defense, aerospace, or medical applications.
- Familiarity with heterogeneous integration, chiplets, advanced substrates, 2.5D/3D packaging, or hybrid bonding.
- Experience with package DFM, thermal management, lid attach, TIM materials, or package reliability.
- Experience introducing and qualifying new semiconductor packaging equipment.
- Proficiency with SolidWorks, Python, MATLAB, JMP/Minitab, or similar engineering tools.
- Experience supporting customer RFQs, technical proposals, and manufacturing feasibility reviews.
Soft Skills
- Hands-on, inquisitive, and passionate about advanced semiconductor packaging and process development.
- Strong ownership mentality with the ability to drive NPI programs from concept through production.
- Excellent communication and collaboration skills across customer, engineering, manufacturing, quality, and supplier teams.
- Highly organized and able to manage multiple projects in a fast-paced R&D environment.
- Strong problem-solving skills and willingness to work directly on the manufacturing floor.
Why Join Us
- Comprehensive health benefits including medical, vision, dental, 401(k) with company match, paid vacation, holidays, sick leave, and disability insurance.
- Opportunity to work on next-generation semiconductor packaging and heterogeneous integration technologies.
- Exposure to advanced packaging for AI/ML, HPC, photonics, RF, quantum computing, defense, aerospace, and emerging applications.
- Hands-on collaboration with customers, substrate suppliers, equipment manufacturers, and semiconductor technology companies.
- Career growth in advanced packaging, NPI, semiconductor process development, and manufacturing technology.
- Innovative and collaborative engineering environment with opportunities to contribute to patents and new technology development.
Job Types: Full-time, Permanent
Pay: $120,000.00 - $160,000.00 per year
Benefits:
- 401(k)
- 401(k) matching
- Dental insurance
- Employee assistance program
- Flexible spending account
- Health insurance
- Health savings account
- Life insurance
- Paid time off
- Referral program
- Retirement plan
- Vision insurance
Work Location: In person
Job Description
Silitronics takes pride in delivering Vertically Integrated Design and Assembly Services for next-generation products in AI/ML, Silicon Photonics, High Performance Computing, IoT Sensors, Medical, Defense, LiDAR, RF, and Commercial Applications. Our team brings over 100 years of combined domain expertise in Complex Assembly, Substrate and Board Design, Silicon Assembly, and automated Photonics Active Alignment. Silitronics specializes in advanced Semiconductor IC and Photonics PIC assembly, complemented by value-added design engineering services.
We are seeking an experienced New Product Introduction (NPI) Engineer – Advanced Semiconductor Packaging to lead the development, qualification, and transfer of advanced semiconductor packaging technologies into manufacturing.
This role will support complex packaging solutions for AI/ML, hyperscale computing, HPC, photonics, RF, quantum computing, defense/aerospace, and emerging technology applications. The engineer will work closely with customers, suppliers, equipment manufacturers, and cross-functional teams to develop robust, scalable processes from RFQ and prototype through qualification and production release.
Responsibilities
- Lead NPI activities from customer engagement/RFQ through prototype builds, qualification, production release, and ramp.
- Develop, optimize, and qualify advanced packaging processes including flip chip, die attach, thermocompression bonding, wire bonding, SMT/BGA, reflow, underfill, and encapsulation.
- Develop process windows using DOE, SPC, statistical analysis, and engineering characterization.
- Create and maintain process flows, assembly travelers, work instructions, PFMEAs, control plans, process specifications, and qualification reports.
- Define equipment, tooling, fixtures, materials, process parameters, and inspection requirements for new technologies.
- Review customer package designs for DFM, assembly feasibility, tolerances, and process integration.
- Support RFQs and proposals by developing process flows, manufacturing requirements, technical risks, and cost considerations.
- Collaborate with substrate suppliers, wafer foundries, material suppliers, and equipment manufacturers during product development.
- Support prototype, engineering, first-article, qualification, and production builds.
- Investigate process and yield issues, perform root-cause analysis, and implement corrective actions.
- Drive improvements in yield, process capability, cycle time, manufacturability, reliability, and cost.
- Support customer technical reviews and provide engineering leadership throughout the product lifecycle.
- Introduce and qualify new manufacturing equipment and technologies.
- Train and mentor technicians, operators, and engineering team members on new processes.
- Contribute to process innovation, patents, and intellectual property development.
Required Qualifications
- BS or MS in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Manufacturing Engineering, or related discipline.
- 5+ years of experience in semiconductor packaging, advanced electronics assembly, or semiconductor process development.
- Strong understanding of advanced substrate-based semiconductor packaging.
- Demonstrated experience developing and qualifying new manufacturing processes/products, not solely sustaining high-volume production.
- Hands-on experience with several of the following: flip chip, copper pillar/micro-bumps, fine-pitch SMT/BGA, die attach, wire bonding, thermocompression bonding, reflow, underfill, X-ray, AOI, and cross-section analysis.
- Experience with DOE, SPC, PFMEA, control plans, process capability, and structured problem solving.
- Familiarity with IPC, JEDEC, and semiconductor packaging reliability standards.
- Strong analytical, troubleshooting, communication, and project management skills.
- US Citizen or GC Permanent Resident.
Preferred (Nice to Have)
- Experience with advanced packaging for AI, HPC, hyperscale computing, photonics, RF, quantum computing, defense, aerospace, or medical applications.
- Familiarity with heterogeneous integration, chiplets, advanced substrates, 2.5D/3D packaging, or hybrid bonding.
- Experience with package DFM, thermal management, lid attach, TIM materials, or package reliability.
- Experience introducing and qualifying new semiconductor packaging equipment.
- Proficiency with SolidWorks, Python, MATLAB, JMP/Minitab, or similar engineering tools.
- Experience supporting customer RFQs, technical proposals, and manufacturing feasibility reviews.
Soft Skills
- Hands-on, inquisitive, and passionate about advanced semiconductor packaging and process development.
- Strong ownership mentality with the ability to drive NPI programs from concept through production.
- Excellent communication and collaboration skills across customer, engineering, manufacturing, quality, and supplier teams.
- Highly organized and able to manage multiple projects in a fast-paced R&D environment.
- Strong problem-solving skills and willingness to work directly on the manufacturing floor.
Why Join Us
- Comprehensive health benefits including medical, vision, dental, 401(k) with company match, paid vacation, holidays, sick leave, and disability insurance.
- Opportunity to work on next-generation semiconductor packaging and heterogeneous integration technologies.
- Exposure to advanced packaging for AI/ML, HPC, photonics, RF, quantum computing, defense, aerospace, and emerging applications.
- Hands-on collaboration with customers, substrate suppliers, equipment manufacturers, and semiconductor technology companies.
- Career growth in advanced packaging, NPI, semiconductor process development, and manufacturing technology.
- Innovative and collaborative engineering environment with opportunities to contribute to patents and new technology development.
Job Types: Full-time, Permanent
Pay: $120,000.00 - $160,000.00 per year
Benefits:
- 401(k)
- 401(k) matching
- Dental insurance
- Employee assistance program
- Flexible spending account
- Health insurance
- Health savings account
- Life insurance
- Paid time off
- Referral program
- Retirement plan
- Vision insurance
Work Location: In person
See All 551+ Product Engineer Jobs in Santa Clara
Find roles in Santa Clara that match your experience and apply in just a few clicks.
Find Product Engineer JobsProduct Engineer Job Market in Santa Clara
Who's Hiring
- Marvell Technology87
- NVIDIA73
- Applied Materials58
- Wipro29
- Eurofins29
Top Industries Hiring
- Technology & Software102
- Electronics & Hardware44
- Medical Devices29
- Consulting & Professional Services29
Product Engineer Jobs in Santa Clara: Frequently Asked Questions
How do I get a product engineer job in Santa Clara?
Focus your search on Santa Clara's semiconductor, enterprise hardware, and networking equipment sectors, where product engineering demand is most consistent. Companies near the Lawrence Expressway corridor and Intel Drive area regularly hire for both hardware and software-integrated product roles. A background that bridges electrical engineering or systems design with hands-on prototyping gives you a clear edge in this market, and experience with silicon-level products or enterprise infrastructure stands out to local recruiters.
Which companies hire product engineers in Santa Clara?
Companies currently hiring product engineers in Santa Clara include Marvell Technology, NVIDIA, and Applied Materials, per current listings on Migrate Mate as of August 2026. Santa Clara's employer mix skews heavily toward chip makers, networking hardware firms, and large-scale cloud infrastructure operators, making it one of the densest concentrations of hardware-focused product engineering roles in the country.
Are there remote product engineer jobs in Santa Clara?
Yes, though availability depends on the role: product engineers working on physical hardware, semiconductors, or lab-based prototyping are almost always required on-site, while roles focused on software integration, product analytics, or program coordination can be hybrid or fully remote. About 39% of product engineer openings tied to Santa Clara are remote or hybrid as of August 2026. Software-integrated and systems-level product roles at Santa Clara's larger cloud and enterprise companies tend to offer the most flexibility.
How can I get a product engineer job in Santa Clara with little or no experience?
The most realistic entry path in Santa Clara is targeting associate or junior product engineer roles at mid-size semiconductor and networking companies, which hire more entry-level candidates than the largest chipmakers. Internship programs at companies near the Convention Center district and Lawrence Expressway campuses regularly convert to full-time offers. A portfolio showing hands-on project work, even from university labs or personal builds, carries significant weight locally, and roles like test engineer or systems integration engineer are common stepping stones into core product engineering positions.
Which industries hire the most product engineers in Santa Clara?
Most product engineer openings in Santa Clara sit in Technology & Software, Electronics & Hardware, and Medical Devices, per current listings on Migrate Mate as of August 2026. Santa Clara's position as home to major semiconductor fabrication and enterprise networking headquarters makes those sectors the dominant and most consistent source of local product engineering demand.
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See All 551+ Product Engineer Jobs in Santa Clara
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