Silicon Engineer Jobs
Silicon Engineer jobs are open from new-grad to principal across semiconductors, consumer electronics, defense, and hyperscaler compute, with specializations in physical design, analog circuit design, and digital VLSI. Scan the live roles below and apply to whichever ones fit.
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Job Details:
Job Description:
The Opportunity
Join Intel's advanced packaging team and help shape the future of high-performance computing. As a Silicon Packaging Design Engineer, you will be responsible for the design and development of next-generation package substrates that enable industry-leading semiconductor products. Working closely with silicon, signal integrity, power delivery, manufacturing, and hardware teams, you will drive substrate solutions from initial concept through tapeout, balancing electrical performance, manufacturability, cost, and schedule requirements.
This role offers the opportunity to influence cutting-edge packaging technologies that support Intel's most advanced products and platforms.
Key Responsibilities
- Design and develop microelectronic package substrates from architecture definition through final tapeout.
- Create and optimize physical package layouts, including high-density routing solutions that meet electrical, mechanical, thermal, and manufacturability requirements.
- Perform substrate feasibility, fit, and routing studies to evaluate design tradeoffs involving performance, complexity, cost, and schedule.
- Define, implement, and maintain substrate design rules while conducting design reviews with internal and external stakeholders.
- Analyze and resolve design rule check (DRC) violations and other layout-related issues to ensure design quality and robustness.
- Collaborate with silicon, package, board, signal integrity, power integrity, and manufacturing teams to optimize pinouts and system-level connectivity.
- Drive continuous improvements in package design methodologies, automation, and best practices.
- Generate and maintain design documentation, technical reports, and engineering deliverables within product lifecycle management systems.
- Support package bring-up, qualification, and debug activities as needed.
Qualifications:
The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- US Citizenship required.
- Ability to obtain US Government TS/SCI Security Clearance.
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related engineering discipline and 6+ months of experience.
- Experience or academic exposure with microelectronic package or PCB physical layout design and manufacturing process.
- Experience with with package design tools like Siemens Xpedition, Cadence Allegro Package Design, AutoCAD, or SolidWorks.
Preferred Qualifications
- Post Graduate degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related engineering discipline.
- Active US Government TS/SCI Security Clearance.
- Experience with semiconductor package substrate design, package I/O planning, and high-density routing technologies.
- Knowledge of advanced packaging technologies such as flip-chip, 2.5D, 3D packaging, chiplets, embedded bridge, or high-bandwidth interconnect solutions.
- Familiarity with package electrical analysis and simulation tools including HyperLynx, PowerDC, Ansys HFSS, and Ansys Q3D.
- Experience using package automation and productivity tools such as Package Layout Automation (PLA) and FIELD.
- Programming or scripting experience using Python, VB, C/C++, or similar languages to drive design automation and workflow improvements.
Why Intel
At Intel, you'll work alongside world-class engineers developing technologies that power everything from artificial intelligence and cloud computing to next-generation client and edge platforms. You'll have the opportunity to solve complex technical challenges, influence leading-edge products, and accelerate your career while helping shape the future of semiconductor innovation
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Arizona, PhoenixAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.Job Details:
Job Description:
The Opportunity
Join Intel's advanced packaging team and help shape the future of high-performance computing. As a Silicon Packaging Design Engineer, you will be responsible for the design and development of next-generation package substrates that enable industry-leading semiconductor products. Working closely with silicon, signal integrity, power delivery, manufacturing, and hardware teams, you will drive substrate solutions from initial concept through tapeout, balancing electrical performance, manufacturability, cost, and schedule requirements.
This role offers the opportunity to influence cutting-edge packaging technologies that support Intel's most advanced products and platforms.
Key Responsibilities
- Design and develop microelectronic package substrates from architecture definition through final tapeout.
- Create and optimize physical package layouts, including high-density routing solutions that meet electrical, mechanical, thermal, and manufacturability requirements.
- Perform substrate feasibility, fit, and routing studies to evaluate design tradeoffs involving performance, complexity, cost, and schedule.
- Define, implement, and maintain substrate design rules while conducting design reviews with internal and external stakeholders.
- Analyze and resolve design rule check (DRC) violations and other layout-related issues to ensure design quality and robustness.
- Collaborate with silicon, package, board, signal integrity, power integrity, and manufacturing teams to optimize pinouts and system-level connectivity.
- Drive continuous improvements in package design methodologies, automation, and best practices.
- Generate and maintain design documentation, technical reports, and engineering deliverables within product lifecycle management systems.
- Support package bring-up, qualification, and debug activities as needed.
Qualifications:
The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- US Citizenship required.
- Ability to obtain US Government TS/SCI Security Clearance.
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related engineering discipline and 6+ months of experience.
- Experience or academic exposure with microelectronic package or PCB physical layout design and manufacturing process.
- Experience with with package design tools like Siemens Xpedition, Cadence Allegro Package Design, AutoCAD, or SolidWorks.
Preferred Qualifications
- Post Graduate degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related engineering discipline.
- Active US Government TS/SCI Security Clearance.
- Experience with semiconductor package substrate design, package I/O planning, and high-density routing technologies.
- Knowledge of advanced packaging technologies such as flip-chip, 2.5D, 3D packaging, chiplets, embedded bridge, or high-bandwidth interconnect solutions.
- Familiarity with package electrical analysis and simulation tools including HyperLynx, PowerDC, Ansys HFSS, and Ansys Q3D.
- Experience using package automation and productivity tools such as Package Layout Automation (PLA) and FIELD.
- Programming or scripting experience using Python, VB, C/C++, or similar languages to drive design automation and workflow improvements.
Why Intel
At Intel, you'll work alongside world-class engineers developing technologies that power everything from artificial intelligence and cloud computing to next-generation client and edge platforms. You'll have the opportunity to solve complex technical challenges, influence leading-edge products, and accelerate your career while helping shape the future of semiconductor innovation
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Arizona, PhoenixAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.Silicon Engineer Jobs by Experience Level
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Find Silicon Engineer JobsSilicon Engineer Job Market
Who's Hiring
- AMD49
- Apple49
- Meta23
- SpaceX23
- Amazon Web Services15
Top Industries Hiring
- Electronics & Hardware20
- Technology & Software7
- Telecommunications5
- Aerospace & Defense5
- Consulting & Professional Services2
What Employers Look For
The qualifications that appear most often in silicon engineer jobs.
- Bachelor's or master's degree in electrical engineering, computer engineering, or a related field
- Hands-on experience with industry EDA tools such as Cadence Virtuoso, Synopsys Design Compiler, or Mentor Calibre
- Proficiency in RTL design languages including Verilog or VHDL, and scripting in Python or Tcl
- Experience with physical design flows covering floor planning, place and route, and timing closure
- Familiarity with DRC, LVS, and sign-off verification using foundry PDKs
- Knowledge of low-power design techniques including clock gating, power gating, and voltage scaling
Tips for Your Silicon Engineer Job Search
Tailor your resume to the node
Hiring managers scan for the process node you've taped out at, 7nm, 5nm, 28nm, whatever it is. List it explicitly on your resume alongside your EDA tools and PDK familiarity, not buried in a skills section at the bottom.
Apply early to roles that fit
Migrate Mate lists silicon engineer openings from across the United States in one place, so you can find roles that match and apply directly to each listing.
Show tapeout ownership on your portfolio
Recruiters differentiate candidates by whether they owned a block versus contributed to one. For each project, state your specific ownership, floor planning, timing closure, analog cell design, and whether the design reached silicon.
Filter openings by design methodology
Job titles blur across digital, analog, and mixed-signal work. Read each job description for the EDA stack, Cadence, Synopsys, or Mentor, and the design flow, so you're not applying to roles that require a different domain than your strongest experience.
Prepare for multi-day technical loops
Silicon engineer interviews often include a take-home design exercise before the onsite loop. Practice explaining your timing constraints, power budget decisions, and DRC debug process out loud, because interviewers test your reasoning as much as your answers.
Negotiate total compensation, not just base
Offers in this field frequently include equity tied to product milestones or IPO timelines. Ask specifically about vesting cliffs, refresh grants, and whether the equity is in stock options or restricted stock units before accepting any offer.
Silicon Engineer Jobs: Frequently Asked Questions
Which companies are hiring the most silicon engineers?
AMD, Apple, and Meta are hiring the most silicon engineers right now, with openings concentrated in California, Texas, and Washington, based on current listings on Migrate Mate as of November 2026. Activity tends to cluster around companies ramping new process nodes or launching custom chip programs.
How many silicon engineer jobs are remote?
About 36% of silicon engineer openings are fully remote or hybrid as of November 2026, reflecting the lab and tool-license dependencies that make fully remote work less common in this field than in pure software roles. Front-end RTL and verification engineers have the most remote flexibility, while physical design and analog layout roles are more likely to require on-site access to lab equipment and licensed EDA servers.
How do you become a silicon engineer?
Start with a bachelor's degree in electrical engineering or computer engineering, focusing on coursework in digital logic, analog circuits, and VLSI design. Build hands-on experience through capstone projects, internships, or open-source chip initiatives that expose you to real EDA tools and design flows. A master's degree strengthens your profile for physical design or analog roles where deep specialization matters to hiring teams.
How do you get hired as a silicon engineer with little experience?
Focus on completing at least one end-to-end design project you can speak to in detail, even if it's a university tape-out or an open-source PDK flow run on a free tier. Target companies with structured new-grad programs in their silicon or custom hardware teams, where hiring managers expect to train candidates on internal tooling. Demonstrating familiarity with Cadence or Synopsys student licenses signals hands-on intent to reviewers who screen hundreds of resumes.
What does the silicon engineer interview process look like?
Most processes start with a recruiter screen followed by a technical phone interview covering digital design fundamentals, timing concepts, or analog circuit analysis depending on the role. A take-home design exercise or coding screen in Verilog or Python is common at mid-to-senior levels. The onsite loop typically includes multiple technical rounds with engineers from the specific team, plus a system design or architecture discussion, before moving to an offer stage.
Where can I find and apply to silicon engineer jobs?
You can find and apply to silicon engineer jobs on Migrate Mate, which lists current openings from companies across the United States. Search for roles that match your design domain and experience level, then apply directly to each listing that fits your background.
See All 308+ Silicon Engineer Jobs
Find roles that match your experience and apply in just a few clicks.
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