Analysis Engineer Jobs
Analysis Engineer jobs are open from new-grad to senior and principal levels across aerospace, automotive, semiconductor, and industrial manufacturing, with common specializations in structural analysis, thermal analysis, and failure analysis. See the openings below and apply to the ones that match your experience.
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Job Description:
Broadcom is seeking a highly motivated and results-driven Failure Analysis Engineer to ensure successful deployment of Broadcom's most advanced products, including industry-leading AI accelerators and high-speed networking solutions. This hands-on, technical position requires ownership of the complete failure analysis lifecycle, from initial fault isolation to physical identification and nanoscale characterization, and findings are used to drive corrective action with design, process, product, and packaging teams across advanced silicon (e.g., FinFET, GAA) and cutting-edge packaging technologies (e.g., 2.5D, CoWoS-S/L, 3DIC, CoPoS, CPO).
Responsibilities:
- Own full-flow FA on advanced-node logic and mixed-signal devices and advanced packages.
- Engage in team-based culture through open communication, continuous improvement, and willingness to assist others.
- Plan and execute individual FA plans through background data collection, ATE datalog interpretation, and non-destructive analysis (optical, CSAM, X-Ray, TDR, IV curve trace).
- Apply fault isolation techniques, including photon emission (PEM/EMMI), laser-based (LADA/SDL/OBIRCH), thermal, and lock-in methods, to localize defects in front-side and backside configurations.
- Perform nanoprobing (SEM-based) for BEOL and FEOL electrical characterization and defect isolation (EBAC, EBIRCH, EBIC).
- Execute sample preparation and physical analysis: physical deprocessing of ICs and packages (mechanical, chemical, PFIB), backside thinning, cross-section SEM/TEM, elemental analysis (EDS).
- Correlate design-based FA results (scan diagnosis, memory bitmapping) and ATPG/DFT results with physical localization to drive root cause on resistive and systematic defects.
- Collaborate with global cross-functional teams to identify root causes of failures from various stages of the product lifecycle (e.g., design, prototype, reliability, RMA, yield).
- Communicate complex FA findings effectively (written and verbal), enabling data-driven corrective actions to resolve critical quality issues.
- Develop and implement new FA methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness.
Required Qualifications:
Please apply only if you meet all of the following:
- BS, MS, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.
- 8+ years of hands-on semiconductor failure analysis experience, with a demonstrated history of root-causing failures at 16nm or below and/or in 2.5D packages.
- Full-flow FA experience: electrical verification, non-destructive analysis, backside fault isolation on flip-chip and/or 3D devices, deprocessing, physical analysis, and technical report writing
- Extensive hands-on expertise in fault isolation and/or nanoprobing, including tool operation, data interpretation, and the ability to choose appropriate EFA/PFA analysis techniques based on the failure signature.
Highly Desired Qualifications:
- Strong understanding of semiconductor device physics, fabrication processes, and packaging technologies.
- Experience with <5nm finFET or GAAFET technologies.
- Experience with 3DICs, CoWoS-L, CoPoS, co-packaged optics/copper (CPO/CPC).
- Experience with high-speed digital and mixed-signal failure analysis.
- Expertise in design-based FA (scan and memory diagnostics).
- FA-specific ATE test flow generation, pattern modification, and hardware.
- Excellent problem-solving skills and a methodical approach to root cause analysis.
- Ability to work independently and as part of a team.
- Broad interests, self-driven, and a lifelong learner.
- Manage multiple root cause projects in parallel in a fast-paced environment.
Compensation and Benefits
The annual base salary range for this position is USD 109,700.00 To USD 175,500.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Please Note:
1. If you are a first time user, please create your candidate login account before you apply for a job.
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:
Broadcom is seeking a highly motivated and results-driven Failure Analysis Engineer to ensure successful deployment of Broadcom's most advanced products, including industry-leading AI accelerators and high-speed networking solutions. This hands-on, technical position requires ownership of the complete failure analysis lifecycle, from initial fault isolation to physical identification and nanoscale characterization, and findings are used to drive corrective action with design, process, product, and packaging teams across advanced silicon (e.g., FinFET, GAA) and cutting-edge packaging technologies (e.g., 2.5D, CoWoS-S/L, 3DIC, CoPoS, CPO).
Responsibilities:
- Own full-flow FA on advanced-node logic and mixed-signal devices and advanced packages.
- Engage in team-based culture through open communication, continuous improvement, and willingness to assist others.
- Plan and execute individual FA plans through background data collection, ATE datalog interpretation, and non-destructive analysis (optical, CSAM, X-Ray, TDR, IV curve trace).
- Apply fault isolation techniques, including photon emission (PEM/EMMI), laser-based (LADA/SDL/OBIRCH), thermal, and lock-in methods, to localize defects in front-side and backside configurations.
- Perform nanoprobing (SEM-based) for BEOL and FEOL electrical characterization and defect isolation (EBAC, EBIRCH, EBIC).
- Execute sample preparation and physical analysis: physical deprocessing of ICs and packages (mechanical, chemical, PFIB), backside thinning, cross-section SEM/TEM, elemental analysis (EDS).
- Correlate design-based FA results (scan diagnosis, memory bitmapping) and ATPG/DFT results with physical localization to drive root cause on resistive and systematic defects.
- Collaborate with global cross-functional teams to identify root causes of failures from various stages of the product lifecycle (e.g., design, prototype, reliability, RMA, yield).
- Communicate complex FA findings effectively (written and verbal), enabling data-driven corrective actions to resolve critical quality issues.
- Develop and implement new FA methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness.
Required Qualifications:
Please apply only if you meet all of the following:
- BS, MS, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.
- 8+ years of hands-on semiconductor failure analysis experience, with a demonstrated history of root-causing failures at 16nm or below and/or in 2.5D packages.
- Full-flow FA experience: electrical verification, non-destructive analysis, backside fault isolation on flip-chip and/or 3D devices, deprocessing, physical analysis, and technical report writing
- Extensive hands-on expertise in fault isolation and/or nanoprobing, including tool operation, data interpretation, and the ability to choose appropriate EFA/PFA analysis techniques based on the failure signature.
Highly Desired Qualifications:
- Strong understanding of semiconductor device physics, fabrication processes, and packaging technologies.
- Experience with <5nm finFET or GAAFET technologies.
- Experience with 3DICs, CoWoS-L, CoPoS, co-packaged optics/copper (CPO/CPC).
- Experience with high-speed digital and mixed-signal failure analysis.
- Expertise in design-based FA (scan and memory diagnostics).
- FA-specific ATE test flow generation, pattern modification, and hardware.
- Excellent problem-solving skills and a methodical approach to root cause analysis.
- Ability to work independently and as part of a team.
- Broad interests, self-driven, and a lifelong learner.
- Manage multiple root cause projects in parallel in a fast-paced environment.
Compensation and Benefits
The annual base salary range for this position is USD 109,700.00 To USD 175,500.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Analysis Engineer Jobs by Experience Level
See All 631+ Analysis Engineer Jobs
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Find Analysis Engineer JobsAnalysis Engineer Job Market
Who's Hiring
- Northrop Grumman37
- Sargent & Lundy36
- Apple29
- Lockheed Martin18
- Boeing16
Top Industries Hiring
- Electronics & Hardware18
- Technology & Software14
- Consulting & Professional Services8
- Aerospace & Defense4
- Energy3
What Employers Look For
The qualifications that appear most often in analysis engineer jobs.
- Bachelor's degree in mechanical, aerospace, or civil engineering or a related field
- Proficiency in FEA tools such as ANSYS, ABAQUS, or NASTRAN
- Experience developing and validating simulation models against physical test data
- Familiarity with CAD software such as CATIA, SolidWorks, or NX for geometry preparation
- Understanding of material properties, fatigue behavior, and failure modes
- 2 to 5 years of hands-on analysis experience in an engineering or manufacturing environment
Tips for Your Analysis Engineer Job Search
Tailor your resume to simulation tools
Hiring managers for analysis engineer roles scan for specific software like ANSYS, ABAQUS, or NASTRAN. List the tools by name in your skills section and reference them in the bullet points where you describe your projects, not just in a summary line.
Quantify your model validation work
Generic phrases like 'performed structural analysis' won't stand out. Show what you validated, what the error margin was between simulation and test, and what engineering decision your analysis supported. That specificity signals real hands-on competency to reviewers.
Apply early to roles that fit
Migrate Mate lists analysis engineer openings from across the United States in one place, so you can find roles that match and apply directly to each listing.
Filter openings by analysis discipline
Job titles vary widely: structural, thermal, systems, fatigue, and dynamics analysis engineers all appear under different postings. Search for your specific discipline alongside the broader title so you don't miss openings that match your background but use a narrower label.
Prepare a technical walkthrough for interviews
Most analysis engineer interviews include a case study or whiteboard problem. Practice explaining your mesh strategy, boundary condition assumptions, and how you verified your model out loud. Interviewers care as much about your reasoning process as your final numbers.
Negotiate by citing project scope and toolset
When discussing offers, anchor your case in the complexity of analyses you've run and the software licenses you're proficient in, since those have real replacement costs for employers. Avoid vague experience-year arguments and focus on what you can execute from day one.
Analysis Engineer Jobs: Frequently Asked Questions
Which companies are hiring the most analysis engineers?
The companies hiring the most analysis engineers right now include Northrop Grumman, Sargent & Lundy, and Apple, with the largest share of openings in California, Texas, and Virginia, based on current listings on Migrate Mate as of November 2026. Aerospace and defense contractors and automotive OEMs consistently account for a large portion of active openings.
How many analysis engineer jobs are remote?
About 51% of analysis engineer openings are fully remote or hybrid as of November 2026, though the share varies by discipline. Systems and data-focused analysis roles tend to offer more remote flexibility, while structural and thermal roles tied to physical hardware programs are more likely to require on-site or lab access.
How do you become an analysis engineer?
Start with a bachelor's degree in mechanical, aerospace, civil, or a related engineering discipline, since most employers treat that as a baseline. Build hands-on proficiency in at least one major FEA or simulation platform through coursework, personal projects, or internships. Develop a portfolio of analyses that shows how you set up a problem, chose boundary conditions, ran the model, and validated the results against test data or published references.
Can you get hired as an analysis engineer with little experience?
Yes, entry-level analysis engineer roles do exist, and employers hiring at that level look for demonstrated simulation work rather than years on a job. Build project examples using student licenses of tools like ANSYS or SolidWorks Simulation, document your methodology clearly, and target companies with structured new-grad engineering programs in aerospace, automotive, or industrial equipment manufacturing.
What does the analysis engineer interview process look like?
Most analysis engineer interviews run in two to three stages. An initial screening covers your background and tool experience. A technical round typically includes a case study, a whiteboard problem involving loads or boundary conditions, or a review of a past project where you walk through your modeling choices. Final rounds often include a team or hiring manager conversation focused on how you communicate analysis results to non-specialists and handle conflicting test data.
Where can I find and apply to analysis engineer jobs?
You can find and apply to analysis engineer jobs on Migrate Mate, which lists current openings from across the United States. Search for roles that fit your discipline and experience level, then apply directly to each listing that matches what you're looking for.
See All 631+ Analysis Engineer Jobs
Find roles that match your experience and apply in just a few clicks.
Find Analysis Engineer Jobs