Manufacturing Jobs at Intel with Visa Sponsorship
Intel's Manufacturing roles span semiconductor fabrication, process engineering, equipment maintenance, and advanced packaging across major U.S. fabs. Intel actively sponsors work visas for qualified engineers and technicians in this function, making it one of the more accessible paths for international candidates pursuing hands-on roles in chip manufacturing.
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Job Details
Job Description:
Performs physical design implementation of custom CPU designs from RTL to GDS to create a design database that is ready for manufacturing.
Conducts all aspects of the CPU physical design flow including synthesis, place and route, clock tree synthesis, floor planning, static timing analysis, power/clock distribution, reliability, and power and noise analysis.
Conducts verification and signoff including formal equivalence verification, static timing analysis, reliability verification, static and dynamic power integrity, layout verification, electrical rule checking, and structural design checking.
Analyzes results and makes recommendations to improve current and future CPU microarchitectures closely collaborating with logic, circuit, architecture, and design automation teams.
Possesses CPU specific expertise in various aspects of structural and physical design, including physical clock design, timing closure, coverage analysis, multiple power domain analysis, structured placement, routing, synthesis, and DFT.
Works intimately with industry EDA vendors to build and enhance tool capabilities to design a highspeed, low power synthesizable CPU.
Optimizes CPU design to improve product level parameters such as power, frequency, and area.
Participates in the development and improvement of physical design methodologies and flow automation.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
The candidate must possess a bachelor's degree in computer engineering, Computer Science or Electrical/Electronic Engineering or any STEM related degree and 6+ years of experience OR master's degree in computer engineering, Computer Science or Electrical/Electronic Engineering or any STEM related degree and 4+ years of experience in:
VLSI circuit design and synthesis.
Static timing analysis.
* Low power design.
Preferred Qualifications
2+ years of experience in:
x86 CPU architecture.
Tcl/Perl/Python programming.
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location: US, California, Folsom
Additional Locations:
Business Group
Silicon and Platform Engineering Group (SPE): Deliver breakthrough silicon and platform solutions that deliver industry-leading products today while also defining the next generation of computing experiences.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $164,470.00 - 232,190.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
- Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION:
Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Job Details
Job Description:
Performs physical design implementation of custom CPU designs from RTL to GDS to create a design database that is ready for manufacturing.
Conducts all aspects of the CPU physical design flow including synthesis, place and route, clock tree synthesis, floor planning, static timing analysis, power/clock distribution, reliability, and power and noise analysis.
Conducts verification and signoff including formal equivalence verification, static timing analysis, reliability verification, static and dynamic power integrity, layout verification, electrical rule checking, and structural design checking.
Analyzes results and makes recommendations to improve current and future CPU microarchitectures closely collaborating with logic, circuit, architecture, and design automation teams.
Possesses CPU specific expertise in various aspects of structural and physical design, including physical clock design, timing closure, coverage analysis, multiple power domain analysis, structured placement, routing, synthesis, and DFT.
Works intimately with industry EDA vendors to build and enhance tool capabilities to design a highspeed, low power synthesizable CPU.
Optimizes CPU design to improve product level parameters such as power, frequency, and area.
Participates in the development and improvement of physical design methodologies and flow automation.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
The candidate must possess a bachelor's degree in computer engineering, Computer Science or Electrical/Electronic Engineering or any STEM related degree and 6+ years of experience OR master's degree in computer engineering, Computer Science or Electrical/Electronic Engineering or any STEM related degree and 4+ years of experience in:
VLSI circuit design and synthesis.
Static timing analysis.
* Low power design.
Preferred Qualifications
2+ years of experience in:
x86 CPU architecture.
Tcl/Perl/Python programming.
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location: US, California, Folsom
Additional Locations:
Business Group
Silicon and Platform Engineering Group (SPE): Deliver breakthrough silicon and platform solutions that deliver industry-leading products today while also defining the next generation of computing experiences.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $164,470.00 - 232,190.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
- Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION:
Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
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Get Access To All JobsTips for Finding Manufacturing Jobs at Intel Jobs
Align your credentials to fab-specific requirements
Intel's manufacturing hiring prioritizes direct experience with semiconductor processes like CVD, CMP, or lithography. Before applying, document specific equipment platforms, node sizes, and yield improvement work on your resume to match Intel's fab environment.
Target Intel's known fab locations strategically
Intel's largest U.S. manufacturing sites are in Hillsboro, Oregon and Chandler, Arizona. Applications tied to active fab expansion projects at these sites move faster through headcount approvals, which directly affects how quickly your visa process can begin.
Search Intel manufacturing roles on Migrate Mate
Migrate Mate filters Intel job listings by visa type and role category, so you can identify open Manufacturing positions that explicitly support sponsorship rather than sifting through postings with unclear immigration support.
Understand how Intel structures LCA filings for manufacturing
Intel files Labor Condition Applications with DOL before sponsoring H-1B petitions. For manufacturing roles, the prevailing wage determination is based on your specific site location, so salaries can differ significantly between Hillsboro and Chandler postings for the same title.
Prepare F-1 OPT documentation before your start date
Intel regularly onboards F-1 graduates through OPT for manufacturing engineering roles. Have your EAD card, I-20 with OPT authorization, and STEM extension eligibility confirmed before your offer letter stage to avoid delays in your start date clearance.
Clarify H-1B cap timing with your recruiter early
If you're subject to the H-1B cap, USCIS's April lottery window determines your earliest October 1 start date. Raising this timeline with Intel's talent acquisition team during the offer stage lets both sides plan around the gap without losing the offer.
Manufacturing at Intel jobs are hiring across the US. Find yours.
Find Manufacturing at Intel JobsFrequently Asked Questions
Does Intel sponsor H-1B visas for Manufacturing roles?
Yes, Intel sponsors H-1B visas for Manufacturing positions including process engineering, equipment engineering, and advanced packaging roles. Intel is a registered H-1B employer and files Labor Condition Applications with DOL as part of the sponsorship process. Cap-subject candidates should confirm their lottery registration status before accepting an offer, since timing directly affects your start date.
How do I apply for Manufacturing jobs at Intel?
Applications go through Intel's careers portal at intel.com/jobs. Filter by the Manufacturing job family and your preferred site location. For visa-sponsored roles specifically, Migrate Mate surfaces Intel Manufacturing listings alongside sponsorship details, making it easier to identify roles where international candidates are actively considered before you submit.
Which visa types does Intel commonly use for Manufacturing positions?
Intel sponsors H-1B, E-3, TN, F-1 OPT, F-1 CPT, J-1, and employment-based Green Card pathways including EB-2 and EB-3 for Manufacturing roles. F-1 OPT and CPT are common entry points for recent graduates. Australian citizens may be sponsored under the E-3, which has no lottery and a faster timeline than the H-1B cap process.
What qualifications does Intel expect for sponsored Manufacturing roles?
Most H-1B-sponsored Manufacturing roles at Intel require a bachelor's degree or higher in Electrical Engineering, Chemical Engineering, Materials Science, or a closely related field. Hands-on experience with semiconductor fabrication equipment, cleanroom protocols, and process control methods strengthens your profile significantly. Some technician-level roles may qualify under TN or EB-3 classifications depending on the specific job duties.
How do I understand the visa filing timeline after receiving a Manufacturing offer from Intel?
Intel's immigration team typically initiates the sponsorship process after your offer is accepted. For H-1B cap-subject candidates, USCIS registration opens in March with an October 1 employment start if selected. OPT transitions and TN approvals can move faster. Ask your Intel recruiter which visa category applies to your offer and confirm the expected USCIS filing window before your intended start date.
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