Head Of Product Jobs in San Jose, CA

ROLE PURPOSE

Lead Power Integrations’ global IC design organization, ensuring the successful and predictable execution of all silicon development aligned to product architectures and Market-driven roadmaps.

This role owns the delivery of high-quality, manufacturable ICs, translating product and system requirements into silicon while maintaining strong execution discipline, risk management, and cross-functional alignment.

Working closely with Product & Technology Development, Marketing, Operations, and Business Units, this leader ensures silicon delivery meets performance, cost, quality, and schedule commitments.

BUSINESS OWNERSHIP & IMPACT

• Own execution and delivery of all IC development programs.
• Ensure predictable silicon delivery aligned to product commitments.
• Drive improvements in:
• First-pass silicon success
• Development cycle time
• Design productivity and reuse
• Balance design innovation with execution risk and schedule confidence.
• Ensure designs meet:
• Performance targets
• Cost and area targets
• Manufacturability and yield requirements

CORE RESPONSIBILITIES

IC DESIGN EXECUTION & DELIVERY

• Lead all IC development across:
• Analog design
• Digital design
• Mixed-signal integration
• Design verification
• CAD/Layout
• Design reuse
• Ensure high-quality execution from specification through tape-out and silicon validation.
• Deliver designs that meet schedule, performance, cost, and quality targets.

ALIGNMENT TO PRODUCT & MARKETING REQUIREMENTS

• Work closely with Product & Technology and Marketing to ensure clear translation of roadmap requirements into design specifications.
• Provide early input on feasibility, risk, and trade-offs.
• Maintain alignment between architecture intent and silicon implementation.

DESIGN METHODOLOGY & PRODUCTIVITY

• Establish best-in-class design methodologies, tools, and flows.
• Drive improvements in:
• Design reuse
• Verification coverage
• Silicon iterations
• Time-to-functioning silicon
• Build scalable design infrastructure to support future growth.

CROSS-FUNCTIONAL INTEGRATION

• Partner closely with:
• Product & Technology (architecture and requirements)
• Marketing (roadmap alignment)
• Operations (process, yield, cost, backend execution)
• Business Units (application needs and priorities)
• Ensure tight alignment between design, manufacturing, and system requirements.

RISK MANAGEMENT & PREDICTABLE EXECUTION

• Implement disciplined design and verification processes to reduce execution risk.
• Identify and manage technical risks early in the development cycle.
• Ensure high confidence in tape-out schedules and silicon success.
• Drive a culture of accountability and delivery predictability.

ORGANIZATIONAL LEADERSHIP

• Lead global IC design teams across regions.
• Build a strong technical culture focused on:
• Quality
• Execution discipline
• Risk management
• Design reuse
• Continuous improvement
• Recruit, develop, and retain top engineering talent.

IDEAL PROFILE

• 15+ years of experience in IC design (analog, mixed-signal, or power ICs).
• Proven leadership of global IC design teams.
• Deep expertise in:
• High-voltage / power IC design
• Mixed-signal integration
• Semiconductor processes (BCD, HV, GaN preferred)
• Strong track record of delivering silicon on schedule with high quality.
• Experience improving design productivity and execution predictability.
• Strong cross-functional collaboration skills across product, marketing, and operations.