Mechanical Engineering Jobs for OPT Students
Mechanical engineering graduates are recruited across a wide range of industries on OPT, from automotive and aerospace to medical devices and consumer products, and the STEM OPT extension is available for all mechanical engineering degree programs. Employers in manufacturing, product development, and R&D have consistent demand for entry-level mechanical engineers and many have established pathways from OPT to H-1B sponsorship.
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Annapurna Labs (our organization within Amazon) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities
As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
BASIC QUALIFICATIONS
- 3+ years industry experience in Mechanical and Thermal design of Systems
- Bachelor's degree in Electrical Engineering or a related field
- Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
- 1+ years of experience in SoC Thermal modeling and IC package transient thermal response
- Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
- Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
- Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization
PREFERRED QUALIFICATIONS
- Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
- Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
- Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in Linux environment is an added advantage
- Working knowledge on fans, valves, chillers, and CDUs
- Knowledge of various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies
- Develop detailed CFD and compact RC models for SoC and Package thermal analysis
- Knowledge of hardware and software based thermal / power management control algorithms
- Optimize thermal solutions under PPA and system design constraints
- Simulate and prototype thermal control strategies
- Validate thermal models through power/thermal measurements on Hardware
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
LOCATION
USA, TX, Austin - 136,000.00 - 184,000.00 USD annually
USA, WA, Seattle - 136,000.00 - 184,000.00 USD annually
DESCRIPTION
Annapurna Labs (our organization within Amazon) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities
As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
BASIC QUALIFICATIONS
- 3+ years industry experience in Mechanical and Thermal design of Systems
- Bachelor's degree in Electrical Engineering or a related field
- Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
- 1+ years of experience in SoC Thermal modeling and IC package transient thermal response
- Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
- Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
- Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization
PREFERRED QUALIFICATIONS
- Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
- Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
- Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in Linux environment is an added advantage
- Working knowledge on fans, valves, chillers, and CDUs
- Knowledge of various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies
- Develop detailed CFD and compact RC models for SoC and Package thermal analysis
- Knowledge of hardware and software based thermal / power management control algorithms
- Optimize thermal solutions under PPA and system design constraints
- Simulate and prototype thermal control strategies
- Validate thermal models through power/thermal measurements on Hardware
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
LOCATION
USA, TX, Austin - 136,000.00 - 184,000.00 USD annually
USA, WA, Seattle - 136,000.00 - 184,000.00 USD annually
See all 13,272+ Mechanical Engineering jobs
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Mechanical Engineering roles.
Get Access To All JobsFrequently Asked Questions
Which industries hire mechanical engineering OPT students most actively?
Automotive, aerospace, medical devices, industrial equipment, consumer products, and energy companies are the most active hirers of mechanical engineering graduates on OPT. Manufacturing companies with active product development and R&D programs have recurring graduate hiring needs and established immigration support. The medical device sector in particular combines strong hiring volume with high H-1B sponsorship rates for engineering roles.
What mechanical engineering skills are most valued by OPT employers?
CAD proficiency in SolidWorks, CATIA, or AutoCAD is typically the first technical requirement. Finite element analysis, GD&T, manufacturing process knowledge, and thermal or fluid simulation experience are valuable depending on the specific industry. Hands-on lab, internship, or capstone project experience that demonstrates these skills in an applied context makes your application significantly more competitive.
Do mechanical engineering jobs at smaller manufacturers offer OPT hiring?
Many smaller manufacturers and engineering firms hire OPT students, particularly those with prior internship experience in the industry. Smaller companies may have less formal immigration support than large corporations, but this does not mean they are unwilling to sponsor H-1B later. Having an early, transparent conversation about your OPT timeline and future sponsorship needs helps smaller employers plan ahead rather than treating it as a surprise.
Can I work in research and development on STEM OPT as a mechanical engineer?
Yes, R&D roles at companies and research institutions are well-suited to STEM OPT because the work directly applies your engineering degree. University research labs, corporate R&D centers, and national laboratories with civilian research mandates all hire mechanical engineering graduates on OPT. These environments also tend to be familiar with STEM OPT requirements and supportive of the process.
How do I make the transition from OPT to H-1B as a mechanical engineer?
The most important step is choosing an employer with a clear sponsorship track record in mechanical or manufacturing engineering roles. Building a strong performance record during OPT, having the H-1B conversation with your manager well before the March registration window, and making sure your employer has immigration counsel in place are the practical steps. Mechanical engineering roles at established manufacturers and product companies have strong sponsorship histories.
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