Photonics Engineer Jobs in USA with Visa Sponsorship
Photonics Engineer roles qualify as H-1B visa specialty occupations under DOL's prevailing wage tiers, and employers in defense, semiconductor, and fiber-optic sectors file LCAs regularly. Security-clearance requirements at some firms can complicate sponsorship timelines. For detailed occupation requirements, see the O*NET profile.
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Get Access To All JobsINTRODUCTION
Silicon Photonics (SiPh) and optical I/O are rapidly becoming foundational to next-generation data center SoCs, unlocking the bandwidth, energy efficiency, and reach that electrical interconnects can no longer sustain. This is a pioneering opportunity to help shape how Apple's silicon connects at the speed of light. Are you a hard-working and proactive engineering leader with a curiosity about optics, photonics, and the future of high-bandwidth silicon interconnects? We are absolutely seeking you out!
DESCRIPTION
Apple is seeking an experienced Engineering Program Manager to lead Analog, Mixed-Signal, and Silicon Photonics IP programs within our silicon organization, with a focus on data center SoCs. In this role, you will drive the end-to-end development of high-speed AMS and optical IPs, including SerDes, PLLs, Data Converters, TIAs, drivers, and Silicon Photonics engines / optical I/O subsystems, from early concept through mass production, ensuring quality, schedule, and successful delivery across our SoC portfolio.
You will bring deep familiarity with advanced packaging technologies (including 2.5D/3D near and co-packaged optics), cutting-edge silicon nodes, SiPh process platforms, and AMS IP development flows and methodologies in an SoC environment. You will serve as the connective tissue across SoC Integration, IC Design, SoC PD, SoC DV, Photonics Design, Optical Packaging, CAD, Software, Hardware, Reliability, and Legal - defining test structure requirements, establishing robust electrical and optical testing methodologies, and ensuring all technical and compliance gates are met on schedule.
Your ability to distill complex electro-optical technical information into clear communication, identify risks across a multi-disciplinary supply chain (foundries, OSATs, laser and optical component vendors), develop mitigation strategies, and align diverse cross-functional stakeholders will be critical to delivering on aggressive hardware milestones for data center silicon.
Responsibilities
-
Drive Silicon, Photonics & Packaging Execution: Manage the program lifecycle for complex Mixed-Signal IP, Silicon Photonics engines, and optical I/O subsystems within data center SoC designs, ensuring alignment from concept to tape-out to HVM.
-
Lead Optical I/O & Co-Packaged Optics Programs: Orchestrate development of optical engine modules, fiber array/connector integration, and co-packaged optics (CPO) solutions in partnership with photonics design, packaging, and assembly teams.
-
Collaborate on Proprietary Tech: Partner closely with foundational vendors, silicon and photonics foundries, OSATs, and laser / optical component suppliers to co-develop proprietary hardware solutions tailored for next-generation data center products.
-
Define Electrical & Optical Testing Frameworks: Collaborate with engineering teams to define requirements for advanced electrical and optical test structures (loopback, BER, optical coupling, wavelength, thermal) and implement robust characterization and qualification strategies.
-
Orchestrate Cross-Functional Teams: Act as the central hub connecting IC Design, Photonics Design, SI/PI, Optical Packaging, Reliability, Operations, Tooling, and Legal to ensure all program dependencies, compliance, and technical gates are met.
-
Global Program Management: Lead and synchronize global engineering efforts, effectively managing communication and deliverables across multiple international time zones and a geographically distributed photonics ecosystem.
-
Navigate Ambiguity in an Emerging Domain: Maintain high agility and execution velocity in the rapidly evolving SiPh and optical I/O landscape, adapting schedules and strategies as project requirements, standards, and technologies pivot.
MINIMUM QUALIFICATIONS
-
BS in Electrical Engineering, Electrical and Computer Engineering, Applied Physics, Optics, or a related field, and 10+ years of relevant experience.
-
Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management.
PREFERRED QUALIFICATIONS
-
MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials Science, or an equivalent field.
-
Hands-on program leadership experience with Silicon Photonics devices and subsystems (lasers, modulators, photodetectors, waveguides, MUX/DeMUX, grating/edge couplers) and/or optical I/O and co-packaged optics (CPO) for data center applications.
-
Extensive experience with AMS IPs supporting optical interconnects, including high-speed SerDes, TIAs, laser/modulator drivers, CDRs, and PLLs across advanced technology nodes.
-
Familiarity with optical packaging concepts: fiber-array attach, active/passive alignment, flip-chip and CoC/CoW/WLP assembly, and thermal / reliability considerations for photonic packages.
-
Proven leadership in delivering high-reliability AMS and/or photonic IPs for data center infrastructure at scale.
-
Demonstrated ability to define and drive multi-generational IP and optical interconnect roadmaps in alignment with product strategy and business objectives.
-
Established track record of executive-level influence and stakeholder management across large, matrixed organizations spanning silicon, photonics, packaging, and supply chain.
-
Deep expertise in advanced EDA tools, IP development methodologies, and SoC integration across cutting-edge technology nodes for data center platforms.
-
History of proactive risk management and real-time crisis leadership in high-complexity, high-visibility programs with direct executive accountability.
-
Experience with adjacent optical technologies (uLED, uVCSEL) and their applications to SoCs is a plus.
PAY & BENEFITS
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $166,600 and $296,000, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
INTRODUCTION
Silicon Photonics (SiPh) and optical I/O are rapidly becoming foundational to next-generation data center SoCs, unlocking the bandwidth, energy efficiency, and reach that electrical interconnects can no longer sustain. This is a pioneering opportunity to help shape how Apple's silicon connects at the speed of light. Are you a hard-working and proactive engineering leader with a curiosity about optics, photonics, and the future of high-bandwidth silicon interconnects? We are absolutely seeking you out!
DESCRIPTION
Apple is seeking an experienced Engineering Program Manager to lead Analog, Mixed-Signal, and Silicon Photonics IP programs within our silicon organization, with a focus on data center SoCs. In this role, you will drive the end-to-end development of high-speed AMS and optical IPs, including SerDes, PLLs, Data Converters, TIAs, drivers, and Silicon Photonics engines / optical I/O subsystems, from early concept through mass production, ensuring quality, schedule, and successful delivery across our SoC portfolio.
You will bring deep familiarity with advanced packaging technologies (including 2.5D/3D near and co-packaged optics), cutting-edge silicon nodes, SiPh process platforms, and AMS IP development flows and methodologies in an SoC environment. You will serve as the connective tissue across SoC Integration, IC Design, SoC PD, SoC DV, Photonics Design, Optical Packaging, CAD, Software, Hardware, Reliability, and Legal - defining test structure requirements, establishing robust electrical and optical testing methodologies, and ensuring all technical and compliance gates are met on schedule.
Your ability to distill complex electro-optical technical information into clear communication, identify risks across a multi-disciplinary supply chain (foundries, OSATs, laser and optical component vendors), develop mitigation strategies, and align diverse cross-functional stakeholders will be critical to delivering on aggressive hardware milestones for data center silicon.
Responsibilities
-
Drive Silicon, Photonics & Packaging Execution: Manage the program lifecycle for complex Mixed-Signal IP, Silicon Photonics engines, and optical I/O subsystems within data center SoC designs, ensuring alignment from concept to tape-out to HVM.
-
Lead Optical I/O & Co-Packaged Optics Programs: Orchestrate development of optical engine modules, fiber array/connector integration, and co-packaged optics (CPO) solutions in partnership with photonics design, packaging, and assembly teams.
-
Collaborate on Proprietary Tech: Partner closely with foundational vendors, silicon and photonics foundries, OSATs, and laser / optical component suppliers to co-develop proprietary hardware solutions tailored for next-generation data center products.
-
Define Electrical & Optical Testing Frameworks: Collaborate with engineering teams to define requirements for advanced electrical and optical test structures (loopback, BER, optical coupling, wavelength, thermal) and implement robust characterization and qualification strategies.
-
Orchestrate Cross-Functional Teams: Act as the central hub connecting IC Design, Photonics Design, SI/PI, Optical Packaging, Reliability, Operations, Tooling, and Legal to ensure all program dependencies, compliance, and technical gates are met.
-
Global Program Management: Lead and synchronize global engineering efforts, effectively managing communication and deliverables across multiple international time zones and a geographically distributed photonics ecosystem.
-
Navigate Ambiguity in an Emerging Domain: Maintain high agility and execution velocity in the rapidly evolving SiPh and optical I/O landscape, adapting schedules and strategies as project requirements, standards, and technologies pivot.
MINIMUM QUALIFICATIONS
-
BS in Electrical Engineering, Electrical and Computer Engineering, Applied Physics, Optics, or a related field, and 10+ years of relevant experience.
-
Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management.
PREFERRED QUALIFICATIONS
-
MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials Science, or an equivalent field.
-
Hands-on program leadership experience with Silicon Photonics devices and subsystems (lasers, modulators, photodetectors, waveguides, MUX/DeMUX, grating/edge couplers) and/or optical I/O and co-packaged optics (CPO) for data center applications.
-
Extensive experience with AMS IPs supporting optical interconnects, including high-speed SerDes, TIAs, laser/modulator drivers, CDRs, and PLLs across advanced technology nodes.
-
Familiarity with optical packaging concepts: fiber-array attach, active/passive alignment, flip-chip and CoC/CoW/WLP assembly, and thermal / reliability considerations for photonic packages.
-
Proven leadership in delivering high-reliability AMS and/or photonic IPs for data center infrastructure at scale.
-
Demonstrated ability to define and drive multi-generational IP and optical interconnect roadmaps in alignment with product strategy and business objectives.
-
Established track record of executive-level influence and stakeholder management across large, matrixed organizations spanning silicon, photonics, packaging, and supply chain.
-
Deep expertise in advanced EDA tools, IP development methodologies, and SoC integration across cutting-edge technology nodes for data center platforms.
-
History of proactive risk management and real-time crisis leadership in high-complexity, high-visibility programs with direct executive accountability.
-
Experience with adjacent optical technologies (uLED, uVCSEL) and their applications to SoCs is a plus.
PAY & BENEFITS
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $166,600 and $296,000, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
See all 1,956+ Photonics Engineer Jobs
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Photonics Engineer roles.
Get Access To All JobsTips for Finding Visa Sponsorship as a Photonics Engineer
Verify your degree maps to photonics
USCIS evaluates specialty occupation based on degree field, not job title. A degree in electrical engineering, physics, or optical engineering typically satisfies the requirement. A general engineering degree without photonics coursework may trigger a Request for Evidence.
Check employer LCA history before applying
Search the OFLC Wage Search for your target employer's LCA filings under SOC code 17-2199 or 17-3029. Employers who've certified LCAs for photonics or optical engineer roles have an active sponsorship process already in place.
Target defense contractors with clearance-exempt roles
Many defense-sector photonics roles require security clearance that non-citizens can't hold, which blocks sponsorship entirely. Filter your search to commercial photonics, telecom, and semiconductor firms where clearance isn't a prerequisite for the specific position.
Confirm prevailing wage tier before salary negotiation
DOL assigns photonics roles to wage levels I through IV. Your offered salary must meet or exceed the certified LCA wage. Use the OFLC Wage Search to look up Level II or III rates for your metro area before you negotiate an offer.
File your LCA early if your employer is new to sponsorship
First-time sponsors often underestimate the DOL LCA certification window and I-129 preparation timeline. Use Migrate Mate to handle the LCA filing and USCIS petition so your start date doesn't slip while the employer gets up to speed on the process.
Request cap-exempt status through a university research lab
If you're working on a photonics research project affiliated with a nonprofit research organization or university, your employer may qualify as cap-exempt. Cap-exempt H-1B petitions can be filed year-round without waiting for the annual lottery.
Frequently Asked Questions
Does a Photonics Engineer role qualify as an H-1B specialty occupation?
Yes. Photonics Engineer positions consistently qualify because USCIS requires a bachelor's degree or higher in a specific technical field as a minimum entry requirement for the role. Employers typically document this through job postings specifying electrical engineering, optical engineering, or physics. Roles where any engineering degree satisfies the requirement without field specificity are more likely to face scrutiny during adjudication.
Which degree fields support H-1B sponsorship for photonics roles?
Electrical engineering, optical engineering, physics, photonics, and applied optics are the most straightforward degree matches. Materials science and mechanical engineering can qualify if the employer documents that the specific role requires that field's coursework. According to O*NET, the occupation sits in Job Zone 4, requiring a four-year degree. Australian three-year bachelor's degrees are generally accepted by USCIS as equivalent.
Why do some photonics employers refuse to sponsor visas?
Defense and aerospace employers often cite security clearance requirements. Many photonics roles at those firms require a U.S. security clearance that non-U.S. citizens aren't eligible to hold, which makes sponsorship impractical regardless of technical qualifications. Commercial photonics, semiconductor, and fiber-optic telecom employers don't face this constraint and are more likely to sponsor. Filtering your search on Migrate Mate by visa-sponsoring employers helps surface those categories.
How does the H-1B lottery affect photonics engineers specifically?
The standard H-1B cap applies unless your employer qualifies as cap-exempt. Photonics engineers working for universities, nonprofit research institutions, or employers affiliated with federally funded R&D centers may be cap-exempt, meaning their petition can be filed at any time. For cap-subject roles, USCIS runs the annual registration lottery each March, with a 65,000 regular-cap and 20,000 U.S. master's degree exemption.
Can a Photonics Engineer qualify for an O-1A visa instead of H-1B?
Yes, and it's worth evaluating if your work includes peer-reviewed publications, patents, or conference presentations at recognized photonics venues like SPIE or OSA. The O-1A requires demonstrating extraordinary ability through evidence meeting at least three of eight USCIS criteria. Unlike the H-1B, there's no lottery and no annual cap, making it a viable alternative if your publication or invention record supports the petition.
What is the prevailing wage requirement for sponsored Photonics Engineer jobs?
U.S. employers sponsoring a visa must pay at least the prevailing wage, which is what workers in the same role, area, and experience level typically earn. The Department of Labor sets this rate to make sure companies aren't hiring foreign workers simply because they'd accept lower pay than a U.S. worker. It varies by job title, location, and experience. You can look up current prevailing wage rates for any occupation and location using the OFLC Wage Search page.