R D Engineering Jobs in Austin, TX
R D Engineering jobs in Austin, Texas are concentrated in the Domain, East Austin's tech corridor, and the Mueller district, where semiconductor, defense electronics, and cleantech employers are actively hiring. Companies currently posting openings include Synopsys, University of Texas at Austin, and Fivetran. See the openings below and apply to the ones that match your experience.
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Category Engineering Hire Type Employee Job ID 18345 Base Salary Range $166000-$249000 Remote Eligible No Date Posted 08/09/2026
Principal EDA R&D Engineer, Advanced Packaging
We Are
Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.
You Are
You have built a career at the intersection of package substrate design and EDA tool development, and you understand that advancing the field requires more than incremental feature improvements. It requires rethinking the underlying technical approach. You are the engineer who can engage in substantive technical discussions with foundry partners and assembly and test companies about DRC constraints, PDN topology, and Design Rule Manual implementation, translating those conversations into actionable R&D direction.
Your experience spans both the theoretical and the practical. You have developed EDA tools that handle production-scale designs, and you understand computational geometry well enough to anticipate when an algorithm will scale and when it will encounter limitations. You have worked through the details of ODB++ output formats and manufacturing handoff requirements because you know that tools must integrate seamlessly into real-world flows.
At this stage in your career, you contribute to technical strategy while maintaining deep hands-on involvement in implementation. You guide less experienced engineers through complex technical decisions, helping them develop the judgment that comes from years of solving hard problems. At Synopsys, you will work on package substrate technology that enables the next generation of semiconductor products, and your technical contributions will influence how the industry approaches these design challenges.
What You'll Be Doing
- Lead R&D projects that advance the state of the art in package substrate design automation, including auto-routing algorithms, DRC verification engines, power delivery network analysis, and design-for-manufacturing capabilities
- Drive technical direction for database models that enable schematic-driven layout workflows and support integration across the Synopsys packaging tool suite
- Develop and optimize EDA software using C++, Python, and TCL to address complex challenges in computational geometry, constraint solving, and physical design automation
- Collaborate directly with foundries and assembly and test companies to implement emerging substrate technologies, translating their Design Rule Manuals and manufacturing requirements into functional tooling
- Work with cross-functional teams to define collateral input/output formats, integrate analysis capabilities, and ensure database architectures support increasingly complex designs
- Provide technical guidance to engineers across the R&D organization, reviewing designs and implementations, and helping the team navigate technical tradeoffs
- Engage with customers in technical discussions at senior levels, representing Synopsys expertise in substrate design methodology and contributing to product direction
The Impact You Will Have
- Establish technical foundations for next-generation package substrate design tools that will be adopted across the semiconductor industry
- Enable customers to design substrates for advanced packaging technologies that current tooling cannot adequately support
- Reduce design cycle time by delivering automation that accurately models the constraints substrate engineers face in production environments
- Influence product roadmap by translating customer requirements and foundry technology trends into prioritized R&D initiatives
- Accelerate adoption of new packaging technologies by developing tools that integrate effectively with manufacturing flows and identify design-for-manufacturing issues early
- Shape industry best practices by collaborating with foundries and OSATs to develop and validate new design methodologies
- Strengthen the technical capabilities of the R&D organization through mentorship and knowledge transfer
What You'll Need
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience in EDA or semiconductor design
- 10+ years of experience in EDA software development with focus on physical design automation, package design, or substrate design
- Deep technical expertise in package substrate physical design methodologies, including schematic-driven layout, auto-routing, design rule checking, and power delivery network analysis
- Strong programming proficiency in Python or TCL for tool integration and automation
- Demonstrated track record leading R&D projects that resulted in production software capabilities or significant architectural improvements
- Experience collaborating with foundries, OSATs, or substrate manufacturers on Design Rule Manuals, technology files, and manufacturing output formats such as ODB++
- Solid foundation in computational geometry and algorithm design for layout automation, experience with constraint-based routing or placement is highly valued
Who You Are
- You can engage in technical discussions with senior engineering leaders at semiconductor companies and clearly articulate complex technical tradeoffs and solution approaches
- You raise concerns when technical requirements conflict with sound architectural principles, and you can articulate alternative approaches that address the underlying need
- You write well-structured code with attention to maintainability, documentation, and long-term supportability
- You are effective working in environments where requirements are still evolving, particularly when new packaging technologies are under development and design rules are not yet finalized
- You understand how to guide less experienced engineers through technical challenges in a way that builds their capabilities and judgment
- You approach partnerships with foundries and OSATs as collaborative technical relationships, recognizing that effective solutions require understanding their constraints and processes
The Team You'll Be Part Of
Your recruiter will
Category Engineering Hire Type Employee Job ID 18345 Base Salary Range $166000-$249000 Remote Eligible No Date Posted 08/09/2026
Principal EDA R&D Engineer, Advanced Packaging
We Are
Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.
You Are
You have built a career at the intersection of package substrate design and EDA tool development, and you understand that advancing the field requires more than incremental feature improvements. It requires rethinking the underlying technical approach. You are the engineer who can engage in substantive technical discussions with foundry partners and assembly and test companies about DRC constraints, PDN topology, and Design Rule Manual implementation, translating those conversations into actionable R&D direction.
Your experience spans both the theoretical and the practical. You have developed EDA tools that handle production-scale designs, and you understand computational geometry well enough to anticipate when an algorithm will scale and when it will encounter limitations. You have worked through the details of ODB++ output formats and manufacturing handoff requirements because you know that tools must integrate seamlessly into real-world flows.
At this stage in your career, you contribute to technical strategy while maintaining deep hands-on involvement in implementation. You guide less experienced engineers through complex technical decisions, helping them develop the judgment that comes from years of solving hard problems. At Synopsys, you will work on package substrate technology that enables the next generation of semiconductor products, and your technical contributions will influence how the industry approaches these design challenges.
What You'll Be Doing
- Lead R&D projects that advance the state of the art in package substrate design automation, including auto-routing algorithms, DRC verification engines, power delivery network analysis, and design-for-manufacturing capabilities
- Drive technical direction for database models that enable schematic-driven layout workflows and support integration across the Synopsys packaging tool suite
- Develop and optimize EDA software using C++, Python, and TCL to address complex challenges in computational geometry, constraint solving, and physical design automation
- Collaborate directly with foundries and assembly and test companies to implement emerging substrate technologies, translating their Design Rule Manuals and manufacturing requirements into functional tooling
- Work with cross-functional teams to define collateral input/output formats, integrate analysis capabilities, and ensure database architectures support increasingly complex designs
- Provide technical guidance to engineers across the R&D organization, reviewing designs and implementations, and helping the team navigate technical tradeoffs
- Engage with customers in technical discussions at senior levels, representing Synopsys expertise in substrate design methodology and contributing to product direction
The Impact You Will Have
- Establish technical foundations for next-generation package substrate design tools that will be adopted across the semiconductor industry
- Enable customers to design substrates for advanced packaging technologies that current tooling cannot adequately support
- Reduce design cycle time by delivering automation that accurately models the constraints substrate engineers face in production environments
- Influence product roadmap by translating customer requirements and foundry technology trends into prioritized R&D initiatives
- Accelerate adoption of new packaging technologies by developing tools that integrate effectively with manufacturing flows and identify design-for-manufacturing issues early
- Shape industry best practices by collaborating with foundries and OSATs to develop and validate new design methodologies
- Strengthen the technical capabilities of the R&D organization through mentorship and knowledge transfer
What You'll Need
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience in EDA or semiconductor design
- 10+ years of experience in EDA software development with focus on physical design automation, package design, or substrate design
- Deep technical expertise in package substrate physical design methodologies, including schematic-driven layout, auto-routing, design rule checking, and power delivery network analysis
- Strong programming proficiency in Python or TCL for tool integration and automation
- Demonstrated track record leading R&D projects that resulted in production software capabilities or significant architectural improvements
- Experience collaborating with foundries, OSATs, or substrate manufacturers on Design Rule Manuals, technology files, and manufacturing output formats such as ODB++
- Solid foundation in computational geometry and algorithm design for layout automation, experience with constraint-based routing or placement is highly valued
Who You Are
- You can engage in technical discussions with senior engineering leaders at semiconductor companies and clearly articulate complex technical tradeoffs and solution approaches
- You raise concerns when technical requirements conflict with sound architectural principles, and you can articulate alternative approaches that address the underlying need
- You write well-structured code with attention to maintainability, documentation, and long-term supportability
- You are effective working in environments where requirements are still evolving, particularly when new packaging technologies are under development and design rules are not yet finalized
- You understand how to guide less experienced engineers through technical challenges in a way that builds their capabilities and judgment
- You approach partnerships with foundries and OSATs as collaborative technical relationships, recognizing that effective solutions require understanding their constraints and processes
The Team You'll Be Part Of
Your recruiter will
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Who's Hiring
- Synopsys16
- University of Texas at Austin16
- Fivetran10
- Orbia3
- NVIDIA3
Top Industries Hiring
- Technology & Software10
- Education3
- Manufacturing3
- Food & Beverage3
- Law & Legal Services3
R D Engineering Jobs in Austin: Frequently Asked Questions
How do I get a r d engineering job in Austin?
Austin's r d engineering market is driven by semiconductor design, defense electronics, and clean energy, with the heaviest hiring in the Domain, Mueller, and North Austin research campuses. Candidates with hands-on lab experience, prototyping skills, or familiarity with RF, photonics, or embedded systems have a clear edge locally. Targeting mid-size hardware startups alongside large employers like chip fabricators and defense contractors broadens your options significantly in this market.
Which companies hire r d engineerings in Austin?
Companies currently hiring r d engineerings in Austin include Synopsys, University of Texas at Austin, and Fivetran, per current listings on Migrate Mate as of August 2026. Austin's r d engineering employers range from global semiconductor firms and defense contractors to well-funded hardware startups and university-affiliated research centers.
Are there remote r d engineering jobs in Austin?
Yes, though it depends heavily on the role, since hands-on lab and hardware prototyping work is rarely fully remote while computational modeling, simulation, and documentation roles can be. About 50% of r d engineering openings tied to Austin are remote or hybrid as of August 2026, and the most remote-friendly positions tend to be in software-defined systems, data analysis, and technical program management within Austin's tech sector.
How can I get a r d engineering job in Austin with little or no experience?
The most realistic entry path in Austin is through co-op or internship programs at the city's semiconductor and defense employers, which regularly convert into full-time roles. University of Texas research labs and Austin Community College's engineering technology programs also place entry-level candidates with local firms. Targeting test engineering, lab technician, or engineering associate titles at mid-size Austin hardware companies is a practical way to build the hands-on credentials larger employers require.
Which industries hire the most r d engineerings in Austin?
Austin r d engineering roles concentrate in Technology & Software, Education, and Manufacturing, based on current listings on Migrate Mate as of August 2026. Austin's decades-long investment in semiconductor manufacturing, a growing defense electronics presence, and an expanding cleantech startup scene collectively sustain strong and consistent demand for r d engineering talent across the city.
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