Director Of Projects Visa Sponsorship Jobs in Idaho
Director of projects roles in Idaho are concentrated in Boise's growing tech and construction sectors, with employers like Micron Technology, St. Luke's Health System, and Idaho Power among the state's larger organizations managing complex, multi-year initiatives. International candidates seeking visa sponsorship will find the most opportunities in the Treasure Valley region.
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Get Access To All JobsINTRODUCTION
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
ROLE AND RESPONSIBILITIES
As Director of Package Materials Integration in Advanced Packaging Technology Development (APTD), you will lead the strategy, execution, and organizational capability for Micron’s advanced packaging materials roadmap for advanced 3D memory products including HBM and 3DS DRAM. You will lead a global team with direct reports in both the U.S. and Asia and work closely with cross-functional partners across process development, process integration, equipment development, manufacturing, global quality, and purchasing. You will be responsible for setting the advanced packaging materials roadmap, driving supplier engagement to meet roadmap needs, building organizational capability across regions, leading materials aspects of program execution, and resolving critical materials-package interaction issues.
Responsibilities will include, but are not limited to:
- Lead the advanced packaging materials roadmap and ensure alignment with overall product roadmap timelines across multiple development programs.
- Provide organizational leadership for a diverse materials portfolio that includes chemistries (plating, cleaning, etc.), photoresists, films (dicing tapes, temporary bond films, etc.), polymer composites (NCF, mold compound, etc.), and carrier materials (glass, silicon, etc.).
- Lead supplier engagement at executive and engineering levels to prototype, develop, and certify materials in alignment with program requirements, timelines, and long-range roadmap needs.
- Build and lead a high-performing global team with direct reports in both the U.S. and Asia, establishing clear priorities, talent development plans, and strong execution disciplines.
- Partner with process engineering, equipment development, and process integration leaders to ensure all TD deliverables are met and that regional teams operate with aligned priorities and decision-making.
- Drive materials characterization strategies to understand materials-package interaction mechanisms using analytical, mechanical, and thermal testing and analysis, and translate findings into development and product decisions.
- Lead development of novel materials solutions in conjunction with advanced packaging and product teams to recommend optimum package solutions that meet electrical, mechanical, thermal, reliability, cost, and system-level requirements.
- Interface closely with Product Development, frontend Si TD, APTD, Manufacturing, and Global Quality to lead the product/package path from pathfinding through development and into high-volume manufacturing.
BASIC QUALIFICATIONS
Successful candidates for this position will have:
- Demonstrated success leading technical organizations with a strong foundation in structured problem solving.
- Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
- Experience and working knowledge with materials used throughout the advanced packaging flow.
- Understanding of and experience working with materials suppliers in the advanced packaging supply chain/ecosystem.
- Working knowledge of materials characterization techniques and simulation (thermal/mechanical/electrical) methodologies.
- Knowledge in materials-package interactions.
- Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.
- Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
- Proven people leadership with experience managing managers and/or senior technical leaders across geographies, including direct reports in both the U.S. and Asia.
- Demonstrated ability to set organizational direction, develop talent, and drive technical excellence through cross-functional and cross-regional teams.
REQUIRED EXPERIENCE
- Master of Science/PhD in chemistry, chemical engineering, or materials science and engineering. PhD preferred.
- 15+ years of relevant experience in semiconductor manufacturing or a related field, including hands-on experience in semiconductor advanced packaging.
- 10+ years of management/leadership experience in packaging technology development, including responsibility for leading global teams and driving execution across regions.
- Strong understanding of semiconductor process integration and process development.
- Proven program and organizational leadership skills, with experience driving cross-functional technical teams, influencing executive stakeholders, and delivering results through others.
- Experience with advanced memory packaging is a plus.
BENEFITS
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3).
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
INTRODUCTION
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
ROLE AND RESPONSIBILITIES
As Director of Package Materials Integration in Advanced Packaging Technology Development (APTD), you will lead the strategy, execution, and organizational capability for Micron’s advanced packaging materials roadmap for advanced 3D memory products including HBM and 3DS DRAM. You will lead a global team with direct reports in both the U.S. and Asia and work closely with cross-functional partners across process development, process integration, equipment development, manufacturing, global quality, and purchasing. You will be responsible for setting the advanced packaging materials roadmap, driving supplier engagement to meet roadmap needs, building organizational capability across regions, leading materials aspects of program execution, and resolving critical materials-package interaction issues.
Responsibilities will include, but are not limited to:
- Lead the advanced packaging materials roadmap and ensure alignment with overall product roadmap timelines across multiple development programs.
- Provide organizational leadership for a diverse materials portfolio that includes chemistries (plating, cleaning, etc.), photoresists, films (dicing tapes, temporary bond films, etc.), polymer composites (NCF, mold compound, etc.), and carrier materials (glass, silicon, etc.).
- Lead supplier engagement at executive and engineering levels to prototype, develop, and certify materials in alignment with program requirements, timelines, and long-range roadmap needs.
- Build and lead a high-performing global team with direct reports in both the U.S. and Asia, establishing clear priorities, talent development plans, and strong execution disciplines.
- Partner with process engineering, equipment development, and process integration leaders to ensure all TD deliverables are met and that regional teams operate with aligned priorities and decision-making.
- Drive materials characterization strategies to understand materials-package interaction mechanisms using analytical, mechanical, and thermal testing and analysis, and translate findings into development and product decisions.
- Lead development of novel materials solutions in conjunction with advanced packaging and product teams to recommend optimum package solutions that meet electrical, mechanical, thermal, reliability, cost, and system-level requirements.
- Interface closely with Product Development, frontend Si TD, APTD, Manufacturing, and Global Quality to lead the product/package path from pathfinding through development and into high-volume manufacturing.
BASIC QUALIFICATIONS
Successful candidates for this position will have:
- Demonstrated success leading technical organizations with a strong foundation in structured problem solving.
- Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
- Experience and working knowledge with materials used throughout the advanced packaging flow.
- Understanding of and experience working with materials suppliers in the advanced packaging supply chain/ecosystem.
- Working knowledge of materials characterization techniques and simulation (thermal/mechanical/electrical) methodologies.
- Knowledge in materials-package interactions.
- Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.
- Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
- Proven people leadership with experience managing managers and/or senior technical leaders across geographies, including direct reports in both the U.S. and Asia.
- Demonstrated ability to set organizational direction, develop talent, and drive technical excellence through cross-functional and cross-regional teams.
REQUIRED EXPERIENCE
- Master of Science/PhD in chemistry, chemical engineering, or materials science and engineering. PhD preferred.
- 15+ years of relevant experience in semiconductor manufacturing or a related field, including hands-on experience in semiconductor advanced packaging.
- 10+ years of management/leadership experience in packaging technology development, including responsibility for leading global teams and driving execution across regions.
- Strong understanding of semiconductor process integration and process development.
- Proven program and organizational leadership skills, with experience driving cross-functional technical teams, influencing executive stakeholders, and delivering results through others.
- Experience with advanced memory packaging is a plus.
BENEFITS
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3).
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Director Of Projects Job Roles in Idaho
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Search Director Of Projects Jobs in IdahoDirector Of Projects Jobs in Idaho: Frequently Asked Questions
Which companies sponsor visas for director of projects roles in Idaho?
Micron Technology in Boise is one of Idaho's most active H-1B visa sponsors and regularly hires for senior project leadership roles. St. Luke's Health System, Idaho Power, and Clearwater Paper have also filed LCAs for project management positions. Larger engineering and construction firms operating in the state, including those supporting semiconductor and energy infrastructure, are generally the most likely to sponsor.
Which visa types are most common for director of projects roles in Idaho?
The H-1B is the most common visa for director of projects roles in Idaho, as the position typically requires a bachelor's degree or higher in a relevant field such as engineering, business, or information technology, satisfying the specialty occupation requirement. Candidates with extraordinary achievements may qualify for the O-1A. Those already holding TN visa or L-1 visa status through a qualifying employer may also be eligible for project director positions without an additional cap-subject petition.
Which cities in Idaho have the most director of projects sponsorship jobs?
Boise accounts for the clear majority of director of projects sponsorship activity in Idaho, driven by its concentration of technology, healthcare, and utility employers. Nampa and Meridian, both part of the Treasure Valley metro area, also see project leadership hiring tied to manufacturing and healthcare expansion. Idaho Falls has a smaller but active market connected to the energy and nuclear research sectors near the Idaho National Laboratory.
How to find director of projects visa sponsorship jobs in Idaho?
Migrate Mate filters job listings specifically to roles where employers are willing to sponsor work visas, so you can search director of projects openings in Idaho without sorting through positions that exclude international candidates. The platform is useful for identifying which Idaho employers are actively hiring for senior project leadership and have a documented history of sponsorship, particularly in Boise's technology and healthcare markets.
Are there any Idaho-specific considerations for director of projects candidates seeking sponsorship?
Idaho's sponsorship market for director of projects roles is smaller than coastal tech hubs, so candidates benefit from targeting industries where the state has genuine depth: semiconductor manufacturing, energy infrastructure, and regional healthcare systems. The Department of Labor's prevailing wage for project director roles in the Boise metropolitan area reflects local market rates, which employers must meet or exceed in any H-1B Labor Condition Application filed for Idaho positions.
What is the prevailing wage for sponsored director of projects jobs in Idaho?
U.S. employers sponsoring a visa must pay at least the prevailing wage, which is what workers in the same role, area, and experience level typically earn. The Department of Labor sets this rate to make sure companies aren't hiring foreign workers simply because they'd accept lower pay than a U.S. worker. It varies by job title, location, and experience. You can look up current prevailing wage rates for any occupation and location using the OFLC Wage Search page.