Principal Design Engineer Jobs in USA with Visa Sponsorship
Principal Design Engineer roles qualify as specialty occupations under H-1B visa, requiring a bachelor's degree or higher in mechanical, electrical, or systems engineering. Employers typically file LCAs with DOL and I-129 petitions with USCIS, and many also support EB-2 or EB-3 green card sponsorship for long-term hires.
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JR117434
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Description
We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward!
In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.
Responsibilities:
The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive.
Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below.
Foundry Interface and Technology Alignment
- Act as the primary technical interface between foundry partners and Micron design organizations.
- Drive closure of design-process gaps through collaborative engagement with foundry process teams.
- Influence foundry roadmaps related to TSV, BEOL, reliability, and design enablement.
- Define technology requirements for future HBM and custom memory products.
Circuit Simulation and Analysis
- Perform HSPICE simulations for technology evaluation and design optimization.
- Evaluate compact models, PDK SPICE models, and process corners.
- Conduct pre-layout and post-layout circuit analysis.
- Support BEOL optimization and routing studies through simulation.
- Develop methodologies for evaluating design sensitivity to process variations.
Test-Chip and Silicon Validation
- Plan and implement technology evaluation test chips.
- Define process monitor structures and benchmark vehicles.
- Analyze post-silicon data and correlate results with simulations.
- Collaborate with product engineering and foundry/Fab teams on silicon learning and technology qualification.
PDK and Design Enablement
- Evaluate foundry PDKs and IP collateral.
- Support design teams by providing technology guidelines and best-known methods.
- Drive creation of design recommendations, analog guidelines, and digital PPA evaluation methodologies.
- Collaborate with CAD teams on flow enablement and validation.
AI-Enabled Productivity and Efficiency Improvement
- Identify and implement AI-enabled workflows, automation opportunities, and knowledge-management practices to improve engineering productivity, decision quality, and execution efficiency across DTCO, foundry interface, PDK evaluation, and design enablement activities.
Minimum Qualifications
- BS, MS, or PhD or equivalent experience in Electrical Engineering, Computer Engineering, or related field.
- 5+ years of semiconductor industry experience and solid understanding of advanced semiconductor technology development.
- Strong grasp of advanced CMOS technology nodes, FinFET devices, and process integration.
- Hands-on experience with: HSPICE simulations, device characterization, standard cell benchmarking, PPA analysis, parasitic extraction and physical verification.
- Experience in driving AI-enabled engineering practices and automation to improve the efficiency of DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams.
Preferred Qualifications
- Experience working directly with leading foundries such as TSMC, Samsung, Intel Foundry Services, or GlobalFoundries.
- Experience with memory products including DRAM, HBM, or SRAM.
- Knowledge of: TSV technologies, advanced packaging, reliability modeling and aging simulations, advanced BEOL technologies, PDK development and validation.
- Ability to apply AI tools to summarize, analyze, and extract insights from: PDK documentation, Design Rule Manuals (DRMs), reliability reports, foundry collateral, silicon characterization data.
- Experience leading technology pathfinding and node selection activities.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$150,000.00 - $308,000.00 a year
Additional compensation may include benefits, bonuses and equity.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn more about Micron, please visit micron.com/careers.
US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3).
Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Micron Foundation
Strong communities and education are vital to the success of both society and innovative companies. Every Micron site understands the complex needs of their local community. Whether it’s through strategic giving, sponsorships or deploying team member volunteers, we are making a difference.
Sustainability
Micron is committed to sustainable practices and supporting our global community. We are building and maintaining sustainable operations, products, and communities while focusing on opportunities and risks that are most important to our business success and stakeholders.
Job ID
JR117434
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Description
We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward!
In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.
Responsibilities:
The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive.
Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below.
Foundry Interface and Technology Alignment
- Act as the primary technical interface between foundry partners and Micron design organizations.
- Drive closure of design-process gaps through collaborative engagement with foundry process teams.
- Influence foundry roadmaps related to TSV, BEOL, reliability, and design enablement.
- Define technology requirements for future HBM and custom memory products.
Circuit Simulation and Analysis
- Perform HSPICE simulations for technology evaluation and design optimization.
- Evaluate compact models, PDK SPICE models, and process corners.
- Conduct pre-layout and post-layout circuit analysis.
- Support BEOL optimization and routing studies through simulation.
- Develop methodologies for evaluating design sensitivity to process variations.
Test-Chip and Silicon Validation
- Plan and implement technology evaluation test chips.
- Define process monitor structures and benchmark vehicles.
- Analyze post-silicon data and correlate results with simulations.
- Collaborate with product engineering and foundry/Fab teams on silicon learning and technology qualification.
PDK and Design Enablement
- Evaluate foundry PDKs and IP collateral.
- Support design teams by providing technology guidelines and best-known methods.
- Drive creation of design recommendations, analog guidelines, and digital PPA evaluation methodologies.
- Collaborate with CAD teams on flow enablement and validation.
AI-Enabled Productivity and Efficiency Improvement
- Identify and implement AI-enabled workflows, automation opportunities, and knowledge-management practices to improve engineering productivity, decision quality, and execution efficiency across DTCO, foundry interface, PDK evaluation, and design enablement activities.
Minimum Qualifications
- BS, MS, or PhD or equivalent experience in Electrical Engineering, Computer Engineering, or related field.
- 5+ years of semiconductor industry experience and solid understanding of advanced semiconductor technology development.
- Strong grasp of advanced CMOS technology nodes, FinFET devices, and process integration.
- Hands-on experience with: HSPICE simulations, device characterization, standard cell benchmarking, PPA analysis, parasitic extraction and physical verification.
- Experience in driving AI-enabled engineering practices and automation to improve the efficiency of DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams.
Preferred Qualifications
- Experience working directly with leading foundries such as TSMC, Samsung, Intel Foundry Services, or GlobalFoundries.
- Experience with memory products including DRAM, HBM, or SRAM.
- Knowledge of: TSV technologies, advanced packaging, reliability modeling and aging simulations, advanced BEOL technologies, PDK development and validation.
- Ability to apply AI tools to summarize, analyze, and extract insights from: PDK documentation, Design Rule Manuals (DRMs), reliability reports, foundry collateral, silicon characterization data.
- Experience leading technology pathfinding and node selection activities.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$150,000.00 - $308,000.00 a year
Additional compensation may include benefits, bonuses and equity.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn more about Micron, please visit micron.com/careers.
US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3).
Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Micron Foundation
Strong communities and education are vital to the success of both society and innovative companies. Every Micron site understands the complex needs of their local community. Whether it’s through strategic giving, sponsorships or deploying team member volunteers, we are making a difference.
Sustainability
Micron is committed to sustainable practices and supporting our global community. We are building and maintaining sustainable operations, products, and communities while focusing on opportunities and risks that are most important to our business success and stakeholders.
See all 911+ Principal Design Engineer Jobs
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Principal Design Engineer roles.
Get Access To All JobsTips for Finding Visa Sponsorship as a Principal Design Engineer
Map your degree to your engineering discipline
USCIS scrutinizes whether your specific degree field directly relates to the Principal Design Engineer role. A mechanical engineering degree supporting a thermal systems design role clears this bar; a general business degree does not. Document the technical coursework that ties your credentials to the job's design scope.
Use OFLC Wage Search before accepting offers
Principal Design Engineer prevailing wages vary significantly by metro area and experience level. Run the OFLC Wage Search for your target city before negotiations so you know the Level III or Level IV wage your employer must certify on the LCA, and can flag any offer that falls below it.
Target companies with active LCA filing history
Defense contractors, semiconductor firms, and industrial automation companies file disproportionately high LCA volumes for design engineering roles. Search Migrate Mate to browse employers with verified sponsorship history for Principal Design Engineer positions, filtered by location and engineering discipline.
Clarify whether the role is exempt from the H-1B cap
Principal Design Engineers employed directly by universities, affiliated nonprofits, or government research laboratories are cap-exempt, meaning USCIS can approve the petition year-round without lottery selection. If your offer is from an institution in one of these categories, you can start in H-1B status far faster than cap-subject candidates.
Ask about PERM labor certification timing early
Many Principal Design Engineer sponsors initiate PERM for EB-2 or EB-3 green card sponsorship within the first two years of employment. Ask during the offer stage whether the company has an established PERM process, since priority date backlogs for some nationalities make an early filing date critical.
Prepare a patent and publication inventory before interviews
Principal Design Engineer roles frequently draw RFEs from USCIS questioning whether the position requires a specialized degree rather than general engineering experience. A documented list of patents, design publications, and proprietary system contributions strengthens both your LCA specialty occupation argument and any future EB-2 extraordinary ability claim.
Frequently Asked Questions
Does a Principal Design Engineer role qualify as a specialty occupation for H-1B purposes?
Yes, in almost all cases. USCIS classifies Principal Design Engineer as a specialty occupation because the role normally requires at least a bachelor's degree in a directly related engineering field such as mechanical, electrical, aerospace, or systems engineering. Roles that require a generalist background or accept any degree field can face RFEs, so the job description should explicitly state the required discipline.
Which visas can Principal Design Engineers use to work in the United States?
H-1B is the most common path, covering most nationalities and allowing up to six years of initial status. Australian citizens can use the E-3 visa, which has a separate annual cap and no lottery. Canadian and Mexican nationals may qualify under TN visa if the engineering role falls within the USMCA profession list. EB-2 and EB-3 green card sponsorship through PERM labor certification is also standard for this seniority level.
How do I find employers who regularly sponsor Principal Design Engineers?
Migrate Mate lists U.S. employers with verified LCA sponsorship history for engineering roles, searchable by city and job type. This lets you focus your applications on companies that have already demonstrated willingness to file, rather than approaching employers who have no prior sponsorship track record for design engineering positions.
Does my engineering degree need to be from a U.S. institution to qualify for H-1B sponsorship?
No. USCIS accepts foreign degrees if they are equivalent to a U.S. bachelor's degree in the relevant engineering field. Many employers request a credential evaluation from a recognized organization to document equivalency. A three-year Australian engineering degree is generally accepted as equivalent to a U.S. four-year degree, but the evaluation report makes the case explicit and reduces the risk of an RFE.
Can a Principal Design Engineer self-petition for a green card without employer sponsorship?
Yes, under two pathways. The EB-1A extraordinary ability category allows self-petition if you can demonstrate sustained national or international acclaim through patents, publications, awards, or high-salary evidence. The EB-2 National Interest Waiver allows self-petition if your design engineering work has substantial national importance. Both routes bypass PERM labor certification, but the evidentiary bar is significantly higher than standard employer-sponsored EB-2 or EB-3 filings.
What is the prevailing wage requirement for sponsored Principal Design Engineer jobs?
U.S. employers sponsoring a visa must pay at least the prevailing wage, which is what workers in the same role, area, and experience level typically earn. The Department of Labor sets this rate to make sure companies aren't hiring foreign workers simply because they'd accept lower pay than a U.S. worker. It varies by job title, location, and experience. You can look up current prevailing wage rates for any occupation and location using the OFLC Wage Search page.