Principal Engineer Jobs at Astera Labs with Visa Sponsorship
Principal Engineer jobs at Astera Labs involve leading silicon, firmware, and systems architecture work at the intersection of connectivity and AI infrastructure. The company sponsors multiple visa types for this function, making it a realistic target for international engineers with deep hardware or semiconductor experience.
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Get Access To All JobsINTRODUCTION
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements.
ROLE AND RESPONSIBILITIES
Senior Principal Thermal Engineer
Location: Research Triangle Park (RTP), North Carolina
Department: Hardware Engineering / System Architecture
Employment Type: Full-Time
We are seeking a Senior Principal Thermal Engineer to lead thermal architecture across next-generation AI systems, networking platforms, optical interconnects, and rack-scale infrastructure.
The Opportunity
This is a highly visible technical leadership role responsible for defining thermal strategy across:
- PCIe Scale-Up Fabrics
- UALink Scale-Up Networks
- Ethernet Scale-Out Fabrics
- ESUN Network Architectures
- Advanced Fiber Connectivity Solutions
- GPU Compute Platforms
- Rack-Scale AI Systems
- Near Package Optics (NPO)
- Co-Packaged Optics (CPO)
- Air-Cooled and Liquid-Cooled Open Rack Platforms
You will work closely with System Architects, Mechanical Architects, Power Architects, Silicon Engineering Teams, Software Architects, and ODM partners such as Accton, Hyve, Quanta, Wistron, and Gigabyte.
Define End-to-End Thermal Architecture
- Develop thermal architecture from silicon devices through complete rack-scale AI systems.
- Define thermal budgets, cooling requirements, and performance objectives.
- Drive architecture decisions balancing performance, reliability, power, density, and cost.
- Establish multi-generation thermal roadmaps supporting future AI infrastructure.
Lead AI Rack and Platform Cooling Design
Provide Thermal Leadership For
- GPU Compute Platforms
- PCIe Scale-Up Switch Platforms
- UALink Switch Systems
- Ethernet Scale-Out Platforms
- Rack Controllers
- AI Accelerators
- Optical Interconnect Systems
Develop system-level cooling strategies supporting next-generation high-density AI deployments.
Develop Advanced Air and Liquid Cooling Solutions
- Architect airflow solutions for high-performance computing systems.
- Define direct liquid cooling and cold plate solutions.
- Support advanced rack cooling technologies.
- Develop thermal strategies for future 100kW+ AI racks.
- Optimize thermal performance while reducing infrastructure cooling cost.
Lead Optical Thermal Innovation
Develop Thermal Solutions For
- Near Package Optics (NPO)
- Co-Packaged Optics (CPO)
- Optical Engines
- Silicon Photonics Platforms
- Fiber Connectivity Infrastructure
- Optical Transceivers and Modules
Address Thermal Interactions Between
- Optical engines
- High-speed SerDes
- Switch ASICs
- GPU interconnects
- Rack cooling systems
Drive Thermal Modeling and Validation
- Lead CFD simulation activities.
- Perform system-level airflow analysis.
- Develop thermal design guidelines.
- Correlate thermal simulations with lab measurements.
- Establish validation procedures and thermal KPIs.
Collaborate with ODM Partners
Work Directly With ODM And JDM Partners To
- Define thermal requirements
- Review rack and platform thermal designs
- Resolve thermal bottlenecks
- Support qualification and manufacturing readiness
- Ensure compliance with Open Rack design objectives
Partner Across Engineering Functions
Collaborate Closely With
- System Architecture
- Mechanical Engineering
- Power Architecture
- Electrical Engineering
- Silicon Design
- Reliability Engineering
- Manufacturing Operations
to deliver industry-leading AI infrastructure solutions.
BASIC QUALIFICATIONS
- BS, MS, or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Physics, or a related discipline.
- 15+ years of thermal engineering experience.
- Proven track record leading thermal architecture for AI infrastructure, networking platforms, servers, storage, or hyperscale systems.
- Deep expertise in:
+ Heat Transfer
+ Conduction and Convection
+ Airflow Optimization
+ Thermal Characterization
+ Cooling System Design
+ Rack-Level Thermal Architecture
- Hands-on experience using:
+ ANSYS Icepak
+ FloTHERM
+ 6SigmaET
+ CFD tools and methodologies
- Strong experience with thermal validation and correlation techniques.
PREFERRED QUALIFICATIONS
- Experience supporting NVIDIA, AMD, or Intel-based AI platforms.
- Experience with Open Rack and OCP architectures.
- Expertise in liquid cooling technologies.
- Familiarity with PCIe Scale-Up and UALink systems.
- Experience with Ethernet scale-out networking.
- Experience supporting optical technologies including:
+ NPO
+ CPO
+ Optical Engines
+ Silicon Photonics
+ Fiber Connectivity Systems
- Experience supporting rack power densities exceeding 50kW and scaling toward future 100kW–250kW deployments.
- Experience working directly with ODMs and hyperscale customers.
Leadership Attributes
The Ideal Candidate Will Demonstrate
- Strong systems thinking
- Strategic technology leadership
- Cross-functional influence
- Excellent communication skills
- Ability to drive architecture across multiple organizations
- Passion for solving complex infrastructure challenges
Why Join Us?
You will help define the thermal architecture for technologies that power the world's most advanced AI systems, including:
- PCIe Scale-Up Infrastructure
- UALink Fabrics
- Ethernet Scale-Out Networks
- Advanced Fiber Connectivity
- NPO and CPO Optical Architectures
- Open Rack AI Platforms
- Future AI Factory Deployments
This role offers a unique opportunity to influence industry-leading products and shape the future of rack-scale AI infrastructure.
Apply Today
If you are passionate about thermal innovation, AI infrastructure, optical systems, and rack-scale architecture, we'd love to hear from you. The salary range is $195,000 to $250,000, depending on experience, level, and business needs. This role may be eligible for discretionary bonuses, incentives, and benefits.
Join us in Research Triangle Park and help engineer the cooling technologies that power the future of AI.
We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
INTRODUCTION
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements.
ROLE AND RESPONSIBILITIES
Senior Principal Thermal Engineer
Location: Research Triangle Park (RTP), North Carolina
Department: Hardware Engineering / System Architecture
Employment Type: Full-Time
We are seeking a Senior Principal Thermal Engineer to lead thermal architecture across next-generation AI systems, networking platforms, optical interconnects, and rack-scale infrastructure.
The Opportunity
This is a highly visible technical leadership role responsible for defining thermal strategy across:
- PCIe Scale-Up Fabrics
- UALink Scale-Up Networks
- Ethernet Scale-Out Fabrics
- ESUN Network Architectures
- Advanced Fiber Connectivity Solutions
- GPU Compute Platforms
- Rack-Scale AI Systems
- Near Package Optics (NPO)
- Co-Packaged Optics (CPO)
- Air-Cooled and Liquid-Cooled Open Rack Platforms
You will work closely with System Architects, Mechanical Architects, Power Architects, Silicon Engineering Teams, Software Architects, and ODM partners such as Accton, Hyve, Quanta, Wistron, and Gigabyte.
Define End-to-End Thermal Architecture
- Develop thermal architecture from silicon devices through complete rack-scale AI systems.
- Define thermal budgets, cooling requirements, and performance objectives.
- Drive architecture decisions balancing performance, reliability, power, density, and cost.
- Establish multi-generation thermal roadmaps supporting future AI infrastructure.
Lead AI Rack and Platform Cooling Design
Provide Thermal Leadership For
- GPU Compute Platforms
- PCIe Scale-Up Switch Platforms
- UALink Switch Systems
- Ethernet Scale-Out Platforms
- Rack Controllers
- AI Accelerators
- Optical Interconnect Systems
Develop system-level cooling strategies supporting next-generation high-density AI deployments.
Develop Advanced Air and Liquid Cooling Solutions
- Architect airflow solutions for high-performance computing systems.
- Define direct liquid cooling and cold plate solutions.
- Support advanced rack cooling technologies.
- Develop thermal strategies for future 100kW+ AI racks.
- Optimize thermal performance while reducing infrastructure cooling cost.
Lead Optical Thermal Innovation
Develop Thermal Solutions For
- Near Package Optics (NPO)
- Co-Packaged Optics (CPO)
- Optical Engines
- Silicon Photonics Platforms
- Fiber Connectivity Infrastructure
- Optical Transceivers and Modules
Address Thermal Interactions Between
- Optical engines
- High-speed SerDes
- Switch ASICs
- GPU interconnects
- Rack cooling systems
Drive Thermal Modeling and Validation
- Lead CFD simulation activities.
- Perform system-level airflow analysis.
- Develop thermal design guidelines.
- Correlate thermal simulations with lab measurements.
- Establish validation procedures and thermal KPIs.
Collaborate with ODM Partners
Work Directly With ODM And JDM Partners To
- Define thermal requirements
- Review rack and platform thermal designs
- Resolve thermal bottlenecks
- Support qualification and manufacturing readiness
- Ensure compliance with Open Rack design objectives
Partner Across Engineering Functions
Collaborate Closely With
- System Architecture
- Mechanical Engineering
- Power Architecture
- Electrical Engineering
- Silicon Design
- Reliability Engineering
- Manufacturing Operations
to deliver industry-leading AI infrastructure solutions.
BASIC QUALIFICATIONS
- BS, MS, or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Physics, or a related discipline.
- 15+ years of thermal engineering experience.
- Proven track record leading thermal architecture for AI infrastructure, networking platforms, servers, storage, or hyperscale systems.
- Deep expertise in:
+ Heat Transfer
+ Conduction and Convection
+ Airflow Optimization
+ Thermal Characterization
+ Cooling System Design
+ Rack-Level Thermal Architecture
- Hands-on experience using:
+ ANSYS Icepak
+ FloTHERM
+ 6SigmaET
+ CFD tools and methodologies
- Strong experience with thermal validation and correlation techniques.
PREFERRED QUALIFICATIONS
- Experience supporting NVIDIA, AMD, or Intel-based AI platforms.
- Experience with Open Rack and OCP architectures.
- Expertise in liquid cooling technologies.
- Familiarity with PCIe Scale-Up and UALink systems.
- Experience with Ethernet scale-out networking.
- Experience supporting optical technologies including:
+ NPO
+ CPO
+ Optical Engines
+ Silicon Photonics
+ Fiber Connectivity Systems
- Experience supporting rack power densities exceeding 50kW and scaling toward future 100kW–250kW deployments.
- Experience working directly with ODMs and hyperscale customers.
Leadership Attributes
The Ideal Candidate Will Demonstrate
- Strong systems thinking
- Strategic technology leadership
- Cross-functional influence
- Excellent communication skills
- Ability to drive architecture across multiple organizations
- Passion for solving complex infrastructure challenges
Why Join Us?
You will help define the thermal architecture for technologies that power the world's most advanced AI systems, including:
- PCIe Scale-Up Infrastructure
- UALink Fabrics
- Ethernet Scale-Out Networks
- Advanced Fiber Connectivity
- NPO and CPO Optical Architectures
- Open Rack AI Platforms
- Future AI Factory Deployments
This role offers a unique opportunity to influence industry-leading products and shape the future of rack-scale AI infrastructure.
Apply Today
If you are passionate about thermal innovation, AI infrastructure, optical systems, and rack-scale architecture, we'd love to hear from you. The salary range is $195,000 to $250,000, depending on experience, level, and business needs. This role may be eligible for discretionary bonuses, incentives, and benefits.
Join us in Research Triangle Park and help engineer the cooling technologies that power the future of AI.
We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
See all 36+ Principal Engineer Jobs at Astera Labs
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Principal Engineer Jobs at Astera Labs.
Get Access To All JobsTips for Finding Principal Engineer Jobs at Astera Labs
Align your portfolio to connectivity silicon
Astera Labs builds PCIe, CXL, and Ethernet semiconductor solutions. Before applying, reframe your resume around protocol-layer architecture, signal integrity, or ASIC design work that maps directly to these domains.
Pursue OPT early in your hardware job search
F-1 OPT gives you up to 12 months of work authorization before H-1B sponsorship is needed. Filing your OPT application through USCIS at least 90 days before your program end date keeps your timeline on track.
Target roles that specify cross-functional leadership
Principal Engineer postings at Astera Labs often expect ownership across RTL, firmware, and systems validation. Highlighting cross-functional scope in your application signals the seniority level their sponsorship investment is geared toward.
Use Migrate Mate to surface Principal Engineer openings
Astera Labs posts Principal Engineer roles across multiple hardware disciplines. Use Migrate Mate to filter specifically for sponsored positions at Astera Labs, so you're only spending time on roles that explicitly support your visa category.
Clarify TN eligibility before your offer negotiation
Canadian and Mexican engineers may qualify for TN status under USMCA without waiting on the H-1B lottery. Confirm with the hiring team that your specific Principal Engineer role is classifiable as an engineer under DOL's TN occupation list.
Prepare for PERM-backed Green Card timelines
EB-2 and EB-3 sponsorship at the Principal Engineer level involves a DOL PERM labor certification before the I-140 petition. Ask your recruiter early whether the role includes an immigrant visa commitment so you can plan around multi-year processing windows.
Frequently Asked Questions
Does Astera Labs sponsor H-1B visas for Principal Engineers?
Yes. Astera Labs has an active record of H-1B visa sponsorship for Principal Engineer roles, consistent with the demands of hiring specialized semiconductor and systems engineering talent. Because Principal Engineer positions typically require deep domain expertise in areas like PCIe or CXL architecture, they align well with the specialty occupation standard USCIS uses to evaluate H-1B petitions.
Which visa types does Astera Labs commonly use for Principal Engineers?
Astera Labs sponsors H-1B, F-1 OPT, TN visa, and Green Card pathways including EB-2 and EB-3 for Principal Engineer roles. OPT is common for recent graduates entering hardware engineering. TN visa is an option for Canadian and Mexican nationals in qualifying engineering disciplines. Green Card sponsorship through PERM is available for longer-term positions at this seniority level.
How do I apply for Principal Engineer jobs at Astera Labs?
Browse open Principal Engineer positions directly on the Astera Labs careers page or use Migrate Mate to filter for sponsored roles by visa type. Applications typically require a resume that demonstrates ownership of hardware or firmware systems at scale. Roles span connectivity silicon, AI infrastructure, and platform engineering, so tailoring your application to the specific product area improves your chances.
What qualifications does Astera Labs expect for Principal Engineer roles?
Astera Labs Principal Engineer roles generally expect a degree in Electrical Engineering, Computer Engineering, or Computer Science, plus substantial experience in semiconductor design, high-speed protocols, or systems architecture. Hands-on expertise with PCIe, CXL, or Ethernet is a recurring requirement. Leadership experience coordinating across RTL, firmware, and validation teams is often expected at this level.
How do I plan the timeline if Astera Labs sponsors my H-1B?
H-1B petitions are subject to an annual lottery that opens in March for an October 1 start date. If you're on F-1 OPT, your authorization can bridge the gap while the petition is processed. Premium processing through USCIS reduces adjudication to roughly 15 business days once the petition is filed, which is worth discussing with your Astera Labs hiring contact if timing is tight.