Green Card Photonics Engineer Jobs
Photonics Engineer roles qualify for EB-2 and EB-3 green card sponsorship through the PERM labor certification process, which requires employers to document recruitment efforts before filing an I-140 immigrant petition. Roles in optical systems design, laser development, and fiber-optic integration regularly attract sponsorship from defense contractors, semiconductor firms, and research institutions.
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Get Access To All JobsINTRODUCTION
Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.
DESCRIPTION
Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
Responsibilities
-
Design and model silicon photonic devices and optical interconnects, optimizing coupling, thermal, and signal integrity performance.
-
Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL.
-
Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements.
-
Collaborate with cross-functional teams (process, electrical, mechanical, reliability) to enable scalable, manufacturable designs.
-
Document results and present technical findings through reports, reviews, or relevant forum presentations contributing to next-generation optical I/O development.
MINIMUM QUALIFICATIONS
BS and 3+ years of relevant industry experience.
PREFERRED QUALIFICATIONS
-
M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.
-
Excellent teamwork and communication skills.
-
Strong theoretical background in optics and photonics fundamentals, device/module integration.
-
Hands-on experience in packaging and measuring fiber-coupled devices.
-
Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool.
-
Min. 5 years works experiences in the related field with M.S and or Ph.D.
-
Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, ...).
-
Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus.
PAY & BENEFITS
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $150,400 and $277,600, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.
APPLICATION DEADLINE
Apple accepts applications to this posting on an ongoing basis.
INTRODUCTION
Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.
DESCRIPTION
Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
Responsibilities
-
Design and model silicon photonic devices and optical interconnects, optimizing coupling, thermal, and signal integrity performance.
-
Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL.
-
Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements.
-
Collaborate with cross-functional teams (process, electrical, mechanical, reliability) to enable scalable, manufacturable designs.
-
Document results and present technical findings through reports, reviews, or relevant forum presentations contributing to next-generation optical I/O development.
MINIMUM QUALIFICATIONS
BS and 3+ years of relevant industry experience.
PREFERRED QUALIFICATIONS
-
M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.
-
Excellent teamwork and communication skills.
-
Strong theoretical background in optics and photonics fundamentals, device/module integration.
-
Hands-on experience in packaging and measuring fiber-coupled devices.
-
Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool.
-
Min. 5 years works experiences in the related field with M.S and or Ph.D.
-
Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, ...).
-
Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus.
PAY & BENEFITS
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $150,400 and $277,600, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.
APPLICATION DEADLINE
Apple accepts applications to this posting on an ongoing basis.
See all 39+ Green Card Photonics Engineer Jobs
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Get Access To All JobsTips for Finding Green Card Sponsorship as a Photonics Engineer
Document your specialized photonics credentials early
Gather degree transcripts, published research, patent filings, and conference presentations before applying. PERM requires the employer to define minimum qualifications, and your documented credentials must align precisely with the job requirements listed in the labor certification.
Target employers with ITAR-cleared photonics divisions
Defense and aerospace firms working on directed-energy or imaging systems routinely sponsor EB-2 and EB-3 petitions because domestic talent pipelines are thin. These employers are accustomed to PERM timelines and often have in-house immigration counsel ready to file.
Search EB-2 and EB-3 sponsoring roles on Migrate Mate
Filter by photonics or optical engineering to find employers who have active green card sponsorship history. Migrate Mate surfaces roles tied to PERM-eligible positions so you can prioritize companies already familiar with the filing process.
Verify the prevailing wage tier before negotiating your offer
Use the OFLC Wage Search to look up the prevailing wage for your SOC code and the employer's metro area before accepting any offer. Your offered salary must meet or exceed the certified wage level, and a mismatch delays or invalidates the PERM filing.
Confirm the employer will cover PERM recruitment costs
DOL rules prohibit employers from passing PERM filing and attorney fees to you. Confirm this in writing before signing an offer. Some smaller photonics startups are unaware of this restriction, and a verbal assurance is not enforceable once the process begins.
Start your priority date clock as soon as possible
If your birth country has EB-2 or EB-3 backlog, your priority date is set when DOL certifies the PERM application. Filing a concurrent I-485 is only possible once that date becomes current, so starting PERM early compresses total wait time significantly.
Green Card Photonics Engineer: Frequently Asked Questions
Does a Photonics Engineer role qualify for EB-2 or EB-3 sponsorship?
Most photonics engineering positions qualify for EB-2 because they require a master's degree or a bachelor's degree plus substantial specialized experience in fields like laser physics, optical fiber systems, or photonic integrated circuits. Roles with a standard bachelor's requirement can qualify under EB-3. The employer's job description determines which category applies, so the minimum education and experience requirements written into the PERM application are critical.
How does PERM green card sponsorship differ from H-1B for this role?
H-1B visa is a temporary work visa subject to an annual lottery cap, while PERM-based green card sponsorship leads to permanent residency with no cap at the EB-3 level for most nationalities. The PERM process requires DOL labor market testing and takes longer than an H-1B petition, often 18 to 36 months from PERM filing to an approved I-485, but it permanently resolves your work authorization rather than requiring renewals every three years.
Which employers typically sponsor green cards for Photonics Engineers?
Defense contractors, national laboratories, semiconductor equipment manufacturers, and telecom infrastructure companies are the most consistent sponsors because photonics talent is genuinely scarce domestically. Firms working on LiDAR, quantum photonics, and advanced imaging systems frequently run PERM processes. O*NET classifies this occupation in Job Zone 4 and 5, reflecting the advanced degree and specialized knowledge that makes domestic recruitment difficult and PERM labor market tests passable.
How can I find Photonics Engineer jobs that offer green card sponsorship?
Migrate Mate is built specifically for this search. You can filter by EB-2 or EB-3 sponsorship history and identify employers with a track record of completing PERM filings for engineering roles. This is faster than sorting through general job boards where sponsorship intent is buried in the application process or not disclosed at all.
Can my employer file PERM while I'm on H-1B status?
Yes, and this is the standard path. USCIS allows concurrent H-1B extensions beyond the normal six-year cap limit once your I-140 is approved and your priority date is more than 365 days away from becoming current. Starting PERM while on H-1B status protects your ability to stay in the country under valid status while the green card process runs its full course.