Mechanical Engineer Jobs at HP with Visa Sponsorship

INTRODUCTION

At HP, we exist to amaze—through the people we hire, the experiences we enable, the way we treat our customers and each other and ultimately through the technology we create. We invent, develop, and bring to market new technologies and capabilities as well as integrate these technologies into systems. Our focus is on microfluidics technologies based on HP’s long history in print, pursuing broader alternative technologies and research with an eye toward consumer and industrial applications. We provide advanced innovative solutions to our partners and customers, both internal and external.

The EMAG (Engineering Modeling and Analysis Group) Expert Structural Modeling Engineer will work as an integral part of our team. You will work with partners to develop and run simulations that uncover fundamental learnings, expedite and inform design cycles, and create insights, leading the organization in a simulation-led design approach. EMAG is responsible for the development and deployment of predictive and diagnostic computational modeling methods in new technology and product development.

Responsibilities:

You will be responsible for running computational models and writing scripts to simplify processes and improve efficiency. You will work with our group of Fluidic, Thermal and Structural modelers to collaborate with internal development teams to drive design decisions and process development.

BASIC QUALIFICATIONS:

• MS/PHD in Mechanical Engineering, Mathematics, Physics, or related fields
• 10+ years of demonstrated Finite Element Analysis experience using ABAQUS or equivalent tools, with relevant experience including one or more of:
• Advanced material properties (Hyperelastic, orthotropic, phase change, etc.)
• Solver selection (Explicit, implicit, etc.)
• Electronic packaging and submodeling
• MEMS (micro-electro-mechanical systems)
• CTE driven component deformation
• 5+ years of demonstrated HyperMesh experience
• 5+ years of experience with programming/scripting languages (Python, FORTRAN, C++, etc.) to build custom analysis tools and procedures
• Ability to lead a cross-functional team with a simulation-first mindset
• Demonstrated experience using experimental and FEA best practices to validate simulation results to improve trust in models
• Ability to work effectively on a globally distributed team
• Strong project management skills
• Strong analytical and problem-solving skills
• Eager, quick learner with strong spirit of team-work
• Excellent oral and written English communication skills

PREFERRED QUALIFICATIONS:

• Knowledge of materials engineering and experience in material characterization for FEA
• Experience solving in frequency and time domains
• Experience with optimizing simulation setup for high performance computing clusters
• Knowledge of optimization tools and techniques including topology optimization
• Experience with data manipulation
• Leadership and mentoring experience

The pay range for this role is $116,150.00 to $182,400.00 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

BENEFITS:

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including:
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

JOB:

Engineering

SCHEDULE:

Full time

SHIFT:

No shift premium (United States of America)

TRAVEL:

Not Specified

RELOCATION:

Yes

Equal Opportunity Employer (EEO)

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.