Development Manager Jobs in Irvine, CA
Development Manager jobs in Irvine are concentrated in the Irvine Spectrum, University Research Park, and the Irvine Business Complex, across technology, real estate development, life sciences, and financial services. Employers hiring right now include Parker Hannifin, GFT, and Fuzion3. Find a role that fits below and apply directly.
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Showing 5 of 461+ Development Manager jobs
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 78361
Description
We are seeking an experienced and highly motivated Senior Manager, Package Process Development to lead the development and industrialization of advanced RF System-in-Package (SiP) technologies. This role will be responsible for driving package process innovation, leading New Technology Introduction (NTI) activities, and establishing robust manufacturing processes that enable high-volume production of next-generation RF modules and SiP products.The ideal candidate possesses deep expertise in RF SiP packaging technologies, assembly processes, process characterization, reliability requirements, and manufacturing scale-up. This individual will collaborate closely with product design, package design, technology development, suppliers, and manufacturing teams to accelerate technology readiness and product commercialization.
Key Responsibilities
Technology Development & NTI
- Lead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.
- Develop process roadmaps and technology strategies to support future RF module and SiP product requirements.
- Evaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.
- Drive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Reliability (DFR) initiatives during product development.
- Partner with cross-functional teams to ensure seamless transition from technology development into production.
Package Process Development
- Own development and optimization of RF SiP assembly processes, including:
- Die Attach
- Flip Chip Assembly
- Wire Bonding
- Wafer-Level Packaging Integration
- Underfill
- Encapsulation/Molding
- Shielding Processes
- SMT and Board-Level Assembly
- Define process windows, critical process parameters, and control methodologies.
- Lead DOE (Design of Experiments), process characterization, root cause analysis, and yield improvement initiatives.
- Establish process specifications, qualification plans, and manufacturing standards.
Manufacturing Readiness & Production Transfer
- Drive process development activities from concept through production release.
- Lead pilot builds, engineering builds, process qualification, and production ramp readiness assessments.
- Develop process control plans and monitoring strategies to ensure consistent manufacturing performance.
- Work closely with OSATs, subcontractors, equipment vendors, and manufacturing partners to implement scalable production solutions.
- Support factory transfer and production ramp-up activities.
Reliability & Quality
- Partner with reliability and quality engineering teams to ensure package/process robustness.
- Define package qualification requirements and reliability stress test plans.
- Lead failure analysis investigations and corrective action implementation.
- Ensure compliance with customer, industry, and regulatory reliability requirements.
Leadership & Team Development
- Build and lead a high-performing package process development team.
- Provide technical mentorship and career development for engineers.
- Foster a culture of innovation, accountability, and continuous improvement.
- Coordinate activities across global engineering, manufacturing, and supplier organizations.
Required Qualifications
- MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
- 12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.
- Strong hands-on experience in RF SiP package development and assembly process engineering .
- Proven track record of successfully launching new package technologies into mass production.
- Deep understanding of semiconductor package assembly processes and equipment.
- Experience with NTI programs and technology transfer to manufacturing.
- Strong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.
- Experience working with OSATs and external manufacturing partners.
- Excellent problem-solving, communication, and cross-functional leadership skills.
Desired Experience and Skills
- Extensive experience with RF front-end modules, wireless communication products, or advanced SiP technologies.
- Knowledge of RF performance impacts associated with package structures and assembly processes.
- Experience with advanced packaging technologies such as:
- Fan-Out Packaging
- Wafer-Level Packaging (WLP)
- Panel-Level Packaging (PLP)
- Heterogeneous Integration
- Multi-Chip Modules (MCM)
- Embedded Component Technologies
- S trong understanding of package reliability physics and failure mechanisms.
- Experience supporting automotive, mobile, Wi-Fi, Bluetooth, GNSS, or cellular RF products.
#LI-JR1
The typical base pay range for this role across the U.S. is currently USD $143,000 - $286,400 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 78361
Description
We are seeking an experienced and highly motivated Senior Manager, Package Process Development to lead the development and industrialization of advanced RF System-in-Package (SiP) technologies. This role will be responsible for driving package process innovation, leading New Technology Introduction (NTI) activities, and establishing robust manufacturing processes that enable high-volume production of next-generation RF modules and SiP products.The ideal candidate possesses deep expertise in RF SiP packaging technologies, assembly processes, process characterization, reliability requirements, and manufacturing scale-up. This individual will collaborate closely with product design, package design, technology development, suppliers, and manufacturing teams to accelerate technology readiness and product commercialization.
Key Responsibilities
Technology Development & NTI
- Lead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.
- Develop process roadmaps and technology strategies to support future RF module and SiP product requirements.
- Evaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.
- Drive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Reliability (DFR) initiatives during product development.
- Partner with cross-functional teams to ensure seamless transition from technology development into production.
Package Process Development
- Own development and optimization of RF SiP assembly processes, including:
- Die Attach
- Flip Chip Assembly
- Wire Bonding
- Wafer-Level Packaging Integration
- Underfill
- Encapsulation/Molding
- Shielding Processes
- SMT and Board-Level Assembly
- Define process windows, critical process parameters, and control methodologies.
- Lead DOE (Design of Experiments), process characterization, root cause analysis, and yield improvement initiatives.
- Establish process specifications, qualification plans, and manufacturing standards.
Manufacturing Readiness & Production Transfer
- Drive process development activities from concept through production release.
- Lead pilot builds, engineering builds, process qualification, and production ramp readiness assessments.
- Develop process control plans and monitoring strategies to ensure consistent manufacturing performance.
- Work closely with OSATs, subcontractors, equipment vendors, and manufacturing partners to implement scalable production solutions.
- Support factory transfer and production ramp-up activities.
Reliability & Quality
- Partner with reliability and quality engineering teams to ensure package/process robustness.
- Define package qualification requirements and reliability stress test plans.
- Lead failure analysis investigations and corrective action implementation.
- Ensure compliance with customer, industry, and regulatory reliability requirements.
Leadership & Team Development
- Build and lead a high-performing package process development team.
- Provide technical mentorship and career development for engineers.
- Foster a culture of innovation, accountability, and continuous improvement.
- Coordinate activities across global engineering, manufacturing, and supplier organizations.
Required Qualifications
- MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
- 12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.
- Strong hands-on experience in RF SiP package development and assembly process engineering .
- Proven track record of successfully launching new package technologies into mass production.
- Deep understanding of semiconductor package assembly processes and equipment.
- Experience with NTI programs and technology transfer to manufacturing.
- Strong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.
- Experience working with OSATs and external manufacturing partners.
- Excellent problem-solving, communication, and cross-functional leadership skills.
Desired Experience and Skills
- Extensive experience with RF front-end modules, wireless communication products, or advanced SiP technologies.
- Knowledge of RF performance impacts associated with package structures and assembly processes.
- Experience with advanced packaging technologies such as:
- Fan-Out Packaging
- Wafer-Level Packaging (WLP)
- Panel-Level Packaging (PLP)
- Heterogeneous Integration
- Multi-Chip Modules (MCM)
- Embedded Component Technologies
- S trong understanding of package reliability physics and failure mechanisms.
- Experience supporting automotive, mobile, Wi-Fi, Bluetooth, GNSS, or cellular RF products.
#LI-JR1
The typical base pay range for this role across the U.S. is currently USD $143,000 - $286,400 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
See All 461+ Development Manager Jobs in Irvine
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Find Development Manager JobsDevelopment Manager Job Market in Irvine
Who's Hiring
- Parker Hannifin66
- GFT22
- Fuzion322F
- ICEYE US22
- AmCan22
Development Manager Jobs in Irvine: Frequently Asked Questions
How do I get a development manager job in Irvine?
The strongest entry point is targeting Irvine's technology corridor around the Spectrum and its real estate and life sciences employers in University Research Park. Companies here tend to prioritize candidates with demonstrated project ownership and cross-functional leadership, not just titles. Tailoring your application to show results in product delivery, team growth, or revenue impact gives you a clear edge over generalist resumes in this market.
Which companies hire development managers in Irvine?
Companies currently hiring development managers in Irvine include Parker Hannifin, GFT, and Fuzion3, per current listings on Migrate Mate as of September 2026. Irvine's employer base skews toward mid-size technology firms, national real estate developers, and regional financial services companies, all of which run active development teams year-round.
Are there remote development manager jobs in Irvine?
Yes, though availability depends on the type of role. About 44% of development manager openings tied to Irvine are remote or hybrid as of September 2026, with the highest remote share in software and product-focused roles. Development managers in real estate, construction, or on-site operations typically require an in-person presence at Irvine offices or project sites.
How can I get a development manager job in Irvine with little or no experience?
The most realistic path is moving into a junior or associate development role at one of Irvine's mid-size technology or real estate firms, which often promote internally rather than hiring externally for senior positions. Roles like project coordinator, associate product manager, or business analyst at Irvine Spectrum employers serve as common stepping stones. Demonstrating measurable ownership of even a single initiative, whether through a portfolio, internship, or contract work, carries real weight with local hiring managers.
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