STEM OPT Ic Design Engineer Jobs
IC design engineer roles sit squarely within STEM OPT eligibility, letting you extend your F-1 work authorization by 24 months beyond your initial OPT year. Your employer must be enrolled in E-Verify, and your electrical engineering, computer engineering, or related STEM degree must align with the SOC code tied to IC design work.
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Get Access To All JobsDo you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this role, you will contribute to package concept exploration, support package selection and configuration studies, and grow into ownership of package integration across SoC and advanced packaging projects.
Description
Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.
Responsibilities
- Support packaging technology development, including advanced 2.5D / 3D packaging
- Contribute to multi-functional SoC package integration efforts - design, test, characterization, reliability, and product teams.
- Participate in package architecture trade-off studies and prototype evaluations.
- Collaborate with foundry and OSAT partners on build execution, DOEs, and data analysis.
- Own well-scoped technical deliverables (characterization, modeling, failure analysis, product development) end-to-end
- 5% International travel
Minimum Qualifications
Minimum requirement of a bachelor's degree
Preferred Qualifications
- MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
- Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab.
- Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards.
- Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level
- General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
- Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
- Ability to work independently and orchestrate projects with cross functional teams
- Solution-oriented mindset with strong fundamentals in engineering physics
- Good program management skills.
Pay & Benefits
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $129,300 and $225,300, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this role, you will contribute to package concept exploration, support package selection and configuration studies, and grow into ownership of package integration across SoC and advanced packaging projects.
Description
Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.
Responsibilities
- Support packaging technology development, including advanced 2.5D / 3D packaging
- Contribute to multi-functional SoC package integration efforts - design, test, characterization, reliability, and product teams.
- Participate in package architecture trade-off studies and prototype evaluations.
- Collaborate with foundry and OSAT partners on build execution, DOEs, and data analysis.
- Own well-scoped technical deliverables (characterization, modeling, failure analysis, product development) end-to-end
- 5% International travel
Minimum Qualifications
Minimum requirement of a bachelor's degree
Preferred Qualifications
- MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
- Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab.
- Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards.
- Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level
- General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
- Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
- Ability to work independently and orchestrate projects with cross functional teams
- Solution-oriented mindset with strong fundamentals in engineering physics
- Good program management skills.
Pay & Benefits
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $129,300 and $225,300, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
See all STEM OPT Ic Design Engineer Jobs
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Get Access To All JobsTips for Finding STEM OPT Authorization as an Ic Design Engineer
Verify your CIP code covers IC design
Cross-reference your degree's CIP code against the STEM-designated degree list that USCIS and ICE publish. Electrical engineering (14.1001) and computer engineering (14.0901) both qualify, but computer science degrees may need closer review depending on your university's listed CIP code.
Confirm E-Verify enrollment before applying
Ask your recruiter directly whether the hiring entity, not just the parent company, is enrolled in E-Verify. Subsidiaries and acquired startups often operate under separate EINs, and E-Verify enrollment doesn't automatically transfer, so verify the specific legal entity that will employ you.
Build a training plan around your IC design workflow
Your I-983 training plan must connect your STEM degree learning objectives to your actual job tasks. For IC design, map coursework in circuit theory, VLSI, or semiconductor physics directly to the design tools, tapeout processes, and verification methodologies your employer will assign you.
Target fabless companies and EDA tool vendors
Fabless semiconductor firms and EDA software companies consistently hire on STEM OPT and have structured onboarding for the I-983 reporting cycle. Their HR teams are familiar with the 6-month and 12-month evaluation checkpoints USCIS requires under the STEM extension.
Search for IC design roles on Migrate Mate
Migrate Mate filters IC design engineer listings by E-Verify-enrolled employers, so you're not manually vetting each company's enrollment status. Use it to surface roles where the employer infrastructure already supports STEM OPT onboarding.
Time your H-1B registration around your OPT end date
If your STEM OPT expires before October 1 of the fiscal year you're selected in the H-1B lottery, the cap-gap rule extends your authorization automatically. File your H-1B visa petition with your employer before your STEM OPT end date to preserve that bridge and avoid a status gap.
Frequently Asked Questions
Does an IC design engineer role qualify for the STEM OPT extension?
Yes, IC design engineer positions qualify when your degree is in an eligible STEM field such as electrical engineering, computer engineering, or a related discipline with a qualifying CIP code. The role must be directly related to your degree, and your employer must confirm the connection in your I-983 training plan. USCIS reviews the degree-to-job alignment when you file for the 24-month extension.
How do I find IC design engineer employers enrolled in E-Verify?
You can browse IC design engineer listings on Migrate Mate, which filters for E-Verify-enrolled employers so you don't have to research each company manually. When you receive an offer, confirm that the specific legal entity signing your employment agreement, not just the corporate parent, is the enrolled entity in E-Verify, since subsidiaries can operate under separate employer identification numbers.
What goes into the I-983 training plan for an IC design engineer role?
Your I-983 must document how the IC design work you'll perform connects to the STEM learning objectives from your degree. List specific tasks like RTL design, simulation, physical layout, or verification, and tie each to coursework in areas such as VLSI design, digital logic, or semiconductor devices. Both you and your employer's designated supervisor sign the plan, and you'll submit updated evaluations at six and twelve months.
Does my computer science degree qualify me for STEM OPT in an IC design engineer role?
It depends on your university's assigned CIP code for your specific computer science program and whether the IC design role is considered directly related to that degree. Some computer science programs carry CIP codes on the STEM-designated list while others do not. Cross-check your degree's CIP code against the official STEM list and review the job description to assess whether your coursework in hardware, computer architecture, or logic design supports the connection.
What happens to my STEM OPT if my IC design employer loses E-Verify enrollment?
If your employer loses E-Verify enrollment or withdraws, your STEM OPT authorization is no longer valid with that employer, and you must stop working. You have a 60-day grace period from the end of your authorized employment to find a new E-Verify-enrolled employer or take other action to maintain lawful status. Notify your DSO immediately and consult USCIS guidance on the steps required to transfer your STEM OPT to a qualifying new employer.