Technical Solutions Engineer Visa Sponsorship Jobs in Oregon
Technical solutions engineer roles in Oregon are concentrated in Portland's thriving tech corridor, where companies like Intel, Daimler Truck North America, and Salesforce actively hire. Oregon's semiconductor and cloud infrastructure sectors drive consistent demand for this role, and several employers in the state have an established track record of H-1B visa sponsorship for technical solutions engineers.
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Job Description:
About Intel Foundry
Intel Foundry is revolutionizing the semiconductor industry as a leading systems foundry, delivering breakthrough silicon process and packaging technologies for the AI era. We combine industry-leading technology, extensive IP portfolio, world-class design ecosystem, and a resilient global manufacturing supply chain to drive scalability and innovation.
As pioneers of Moore's Law, we continuously innovate and collaborate with an extensive partner ecosystem to advance technologies that enable our customers to create industry-leading products. Our strategic investments in geographically diverse manufacturing capabilities strengthen semiconductor supply chain resilience, particularly for advanced products. Through our technological expertise, manufacturing scale, and sustainable supply chain approach, Intel Foundry enables the world's essential computing, server, mobile, networking, and automotive systems for the AI era.
The Opportunity
Join Intel Foundry Services as a Senior Technical Solutions Engineer - Advanced Packaging and become the cornerstone of customer success for our key Packaging and Test accounts. This critical role combines technical expertise with customer relationship management to drive adoption of Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.
Customer Relationship Leadership:
- Serve as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases
- Act as the Voice of the Customer within Intel Foundry, advocating for customer priorities and expectations across all internal functions
Technical Consultation & Problem-Solving:
- Partner directly with customers to understand packaging challenges and requirements
- Provide expert technical consultation on packaging solutions and processes
- Connect customers with Intel Foundry's technical experts for specialized insights
Cross-Functional Collaboration:
- Work with Technology Development, Product Engineering, Manufacturing, Operations, and Customer Engineering teams
- Influence product and technology roadmaps through customer feedback and market insights
- Coordinate internal Intel resources to ensure customer success
Program Management & Execution:
- Develop and maintain comprehensive Statements of Work (SOW) documenting requirements, commitments, deliverables, and milestones
- Manage complete customer engagement lifecycle from design award through high-volume manufacturing and end-of-life
- Track commitments, action items, and escalations while monitoring risks and dependencies
- Drive resolution of qualification and delivery issues
Communication & Reporting:
- Provide clear, regular status reports to customers and leadership
- Facilitate effective communication between technical and business stakeholders
Core Competencies:
- Strong communication skills
- Ability to navigate both technical and operational discussions effectively
- Strong problem-solving and analytical thinking capabilities
- Talent for explaining complex technical concepts clearly and concisely
Qualifications
The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and/or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:
- Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or in a related field
- 5+ years of experience in one or more of the following: Semiconductor Packaging, Assembly/Test, Backend Manufacturing, Operations, Product Engineering, Field Applications, or customer-facing engineering roles
- 8+ years of Semiconductor experience
Preferred Qualifications:
- Post graduate degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field
- Experience in Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, Power Delivery, and Thermal Management
- Experience with Advanced Package Manufacturing, Bumping, Assembly, and Test processes
- Experience with DOE, FMEA, yield analysis, and failure analysis methodologies
- Project management and customer-facing experience
- Flexibility for travel as needed
Ready to make your mark? Apply today and become integral to Intel's journey toward operational excellence.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, California, Folsom
US, California, Santa Clara
US, Oregon, Hillsboro
US, Texas, Austin
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $160,980.00-311,040.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Job Details:
Job Description:
About Intel Foundry
Intel Foundry is revolutionizing the semiconductor industry as a leading systems foundry, delivering breakthrough silicon process and packaging technologies for the AI era. We combine industry-leading technology, extensive IP portfolio, world-class design ecosystem, and a resilient global manufacturing supply chain to drive scalability and innovation.
As pioneers of Moore's Law, we continuously innovate and collaborate with an extensive partner ecosystem to advance technologies that enable our customers to create industry-leading products. Our strategic investments in geographically diverse manufacturing capabilities strengthen semiconductor supply chain resilience, particularly for advanced products. Through our technological expertise, manufacturing scale, and sustainable supply chain approach, Intel Foundry enables the world's essential computing, server, mobile, networking, and automotive systems for the AI era.
The Opportunity
Join Intel Foundry Services as a Senior Technical Solutions Engineer - Advanced Packaging and become the cornerstone of customer success for our key Packaging and Test accounts. This critical role combines technical expertise with customer relationship management to drive adoption of Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.
Customer Relationship Leadership:
- Serve as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases
- Act as the Voice of the Customer within Intel Foundry, advocating for customer priorities and expectations across all internal functions
Technical Consultation & Problem-Solving:
- Partner directly with customers to understand packaging challenges and requirements
- Provide expert technical consultation on packaging solutions and processes
- Connect customers with Intel Foundry's technical experts for specialized insights
Cross-Functional Collaboration:
- Work with Technology Development, Product Engineering, Manufacturing, Operations, and Customer Engineering teams
- Influence product and technology roadmaps through customer feedback and market insights
- Coordinate internal Intel resources to ensure customer success
Program Management & Execution:
- Develop and maintain comprehensive Statements of Work (SOW) documenting requirements, commitments, deliverables, and milestones
- Manage complete customer engagement lifecycle from design award through high-volume manufacturing and end-of-life
- Track commitments, action items, and escalations while monitoring risks and dependencies
- Drive resolution of qualification and delivery issues
Communication & Reporting:
- Provide clear, regular status reports to customers and leadership
- Facilitate effective communication between technical and business stakeholders
Core Competencies:
- Strong communication skills
- Ability to navigate both technical and operational discussions effectively
- Strong problem-solving and analytical thinking capabilities
- Talent for explaining complex technical concepts clearly and concisely
Qualifications
The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and/or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:
- Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or in a related field
- 5+ years of experience in one or more of the following: Semiconductor Packaging, Assembly/Test, Backend Manufacturing, Operations, Product Engineering, Field Applications, or customer-facing engineering roles
- 8+ years of Semiconductor experience
Preferred Qualifications:
- Post graduate degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field
- Experience in Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, Power Delivery, and Thermal Management
- Experience with Advanced Package Manufacturing, Bumping, Assembly, and Test processes
- Experience with DOE, FMEA, yield analysis, and failure analysis methodologies
- Project management and customer-facing experience
- Flexibility for travel as needed
Ready to make your mark? Apply today and become integral to Intel's journey toward operational excellence.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, California, Folsom
US, California, Santa Clara
US, Oregon, Hillsboro
US, Texas, Austin
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $160,980.00-311,040.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Technical Solutions Engineer Job Roles in Oregon
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Search Technical Solutions Engineer Jobs in OregonTechnical Solutions Engineer Jobs in Oregon: Frequently Asked Questions
Which companies in Oregon sponsor visas for technical solutions engineers?
Intel is one of Oregon's largest H-1B visa sponsors and regularly hires technical solutions engineers at its Hillsboro campuses. Other notable sponsors include Nike's global technology division in Beaverton, Salesforce's Portland office, and Daimler Truck North America. Smaller Portland-based SaaS companies also sponsor, though less consistently than established enterprise employers in the region.
Which visa types are most common for technical solutions engineer roles in Oregon?
The H-1B is the most common visa category for technical solutions engineers in Oregon, as the role typically qualifies as a specialty occupation requiring a bachelor's degree in computer science, engineering, or a related field. Candidates already holding TN visa status (Canadians and Mexicans), O-1 visas, or L-1 visa transfers from multinational employers like Intel are also well-represented in this role.
Which cities in Oregon have the most technical solutions engineer sponsorship jobs?
Portland and the surrounding metro area, including Beaverton and Hillsboro, account for the large majority of technical solutions engineer sponsorship jobs in Oregon. Hillsboro is particularly notable due to Intel's large semiconductor manufacturing and R&D presence. Eugene sees some hiring from University of Oregon-affiliated tech ventures, but Portland-metro remains the primary concentration by a wide margin.
How to find technical solutions engineer visa sponsorship jobs in Oregon?
Migrate Mate filters job listings specifically by visa sponsorship availability, so you can search for technical solutions engineer roles in Oregon without sorting through employers who won't sponsor. The platform is built for international candidates, making it more targeted than general job searches. Filtering by Oregon on Migrate Mate surfaces roles from both large enterprise sponsors like Intel and smaller Portland-area SaaS employers.
Are there any Oregon-specific considerations for technical solutions engineers seeking visa sponsorship?
Oregon's tech sector is anchored by semiconductor manufacturing, which means many technical solutions engineer roles intersect with hardware, chip design, or embedded systems, not just software. Intel's presence in Hillsboro has historically created a pipeline from Oregon State University and Portland State University into sponsored engineering roles. Prevailing wage requirements apply statewide, and the Portland-metro area falls under its own DOL wage determination zone, which employers must meet when filing Labor Condition Applications.
What is the prevailing wage for sponsored technical solutions engineer jobs in Oregon?
U.S. employers sponsoring a visa must pay at least the prevailing wage, which is what workers in the same role, area, and experience level typically earn. The Department of Labor sets this rate to make sure companies aren't hiring foreign workers simply because they'd accept lower pay than a U.S. worker. It varies by job title, location, and experience. You can look up current prevailing wage rates for any occupation and location using the OFLC Wage Search page.