Design Director Jobs
Design Director jobs are open across tech, consumer brands, agencies, and media, from mid-level creative lead to VP-adjacent, with specializations in brand, product, and UX design. Find a role that fits from the openings below and apply directly.
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The Sr. Director, Technical Program Management will lead a global technical program management organization responsible for driving execution of strategic AI/Datacenter Infrastructure Power package engineering and new product introduction (NPI) programs. This leader will partner closely with Package Engineering Directors, Power product group partners—especially Design, Application, and Marketing teams—Product, Reliability, Quality, Operations, Supply Chain, and key OSAT/CM partners to ensure programs meet committed schedules, quality and reliability objectives, and production readiness requirements. The role will establish strong program governance, identify and escalate critical risks early, and lead cross-functional technical task forces to resolve development challenges that threaten quality, reliability, yield, manufacturability, or schedule.
The organization will also provide technical program management leadership at key OSATs, ensuring consistent execution, issue escalation, and alignment between Renesas development teams and external assembly partners.
KEY RESPONSIBILITIES
Lead the global Technical Program Management (TPM) organization supporting AI/Datacenter Infrastructure Power NPI and package engineering programs.
Partner with Package Engineering Directors who lead technical package development programs, providing program-level execution leadership, governance, and accountability.
Establish and drive end-to-end NPI program plans, milestones, critical paths, resource alignment, risk management, and executive reporting to ensure committed schedules are achieved.
Create a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing.
Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks; establish mitigation plans and escalate critical issues with clear recommendations and decision points.
Lead cross-functional technical task forces for major development challenges, particularly issues affecting quality, reliability, yield, manufacturability, qualification, or NPI schedule.
Drive structured problem solving and closure of critical issues using data-driven methods, root-cause analysis, risk assessment, and clearly defined corrective/preventive actions.
Coordinate closely with Package Engineering, Power product group partners—especially Design, Application, and Marketing teams—Product Engineering, Reliability, Quality, Operations, Supply Chain, and other functional leaders to remove execution barriers and maintain program momentum.
Establish program dashboards and management systems that provide transparent visibility to milestones, critical path activities, risks, issues, action owners, and recovery plans.
Lead technical program management activities with key OSAT/CM partners, including program reviews, milestone tracking, issue escalation, recovery plans, qualification readiness, and production ramp execution.
Ensure execution of Engineering Build Requests (EBRs) per committed schedule at each OSAT, regularly tracking overall EBR progress, identifying delays, and driving timely recovery actions.
Develop and lead TPM teams located at strategic OSATs, ensuring alignment with Renesas priorities, technical teams, and global NPI schedules.
Ensure OSAT/CM development activities, DOE, process optimization, qualification, process-window verification, production controls, and ramp readiness are aligned with overall NPI program objectives.
Drive timely resolution of process integration and assembly issues that could impact product quality, reliability, qualification, yield, or customer commitments.
Ensure effective transition from development and qualification into production, including readiness reviews, ramp monitoring, issue management, and sustained execution.
Establish standardized program management processes, templates, metrics, escalation mechanisms, and lessons-learned practices across the global organization.
Provide concise, fact-based executive communication on program health, critical risks, schedule recovery, resource needs, and decisions required from senior leadership.
Build strong relationships with OSAT/CM executive and technical leadership to improve responsiveness, accountability, and execution of critical AI/Datacenter Power programs.
Develop the technical and leadership capabilities of the TPM organization and establish a high-performance, execution-focused culture.
Support package technology roadmap execution by translating strategic technology priorities into executable development programs, milestones, resources, and deliverables.
Address internal and external customer-impacting issues in partnership with Marketing, Product, Quality, Operations, and Package Engineering organizations.
LEADERSHIP & ORGANIZATIONAL RESPONSIBILITIES
Lead and develop a global team of Technical Program Managers supporting strategic AI/Datacenter Infrastructure Power programs.
Set organizational priorities, staffing strategy, performance expectations, and development plans aligned with business growth.
Establish clear accountability between Technical Program Managers and Package Engineering technical leaders while avoiding duplication of technical ownership.
Create a culture of urgency, fact-based decision making, cross-functional collaboration, ownership, and rapid issue resolution.
Drive consistent execution standards across internal teams and strategic OSAT locations.
Qualifications
QUALIFICATIONS
Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline.
15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field.
Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
Strong understanding of semiconductor product development process, package and assembly processes.
Experience in Power Management products, particularly power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management system, PMICs, wafer-level and/or flip-chip technologies.
Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.
Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule.
Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.
Exceptional program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.
Strong interpersonal, communication, negotiation, and executive presentation skills.
Ability to influence senior technical and business leaders without direct authority and drive accountability across organizational boundaries.
Experience building and leading global teams, including teams in product groups, embedded at external manufacturing or OSAT locations.
Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions.
PREFERRED QUALIFICATIONS
Experience supporting high-growth customer programs.
Experience with Smart Power Stage, Vertical Power Stage, power module, discrete FET, SiC/GaN, DBC/AMB, multi-chip, wafer-level, or advanced interconnect technologies.
Experience with formal technical program management methodologies and portfolio-level governance.
Experience driving customer-critical NPI programs in a fast-paced, high-growth environment.
SUCCESS MEASURES
On-time achievement of NPI milestones and customer commitments.
Reduction in schedule delays caused by unresolved technical, quality, reliability, or manufacturing issues.
Timely closure of critical cross-functional task-force actions.
Improved qualification, yield, reliability, and production-readiness performance.
Effective execution and alignment of strategic OSAT/CM partners.
Development of a high-performing global TPM organization and standardized program-management operating model.
Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
The Sr. Director, Technical Program Management will lead a global technical program management organization responsible for driving execution of strategic AI/Datacenter Infrastructure Power package engineering and new product introduction (NPI) programs. This leader will partner closely with Package Engineering Directors, Power product group partners—especially Design, Application, and Marketing teams—Product, Reliability, Quality, Operations, Supply Chain, and key OSAT/CM partners to ensure programs meet committed schedules, quality and reliability objectives, and production readiness requirements. The role will establish strong program governance, identify and escalate critical risks early, and lead cross-functional technical task forces to resolve development challenges that threaten quality, reliability, yield, manufacturability, or schedule.
The organization will also provide technical program management leadership at key OSATs, ensuring consistent execution, issue escalation, and alignment between Renesas development teams and external assembly partners.
KEY RESPONSIBILITIES
Lead the global Technical Program Management (TPM) organization supporting AI/Datacenter Infrastructure Power NPI and package engineering programs.
Partner with Package Engineering Directors who lead technical package development programs, providing program-level execution leadership, governance, and accountability.
Establish and drive end-to-end NPI program plans, milestones, critical paths, resource alignment, risk management, and executive reporting to ensure committed schedules are achieved.
Create a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing.
Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks; establish mitigation plans and escalate critical issues with clear recommendations and decision points.
Lead cross-functional technical task forces for major development challenges, particularly issues affecting quality, reliability, yield, manufacturability, qualification, or NPI schedule.
Drive structured problem solving and closure of critical issues using data-driven methods, root-cause analysis, risk assessment, and clearly defined corrective/preventive actions.
Coordinate closely with Package Engineering, Power product group partners—especially Design, Application, and Marketing teams—Product Engineering, Reliability, Quality, Operations, Supply Chain, and other functional leaders to remove execution barriers and maintain program momentum.
Establish program dashboards and management systems that provide transparent visibility to milestones, critical path activities, risks, issues, action owners, and recovery plans.
Lead technical program management activities with key OSAT/CM partners, including program reviews, milestone tracking, issue escalation, recovery plans, qualification readiness, and production ramp execution.
Ensure execution of Engineering Build Requests (EBRs) per committed schedule at each OSAT, regularly tracking overall EBR progress, identifying delays, and driving timely recovery actions.
Develop and lead TPM teams located at strategic OSATs, ensuring alignment with Renesas priorities, technical teams, and global NPI schedules.
Ensure OSAT/CM development activities, DOE, process optimization, qualification, process-window verification, production controls, and ramp readiness are aligned with overall NPI program objectives.
Drive timely resolution of process integration and assembly issues that could impact product quality, reliability, qualification, yield, or customer commitments.
Ensure effective transition from development and qualification into production, including readiness reviews, ramp monitoring, issue management, and sustained execution.
Establish standardized program management processes, templates, metrics, escalation mechanisms, and lessons-learned practices across the global organization.
Provide concise, fact-based executive communication on program health, critical risks, schedule recovery, resource needs, and decisions required from senior leadership.
Build strong relationships with OSAT/CM executive and technical leadership to improve responsiveness, accountability, and execution of critical AI/Datacenter Power programs.
Develop the technical and leadership capabilities of the TPM organization and establish a high-performance, execution-focused culture.
Support package technology roadmap execution by translating strategic technology priorities into executable development programs, milestones, resources, and deliverables.
Address internal and external customer-impacting issues in partnership with Marketing, Product, Quality, Operations, and Package Engineering organizations.
LEADERSHIP & ORGANIZATIONAL RESPONSIBILITIES
Lead and develop a global team of Technical Program Managers supporting strategic AI/Datacenter Infrastructure Power programs.
Set organizational priorities, staffing strategy, performance expectations, and development plans aligned with business growth.
Establish clear accountability between Technical Program Managers and Package Engineering technical leaders while avoiding duplication of technical ownership.
Create a culture of urgency, fact-based decision making, cross-functional collaboration, ownership, and rapid issue resolution.
Drive consistent execution standards across internal teams and strategic OSAT locations.
Qualifications
QUALIFICATIONS
Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline.
15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field.
Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
Strong understanding of semiconductor product development process, package and assembly processes.
Experience in Power Management products, particularly power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management system, PMICs, wafer-level and/or flip-chip technologies.
Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.
Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule.
Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.
Exceptional program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.
Strong interpersonal, communication, negotiation, and executive presentation skills.
Ability to influence senior technical and business leaders without direct authority and drive accountability across organizational boundaries.
Experience building and leading global teams, including teams in product groups, embedded at external manufacturing or OSAT locations.
Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions.
PREFERRED QUALIFICATIONS
Experience supporting high-growth customer programs.
Experience with Smart Power Stage, Vertical Power Stage, power module, discrete FET, SiC/GaN, DBC/AMB, multi-chip, wafer-level, or advanced interconnect technologies.
Experience with formal technical program management methodologies and portfolio-level governance.
Experience driving customer-critical NPI programs in a fast-paced, high-growth environment.
SUCCESS MEASURES
On-time achievement of NPI milestones and customer commitments.
Reduction in schedule delays caused by unresolved technical, quality, reliability, or manufacturing issues.
Timely closure of critical cross-functional task-force actions.
Improved qualification, yield, reliability, and production-readiness performance.
Effective execution and alignment of strategic OSAT/CM partners.
Development of a high-performing global TPM organization and standardized program-management operating model.
Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Design Director Jobs by Experience Level
Top Cities Hiring Design Directors
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Find Design Director JobsDesign Director Job Market
Who's Hiring
- Capital One12
- Information Technology Senior Management Forum11
- Meta5
- Apple5
- Renesas5
Top Industries Hiring
- Technology & Software19
- Consulting & Professional Services15
- Retail7
- Electronics & Hardware7
- Construction & Real Estate7
What Employers Look For
The qualifications that appear most often in design director jobs.
- 10 or more years of design experience with at least 3 years in a leadership role
- Proficiency in Figma, Adobe Creative Suite, and modern design systems tooling
- Demonstrated ability to build, manage, and mentor cross-functional design teams
- Strong portfolio showing end-to-end brand or product design work at scale
- Experience collaborating with product, marketing, and engineering stakeholders
- Bachelor's or master's degree in graphic design, interaction design, or a related field
Tips for Your Design Director Job Search
Tailor your portfolio to each opening
Design directors are evaluated on vision and process, not just output. Curate your portfolio so the first two or three pieces reflect the exact type of work the company does, whether that's brand systems, product design, or retail experience.
Quantify creative impact on your resume
Hiring teams want to see that your decisions moved a metric. Replace vague bullets like 'led brand refresh' with outcomes: faster time-to-market on design cycles, lift in user engagement after a redesign, or team growth you drove directly.
Apply early to roles that fit
Migrate Mate lists design director openings from across the United States in one place, so you can find roles that match and apply directly to each listing.
Target companies mid-rebrand or post-funding
Design director roles open most often when a company is redefining its visual identity or scaling a product team. Watch for announcements of Series B or C funding rounds and brand overhauls, then search for open roles at those companies immediately.
Prepare a case study walkthrough for interviews
Most design director interviews include a portfolio presentation. Walk interviewers through a project from brief to launch, covering the constraints you faced, the decisions you made, and how you led or mentored the team through each stage.
Negotiate beyond base compensation
At the director level, equity, creative budget, headcount authority, and title scope are often more negotiable than base pay. Know which of those matter most to your career before the offer conversation starts.
Design Director Jobs: Frequently Asked Questions
Which companies are hiring the most design directors?
The companies hiring the most design directors right now include Capital One, Information Technology Senior Management Forum, and Meta, with the largest share of openings in California, New York, and Texas, based on current listings on Migrate Mate as of September 2026. Demand is highest at companies scaling a product team or undergoing a brand transformation.
How many design director jobs are remote?
About 71% of design director openings are fully remote or hybrid as of September 2026, making it one of the more flexible leadership roles in the creative field. Fully remote positions are most common in product and UX design, while brand and experiential design roles are more likely to require at least partial on-site presence.
How do you become a design director?
Becoming a design director typically requires building a strong individual contributor foundation first, then moving into a senior designer or design lead role where you manage at least one direct report or own a significant workstream. From there, you demonstrate strategic thinking by shaping design systems, influencing product or brand decisions at the leadership level, and building a portfolio that shows both craft and team impact. Most candidates reach the director level after several years leading projects and people.
Can you get hired as a design director without prior director experience?
Yes, you can get hired as a design director without a previous director title if you can show director-level work. Hiring managers look for candidates who have owned a design system, led a team through a major launch, or shaped visual or product strategy at a meaningful scale. Framing your portfolio and resume around scope, decisions, and outcomes rather than tasks is what bridges the gap between a senior designer and a first-time director role.
What does the design director interview process look like?
A design director interview process typically includes an initial recruiter screen, a hiring manager conversation focused on leadership philosophy and career trajectory, and at least one portfolio presentation to a cross-functional panel. Later rounds often involve a working session or case study where you walk through how you would approach a real problem the company faces. References and a final conversation with a VP or executive are common closing steps.
Where can I find and apply to design director jobs?
You can find and apply to design director jobs on Migrate Mate, which lists current openings from across the United States. Search the roles available, find the ones that match your experience and specialization, and apply directly to each listing from the page.
See All 430+ Design Director Jobs
Find roles that match your experience and apply in just a few clicks.
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