H-1B Visa Packaging Engineer Jobs
Packaging Engineer roles qualify for H-1B visa sponsorship as specialty occupations requiring at least a bachelor's degree in packaging science, mechanical engineering, or a related field. Employers in food, pharma, consumer goods, and industrial manufacturing file LCAs through DOL before sponsoring, and the annual H-1B cap applies to most private-sector roles.
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Get Access To All JobsCompany:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
We are seeking a highly motivated Staff IC Packaging Engineer to lead the development and commercialization of advanced integrated circuit (IC) packaging technologies. This role focuses on driving innovation and enabling new product introductions. The ideal candidate will possess deep expertise in advanced packaging architectures and assembly processes, and will lead technology development from concept through high-volume manufacturing (HVM) in collaboration with Outsourced Semiconductor Assembly and Test (OSAT) partners. This position requires strong technical leadership, cross-functional collaboration, and the ability to solve complex engineering challenges.
Duties and Responsibilities
-
Lead development and deployment of advanced packaging technologies including FCCSP, FCBGA, SiP/Modules, RDL-based packages, and 2.5D/3D integration.
-
Drive new product introduction (NPI) from concept to successful transfer into high-volume manufacturing.
-
Define and optimize package architectures, including high-density interconnects, die-to-die (D2D) integration, and performance/reliability trade-offs.
-
Develop and establish process flows, material sets, Best Known Methods (BKM), and process control plans.
-
Design and execute Design of Experiments (DOE), test vehicles, and process characterization for technology development and qualification.
-
Collaborate with OSATs, foundries, substrate vendors, and material suppliers to align technology development with product requirements.
-
Partner with internal design, modeling, and product teams to implement Design for Manufacturability (DFM) and establish design rules.
-
Lead cross-functional programs, managing timelines, risks, and deliverables across multiple concurrent projects.
-
Apply strong knowledge of FMEA, SPC/QC, reliability testing, and failure analysis to ensure robust product development.
-
Troubleshoot and resolve complex technical and manufacturing issues across development and production stages.
Minimum Qualifications:
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications
-
Advanced degree (M.S. or Ph.D.) in a relevant engineering discipline
-
Strong expertise in:
-
Flip Chip (CSP/FCBGA) and Wire Bond technologies
-
System in Package (SiP) and module integration
-
Redistribution Layer (RDL), wafer bonding, and advanced packaging (2.5D/3D)
-
Experience with high-density interconnect design, substrate technologies, and package architecture
-
Hands-on knowledge of assembly processes, materials, and equipment
-
Familiarity with wafer-level processes, wafer-on-wafer bonding, and dicing technologies
-
Understanding of reliability standards, qualification methods, and failure mechanisms
-
Experience working with OSATs, foundries, and contract manufacturers
-
Strong background in statistical data analysis and process optimization
-
Knowledge of laser groove technology and wire bond process optimization is a plus
-
Six Sigma Green or Black Belt certification is a plus
-
Experience in IC packaging development and high-volume manufacturing
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able to participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$154,000.00 - $231,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
We are seeking a highly motivated Staff IC Packaging Engineer to lead the development and commercialization of advanced integrated circuit (IC) packaging technologies. This role focuses on driving innovation and enabling new product introductions. The ideal candidate will possess deep expertise in advanced packaging architectures and assembly processes, and will lead technology development from concept through high-volume manufacturing (HVM) in collaboration with Outsourced Semiconductor Assembly and Test (OSAT) partners. This position requires strong technical leadership, cross-functional collaboration, and the ability to solve complex engineering challenges.
Duties and Responsibilities
-
Lead development and deployment of advanced packaging technologies including FCCSP, FCBGA, SiP/Modules, RDL-based packages, and 2.5D/3D integration.
-
Drive new product introduction (NPI) from concept to successful transfer into high-volume manufacturing.
-
Define and optimize package architectures, including high-density interconnects, die-to-die (D2D) integration, and performance/reliability trade-offs.
-
Develop and establish process flows, material sets, Best Known Methods (BKM), and process control plans.
-
Design and execute Design of Experiments (DOE), test vehicles, and process characterization for technology development and qualification.
-
Collaborate with OSATs, foundries, substrate vendors, and material suppliers to align technology development with product requirements.
-
Partner with internal design, modeling, and product teams to implement Design for Manufacturability (DFM) and establish design rules.
-
Lead cross-functional programs, managing timelines, risks, and deliverables across multiple concurrent projects.
-
Apply strong knowledge of FMEA, SPC/QC, reliability testing, and failure analysis to ensure robust product development.
-
Troubleshoot and resolve complex technical and manufacturing issues across development and production stages.
Minimum Qualifications:
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications
-
Advanced degree (M.S. or Ph.D.) in a relevant engineering discipline
-
Strong expertise in:
-
Flip Chip (CSP/FCBGA) and Wire Bond technologies
-
System in Package (SiP) and module integration
-
Redistribution Layer (RDL), wafer bonding, and advanced packaging (2.5D/3D)
-
Experience with high-density interconnect design, substrate technologies, and package architecture
-
Hands-on knowledge of assembly processes, materials, and equipment
-
Familiarity with wafer-level processes, wafer-on-wafer bonding, and dicing technologies
-
Understanding of reliability standards, qualification methods, and failure mechanisms
-
Experience working with OSATs, foundries, and contract manufacturers
-
Strong background in statistical data analysis and process optimization
-
Knowledge of laser groove technology and wire bond process optimization is a plus
-
Six Sigma Green or Black Belt certification is a plus
-
Experience in IC packaging development and high-volume manufacturing
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able to participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$154,000.00 - $231,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
See all 181+ H-1B Visa Packaging Engineer Jobs
Sign up for free to unlock all listings, filter by visa type, and get alerts for new H-1B Visa Packaging Engineer Jobs.
Get Access To All JobsTips for Finding H-1B Visa Sponsorship as a Packaging Engineer
Match your degree to the role
USCIS requires your degree field to directly relate to packaging engineering. A mechanical or materials engineering degree typically qualifies, but a general business degree won't. Pull the O*NET occupation profile to confirm which fields officers consider directly related.
Filter employers by LCA filing history
Search Migrate Mate to identify companies with verified DOL Labor Condition Application filings for Packaging Engineer roles. This narrows your list to employers who have already navigated the sponsorship process, not just those open to it in principle.
Target industries with recurring H-1B demand
Pharmaceutical, medical device, and consumer packaged goods companies file H-1B petitions for packaging engineers far more consistently than small contract manufacturers. Prioritize employers whose production compliance and FDA regulatory work create ongoing specialist demand.
Request prevailing wage documentation early
Before your offer letter is finalized, ask HR which DOL wage level they intend to file at. Use the OFLC Wage Search to verify the prevailing wage for your SOC code and work location so there are no surprises when the LCA is posted.
Clarify employer E-Verify enrollment status
If you're on OPT STEM extension and transitioning to H-1B, your employer must be enrolled in E-Verify. Confirm enrollment before accepting an offer, since unenrolled employers can't maintain your STEM OPT authorization during the cap-gap period.
Prepare a specialty occupation evidence packet
Packaging engineering RFEs often challenge whether the role truly requires a specialized degree. Gather job postings from comparable employers, professional society standards, and any product-specific regulatory requirements that demonstrate why a generalist couldn't perform the work.
H-1B Visa Packaging Engineer: Frequently Asked Questions
Does a Packaging Engineer role qualify as a specialty occupation for H-1B?
Yes, provided the position requires at least a bachelor's degree in a directly related field such as packaging science, mechanical engineering, materials science, or chemical engineering. USCIS scrutinizes roles where employers have historically accepted unrelated degrees, so the job description should specify the required field precisely, not just list a degree as preferred.
Which employers commonly sponsor H-1B visas for Packaging Engineers?
Pharmaceutical manufacturers, medical device companies, food and beverage corporations, and consumer goods producers file H-1B petitions for packaging engineers with the greatest regularity because regulatory compliance and product integrity create sustained specialist demand. You can browse employers with verified H-1B filing history for this role on Migrate Mate.
How does the H-1B lottery affect a Packaging Engineer's job search timeline?
USCIS opens H-1B registration each March for the following October 1 start date. If you're on OPT, you need to secure an offer and have your employer submit a registration before the March window closes. A cap-gap rule extends your OPT authorization through September 30 if your I-765 is timely filed, but you can't start a new H-1B-dependent role until October 1.
What documents should a Packaging Engineer prepare before an employer files an H-1B petition?
You'll need official transcripts confirming your degree and field, credential evaluations if your degree is from outside the U.S., a current resume showing relevant work history, and any professional licenses or certifications specific to your industry. If your degree field isn't an exact match for the role, a credential evaluation that maps your coursework to packaging engineering requirements strengthens the petition.
Can a Packaging Engineer change employers while on H-1B?
Yes. Under H-1B portability, you can start with a new employer as soon as the new I-129 petition is filed, without waiting for approval, as long as your prior H-1B was approved and you haven't been out of status. The new employer must file an LCA through DOL and submit a new I-129 before your first day in the new role.