Director Of Program Management Visa Sponsorship Jobs in Idaho
Director of program management roles in Idaho are concentrated in Boise's growing technology and healthcare sectors, with employers like Micron Technology, St. Luke's Health System, and HP Inc. historically sponsoring senior management positions. Boise's emergence as a regional tech hub has increased demand for experienced program leaders who can drive complex, cross-functional initiatives.
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Get Access To All JobsINTRODUCTION
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As Director of Package Materials Integration in Advanced Packaging Technology Development (APTD), you will lead the strategy, execution, and organizational capability for Micron’s advanced packaging materials roadmap for advanced 3D memory products including HBM and 3DS DRAM. You will lead a global team with direct reports in both the U.S. and Asia and work closely with cross-functional partners across process development, process integration, equipment development, manufacturing, global quality, and purchasing. You will be responsible for setting the advanced packaging materials roadmap, driving supplier engagement to meet roadmap needs, building organizational capability across regions, leading materials aspects of program execution, and resolving critical materials-package interaction issues.
Responsibilities will include, but are not limited to:
- Lead the advanced packaging materials roadmap and ensure alignment with overall product roadmap timelines across multiple development programs.
- Provide organizational leadership for a diverse materials portfolio that includes chemistries (plating, cleaning, etc.), photoresists, films (dicing tapes, temporary bond films, etc.), polymer composites (NCF, mold compound, etc.), and carrier materials (glass, silicon, etc.).
- Lead supplier engagement at executive and engineering levels to prototype, develop, and certify materials in alignment with program requirements, timelines, and long-range roadmap needs.
- Build and lead a high-performing global team with direct reports in both the U.S. and Asia, establishing clear priorities, talent development plans, and strong execution disciplines.
- Partner with process engineering, equipment development, and process integration leaders to ensure all TD deliverables are met and that regional teams operate with aligned priorities and decision-making.
- Drive materials characterization strategies to understand materials-package interaction mechanisms using analytical, mechanical, and thermal testing and analysis, and translate findings into development and product decisions.
- Lead development of novel materials solutions in conjunction with advanced packaging and product teams to recommend optimum package solutions that meet electrical, mechanical, thermal, reliability, cost, and system-level requirements.
- Interface closely with Product Development, frontend Si TD, APTD, Manufacturing, and Global Quality to lead the product/package path from pathfinding through development and into high-volume manufacturing.
Successful candidates for this position will have:
- Demonstrated success leading technical organizations with a strong foundation in structured problem solving.
- Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
- Experience and working knowledge with materials used throughout the advanced packaging flow.
- Understanding of and experience working with materials suppliers in the advanced packaging supply chain/ecosystem.
- Working knowledge of materials characterization techniques and simulation (thermal/mechanical/electrical) methodologies.
- Knowledge in materials-package interactions.
- Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.
- Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
- Proven people leadership with experience managing managers and/or senior technical leaders across geographies, including direct reports in both the U.S. and Asia.
- Demonstrated ability to set organizational direction, develop talent, and drive technical excellence through cross-functional and cross-regional teams.
Required Experience:
- Master of Science/PhD in chemistry, chemical engineering, or materials science and engineering. PhD preferred.
- 15+ years of relevant experience in semiconductor manufacturing or a related field, including hands-on experience in semiconductor advanced packaging.
- 10+ years of management/leadership experience in packaging technology development, including responsibility for leading global teams and driving execution across regions.
- Strong understanding of semiconductor process integration and process development.
- Proven program and organizational leadership skills, with experience driving cross-functional technical teams, influencing executive stakeholders, and delivering results through others.
- Experience with advanced memory packaging is a plus.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
INTRODUCTION
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As Director of Package Materials Integration in Advanced Packaging Technology Development (APTD), you will lead the strategy, execution, and organizational capability for Micron’s advanced packaging materials roadmap for advanced 3D memory products including HBM and 3DS DRAM. You will lead a global team with direct reports in both the U.S. and Asia and work closely with cross-functional partners across process development, process integration, equipment development, manufacturing, global quality, and purchasing. You will be responsible for setting the advanced packaging materials roadmap, driving supplier engagement to meet roadmap needs, building organizational capability across regions, leading materials aspects of program execution, and resolving critical materials-package interaction issues.
Responsibilities will include, but are not limited to:
- Lead the advanced packaging materials roadmap and ensure alignment with overall product roadmap timelines across multiple development programs.
- Provide organizational leadership for a diverse materials portfolio that includes chemistries (plating, cleaning, etc.), photoresists, films (dicing tapes, temporary bond films, etc.), polymer composites (NCF, mold compound, etc.), and carrier materials (glass, silicon, etc.).
- Lead supplier engagement at executive and engineering levels to prototype, develop, and certify materials in alignment with program requirements, timelines, and long-range roadmap needs.
- Build and lead a high-performing global team with direct reports in both the U.S. and Asia, establishing clear priorities, talent development plans, and strong execution disciplines.
- Partner with process engineering, equipment development, and process integration leaders to ensure all TD deliverables are met and that regional teams operate with aligned priorities and decision-making.
- Drive materials characterization strategies to understand materials-package interaction mechanisms using analytical, mechanical, and thermal testing and analysis, and translate findings into development and product decisions.
- Lead development of novel materials solutions in conjunction with advanced packaging and product teams to recommend optimum package solutions that meet electrical, mechanical, thermal, reliability, cost, and system-level requirements.
- Interface closely with Product Development, frontend Si TD, APTD, Manufacturing, and Global Quality to lead the product/package path from pathfinding through development and into high-volume manufacturing.
Successful candidates for this position will have:
- Demonstrated success leading technical organizations with a strong foundation in structured problem solving.
- Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
- Experience and working knowledge with materials used throughout the advanced packaging flow.
- Understanding of and experience working with materials suppliers in the advanced packaging supply chain/ecosystem.
- Working knowledge of materials characterization techniques and simulation (thermal/mechanical/electrical) methodologies.
- Knowledge in materials-package interactions.
- Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.
- Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
- Proven people leadership with experience managing managers and/or senior technical leaders across geographies, including direct reports in both the U.S. and Asia.
- Demonstrated ability to set organizational direction, develop talent, and drive technical excellence through cross-functional and cross-regional teams.
Required Experience:
- Master of Science/PhD in chemistry, chemical engineering, or materials science and engineering. PhD preferred.
- 15+ years of relevant experience in semiconductor manufacturing or a related field, including hands-on experience in semiconductor advanced packaging.
- 10+ years of management/leadership experience in packaging technology development, including responsibility for leading global teams and driving execution across regions.
- Strong understanding of semiconductor process integration and process development.
- Proven program and organizational leadership skills, with experience driving cross-functional technical teams, influencing executive stakeholders, and delivering results through others.
- Experience with advanced memory packaging is a plus.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Director Of Program Management Job Roles in Idaho
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Search Director Of Program Management Jobs in IdahoDirector Of Program Management Jobs in Idaho: Frequently Asked Questions
Which companies sponsor visas for director of program management roles in Idaho?
Micron Technology in Boise is one of Idaho's most active H-1B visa sponsors and regularly hires senior program management leaders for its semiconductor operations. HP Inc. and Clearwater Analytics also have a track record of sponsoring skilled management roles. Healthcare systems like St. Luke's and Saint Alphonsus sponsor program directors for technology and operations functions, particularly as they scale digital transformation initiatives.
Which visa types are most common for director of program management roles in Idaho?
The H-1B is the most common visa for director of program management positions in Idaho, as these roles typically require at least a bachelor's degree in a relevant field such as business, engineering, or computer science, satisfying the specialty occupation requirement. Candidates with extraordinary achievement may pursue the O-1A. Multinational managers transferring from a foreign parent or subsidiary to an Idaho office may qualify for the L-1A instead.
Which cities in Idaho have the most director of program management sponsorship jobs?
Boise accounts for the large majority of director of program management sponsorship activity in Idaho. The city hosts the state's densest concentration of technology, semiconductor, financial technology, and healthcare employers. Meridian and Nampa, both within the Treasure Valley metro area, also have relevant employers in healthcare and manufacturing. Outside this region, meaningful sponsorship opportunities for senior program management roles are limited.
How to find director of program management visa sponsorship jobs in Idaho?
Migrate Mate is purpose-built for international job seekers and filters director of program management roles in Idaho by confirmed visa sponsorship, so you're not sifting through postings from employers who won't support work authorization. Given that sponsoring roles at this seniority level requires significant employer investment, filtering specifically for sponsorship-open companies in Idaho's Treasure Valley tech and healthcare clusters saves considerable time in your search.
Are there state-specific considerations for director of program management sponsorship in Idaho?
Idaho has no state income tax exclusion or special visa program, but the Treasure Valley's lower cost of doing business relative to Seattle or San Francisco means employers there can be more competitive in attracting senior talent. For H-1B petitions, the Department of Labor prevailing wage for director-level program management roles is determined by the Boise metropolitan area wage data, so employers must meet that benchmark when filing the Labor Condition Application.
What is the prevailing wage for sponsored director of program management jobs in Idaho?
U.S. employers sponsoring a visa must pay at least the prevailing wage, which is what workers in the same role, area, and experience level typically earn. The Department of Labor sets this rate to make sure companies aren't hiring foreign workers simply because they'd accept lower pay than a U.S. worker. It varies by job title, location, and experience. You can look up current prevailing wage rates for any occupation and location using the OFLC Wage Search page.