Cloud Engineer Jobs at Qualcomm with Visa Sponsorship
Cloud Engineer jobs at Qualcomm span infrastructure, platform, and chip-to-cloud integration work, with the company maintaining a well-established process for sponsoring international talent in this function. If you need H-1B visa, OPT, or other work authorization, Qualcomm actively supports candidates through the filing process.
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Get Access To All JobsCompany:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
About the role
Qualcomm's Cloud Business Unit is building next-generation AI inference rack scale solutions, anchored by the AI200/AI250 accelerator family. We are seeking a seasoned Senior Director to lead the end-to-end hardware architecture, design, and delivery of full rack-level solutions — from OCP/Open Rack-compliant chassis, power, and thermal systems to high-speed interconnects, management infrastructure, and ODM engagement. This leader will define Qualcomm's rack-scale differentiation strategy and drive execution across cross-functional hardware and systems teams.
Key Responsibilities
Rack Architecture & System Design:
- Define and own end-to-end rack-scale architecture for Qualcomm AI accelerator platforms (AI200/AI250 family and future roadmap), targeting OCP Open Rack and 19" EIA form factors.
- Lead system-level design trade-offs spanning power delivery (48V DC busbar, rack PDU), cooling architecture, signal integrity, and mechanical integration.
Thermal & Cooling Systems:
- Architect and oversee direct liquid cooling (DLC) systems including CDU sizing (e.g., 138+ kW per rack), blind-mate manifolds (UQD/UQDB), cold plates, leak detection, and coolant loop design.
- Ensure rack-level thermal validation and compliance with customer facility requirements (CDU inlet temperature, flow rate, pressure drop).
Power Architecture:
- Define rack power delivery architectures including 48V DC busbars, modular PSU shelves and VR/PMIC integration.
- Drive power budget analysis across full rack configurations (compute blades, switches, storage, CDU) and ensure PUE/efficiency targets are met.
High-Speed Interconnects & Networking:
- Lead rack-scale interconnect strategy encompassing CXL, UALink, PCIe Gen 6, and 800G/1.6T Ethernet switching fabrics (scale-up and scale-out).
- Own signal integrity requirements for high-performance PCB materials and rack-level cabling (copper and optical), including material trade-off analysis.
BMC / RMC & Rack Management:
- Define and drive BMC/RMC architecture for OOB management, Redfish/IPMI compliance, telemetry, and health monitoring.
- Ensure DC-SCM 2.0 integration and multi-generation firmware roadmap aligned with OCP standards.
ODM & Ecosystem Engagement:
- Lead technical engagement with ODM/OEM partners for rack-level NRE, design validation, manufacturing, and qualification.
- Partner with hyperscaler customers and CSPs to align rack-scale hardware solutions to datacenter facility and operational requirements.
Cross-Functional Leadership & Execution:
- Build, mentor, and lead a high-performance team of rack-scale hardware, thermal, power, and mechanical engineers across multiple sites.
- Partner with ASIC, software, product management, and supply chain teams to drive rack-level productization milestones from concept to NPI.
- Own rack-level hardware validation and EVT/DVT/PVT planning, coordinating with QA and customer enablement teams.
- Manage rack-scale program budgets, headcount planning, and delivery schedules in alignment with Cloud BU product roadmap.
Experience
- 20+ years of experience in hardware engineering, with at least 5 years in a senior leadership role (Director or above).
- Proven track record of delivering rack-scale or full-system hardware platforms for cloud/data center markets.
- Deep expertise in OCP Open Rack v3 (ORv3) standards, OCP DC-MHS, DC-SCM, and related specifications.
- Hands-on experience with direct liquid cooling (DLC) system design and thermal architecture at the rack level.
- Strong background in high-speed digital design (PCIe Gen5/6, CXL, UALink, Ethernet 400G/800G) and signal integrity.
- Experience with rack-level power architecture including 48V DC distribution, VR/PMIC design, and efficiency optimization.
- Familiarity with BMC/RMC platforms, Redfish API, IPMI, and OCP management stack.
- Experience managing ODM/OEM partnerships for large-scale hardware development and qualifications.
Minimum Qualifications:
- Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$249,900.00 - $374,900.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
About the role
Qualcomm's Cloud Business Unit is building next-generation AI inference rack scale solutions, anchored by the AI200/AI250 accelerator family. We are seeking a seasoned Senior Director to lead the end-to-end hardware architecture, design, and delivery of full rack-level solutions — from OCP/Open Rack-compliant chassis, power, and thermal systems to high-speed interconnects, management infrastructure, and ODM engagement. This leader will define Qualcomm's rack-scale differentiation strategy and drive execution across cross-functional hardware and systems teams.
Key Responsibilities
Rack Architecture & System Design:
- Define and own end-to-end rack-scale architecture for Qualcomm AI accelerator platforms (AI200/AI250 family and future roadmap), targeting OCP Open Rack and 19" EIA form factors.
- Lead system-level design trade-offs spanning power delivery (48V DC busbar, rack PDU), cooling architecture, signal integrity, and mechanical integration.
Thermal & Cooling Systems:
- Architect and oversee direct liquid cooling (DLC) systems including CDU sizing (e.g., 138+ kW per rack), blind-mate manifolds (UQD/UQDB), cold plates, leak detection, and coolant loop design.
- Ensure rack-level thermal validation and compliance with customer facility requirements (CDU inlet temperature, flow rate, pressure drop).
Power Architecture:
- Define rack power delivery architectures including 48V DC busbars, modular PSU shelves and VR/PMIC integration.
- Drive power budget analysis across full rack configurations (compute blades, switches, storage, CDU) and ensure PUE/efficiency targets are met.
High-Speed Interconnects & Networking:
- Lead rack-scale interconnect strategy encompassing CXL, UALink, PCIe Gen 6, and 800G/1.6T Ethernet switching fabrics (scale-up and scale-out).
- Own signal integrity requirements for high-performance PCB materials and rack-level cabling (copper and optical), including material trade-off analysis.
BMC / RMC & Rack Management:
- Define and drive BMC/RMC architecture for OOB management, Redfish/IPMI compliance, telemetry, and health monitoring.
- Ensure DC-SCM 2.0 integration and multi-generation firmware roadmap aligned with OCP standards.
ODM & Ecosystem Engagement:
- Lead technical engagement with ODM/OEM partners for rack-level NRE, design validation, manufacturing, and qualification.
- Partner with hyperscaler customers and CSPs to align rack-scale hardware solutions to datacenter facility and operational requirements.
Cross-Functional Leadership & Execution:
- Build, mentor, and lead a high-performance team of rack-scale hardware, thermal, power, and mechanical engineers across multiple sites.
- Partner with ASIC, software, product management, and supply chain teams to drive rack-level productization milestones from concept to NPI.
- Own rack-level hardware validation and EVT/DVT/PVT planning, coordinating with QA and customer enablement teams.
- Manage rack-scale program budgets, headcount planning, and delivery schedules in alignment with Cloud BU product roadmap.
Experience
- 20+ years of experience in hardware engineering, with at least 5 years in a senior leadership role (Director or above).
- Proven track record of delivering rack-scale or full-system hardware platforms for cloud/data center markets.
- Deep expertise in OCP Open Rack v3 (ORv3) standards, OCP DC-MHS, DC-SCM, and related specifications.
- Hands-on experience with direct liquid cooling (DLC) system design and thermal architecture at the rack level.
- Strong background in high-speed digital design (PCIe Gen5/6, CXL, UALink, Ethernet 400G/800G) and signal integrity.
- Experience with rack-level power architecture including 48V DC distribution, VR/PMIC design, and efficiency optimization.
- Familiarity with BMC/RMC platforms, Redfish API, IPMI, and OCP management stack.
- Experience managing ODM/OEM partnerships for large-scale hardware development and qualifications.
Minimum Qualifications:
- Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$249,900.00 - $374,900.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
See all 42+ Cloud Engineer Jobs at Qualcomm
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Cloud Engineer Jobs at Qualcomm.
Get Access To All JobsTips for Finding Cloud Engineer Jobs at Qualcomm
Align your credentials to Qualcomm's cloud stack
Qualcomm's cloud engineering roles often sit at the intersection of semiconductor platforms and hyperscale infrastructure. Certifications in AWS, Azure, or GCP, combined with experience in containerization or distributed systems, signal direct fit to their hiring teams.
Target roles that match your current visa status
Qualcomm sponsors multiple visa categories, so check whether a role is open to F-1 OPT or CPT before applying. Some cloud infrastructure positions are filled faster through OPT than through H-1B cap seasons, which can affect your timeline significantly.
Clarify LCA coverage before accepting an offer
Your offer letter should specify the work location and corresponding prevailing wage tier. Qualcomm engineers sometimes work across sites, so confirm your Labor Condition Application filed with DOL reflects where you'll actually be based.
Prepare for technical depth in cloud-specific interviews
Qualcomm's cloud teams frequently probe system design at scale, including networking, storage architecture, and CI/CD pipelines tied to silicon or media workloads. Preparing for these specifics distinguishes you from candidates with generic cloud backgrounds.
Use Migrate Mate to surface open Cloud Engineer roles at Qualcomm
Filter by visa type and role on Migrate Mate to find Cloud Engineer positions at Qualcomm that are actively open to sponsored candidates. This saves time compared to manually parsing job boards that don't surface sponsorship eligibility.
Understand H-1B cap timing relative to your start date
If you need a cap-subject H-1B, USCIS only accepts petitions in April for an October 1 start. If your OPT expires before October, ask Qualcomm's immigration team about cap-gap coverage or whether a cap-exempt filing path applies to your situation.
Frequently Asked Questions
Does Qualcomm sponsor H-1B visas for Cloud Engineers?
Yes, Qualcomm sponsors H-1B visas for Cloud Engineers and has a consistent record of doing so across this function. The company works with immigration counsel to manage petitions, Labor Condition Applications through DOL, and USCIS filings. If you're currently on OPT or another nonimmigrant status, it's worth confirming the specific role's sponsorship eligibility during the interview process.
How do I apply for Cloud Engineer jobs at Qualcomm?
Apply directly through Qualcomm's careers portal, where Cloud Engineer roles are listed by team and location. You can also browse open positions at Qualcomm filtered by visa sponsorship eligibility on Migrate Mate, which surfaces roles suited to candidates who need work authorization. Tailor your resume to reflect cloud infrastructure experience relevant to semiconductor or platform engineering contexts.
Which visa types does Qualcomm commonly use for Cloud Engineer roles?
Qualcomm sponsors several visa categories for Cloud Engineers, including H-1B, H-1B1 visa for Chilean and Singaporean nationals, TN visa for Canadian and Mexican professionals, F-1 OPT and CPT for students, and J-1 visa for eligible trainees. For permanent residence, Qualcomm pursues employment-based Green Card pathways including EB-2 and EB-3 through the PERM labor certification process with DOL.
What qualifications does Qualcomm expect for Cloud Engineer roles?
Qualcomm's Cloud Engineer positions generally require a bachelor's or master's degree in Computer Science, Electrical Engineering, or a closely related field. Hands-on experience with cloud platforms such as AWS, Azure, or GCP is expected, along with proficiency in infrastructure-as-code, Kubernetes, or distributed systems. Roles tied to Qualcomm's chip or media technology platforms may also require familiarity with embedded or real-time systems.
How do I understand the H-1B petition timeline if I'm currently on OPT?
If you're on F-1 OPT when Qualcomm extends a full-time offer, USCIS's cap-gap rule automatically extends your work authorization if your OPT expires between April 1 and September 30 and your H-1B petition was filed before your OPT end date. STEM OPT extension gives up to 24 additional months, which can bridge multiple cap seasons. Confirm with Qualcomm's immigration team which filing window applies to your start date.