E-3 Visa Technical Solutions Engineer Jobs
Technical Solutions Engineer roles qualify for E-3 visa sponsorship as specialty occupations requiring a bachelor's degree in engineering, computer science, or a related field. Australian professionals can secure two-year, renewable E-3 status with no lottery, making this one of the most direct paths to U.S. employment in technical pre-sales and customer-facing engineering.
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Job Description:
About Intel Foundry
Intel Foundry is revolutionizing the semiconductor industry as a leading systems foundry, delivering breakthrough silicon process and packaging technologies for the AI era. We combine industry-leading technology, extensive IP portfolio, world-class design ecosystem, and a resilient global manufacturing supply chain to drive scalability and innovation.
As pioneers of Moore's Law, we continuously innovate and collaborate with an extensive partner ecosystem to advance technologies that enable our customers to create industry-leading products. Our strategic investments in geographically diverse manufacturing capabilities strengthen semiconductor supply chain resilience, particularly for advanced products. Through our technological expertise, manufacturing scale, and sustainable supply chain approach, Intel Foundry enables the world's essential computing, server, mobile, networking, and automotive systems for the AI era.
The Opportunity
Join Intel Foundry Services as a Senior Technical Solutions Engineer - Advanced Packaging and become the cornerstone of customer success for our key Packaging and Test accounts. This critical role combines technical expertise with customer relationship management to drive adoption of Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.
Customer Relationship Leadership:
- Serve as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases
- Act as the Voice of the Customer within Intel Foundry, advocating for customer priorities and expectations across all internal functions
Technical Consultation & Problem-Solving:
- Partner directly with customers to understand packaging challenges and requirements
- Provide expert technical consultation on packaging solutions and processes
- Connect customers with Intel Foundry's technical experts for specialized insights
Cross-Functional Collaboration:
- Work with Technology Development, Product Engineering, Manufacturing, Operations, and Customer Engineering teams
- Influence product and technology roadmaps through customer feedback and market insights
- Coordinate internal Intel resources to ensure customer success
Program Management & Execution:
- Develop and maintain comprehensive Statements of Work (SOW) documenting requirements, commitments, deliverables, and milestones
- Manage complete customer engagement lifecycle from design award through high-volume manufacturing and end-of-life
- Track commitments, action items, and escalations while monitoring risks and dependencies
- Drive resolution of qualification and delivery issues
Communication & Reporting:
- Provide clear, regular status reports to customers and leadership
- Facilitate effective communication between technical and business stakeholders
Core Competencies:
- Strong communication skills
- Ability to navigate both technical and operational discussions effectively
- Strong problem-solving and analytical thinking capabilities
- Talent for explaining complex technical concepts clearly and concisely
Qualifications
The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and/or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:
- Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or in a related field
- 5+ years of experience in one or more of the following: Semiconductor Packaging, Assembly/Test, Backend Manufacturing, Operations, Product Engineering, Field Applications, or customer-facing engineering roles
- 8+ years of Semiconductor experience
Preferred Qualifications:
- Post graduate degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field
- Experience in Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, Power Delivery, and Thermal Management
- Experience with Advanced Package Manufacturing, Bumping, Assembly, and Test processes
- Experience with DOE, FMEA, yield analysis, and failure analysis methodologies
- Project management and customer-facing experience
- Flexibility for travel as needed
Ready to make your mark? Apply today and become integral to Intel's journey toward operational excellence.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, California, Folsom
US, California, Santa Clara
US, Oregon, Hillsboro
US, Texas, Austin
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $160,980.00-311,040.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Job Details:
Job Description:
About Intel Foundry
Intel Foundry is revolutionizing the semiconductor industry as a leading systems foundry, delivering breakthrough silicon process and packaging technologies for the AI era. We combine industry-leading technology, extensive IP portfolio, world-class design ecosystem, and a resilient global manufacturing supply chain to drive scalability and innovation.
As pioneers of Moore's Law, we continuously innovate and collaborate with an extensive partner ecosystem to advance technologies that enable our customers to create industry-leading products. Our strategic investments in geographically diverse manufacturing capabilities strengthen semiconductor supply chain resilience, particularly for advanced products. Through our technological expertise, manufacturing scale, and sustainable supply chain approach, Intel Foundry enables the world's essential computing, server, mobile, networking, and automotive systems for the AI era.
The Opportunity
Join Intel Foundry Services as a Senior Technical Solutions Engineer - Advanced Packaging and become the cornerstone of customer success for our key Packaging and Test accounts. This critical role combines technical expertise with customer relationship management to drive adoption of Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.
Customer Relationship Leadership:
- Serve as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases
- Act as the Voice of the Customer within Intel Foundry, advocating for customer priorities and expectations across all internal functions
Technical Consultation & Problem-Solving:
- Partner directly with customers to understand packaging challenges and requirements
- Provide expert technical consultation on packaging solutions and processes
- Connect customers with Intel Foundry's technical experts for specialized insights
Cross-Functional Collaboration:
- Work with Technology Development, Product Engineering, Manufacturing, Operations, and Customer Engineering teams
- Influence product and technology roadmaps through customer feedback and market insights
- Coordinate internal Intel resources to ensure customer success
Program Management & Execution:
- Develop and maintain comprehensive Statements of Work (SOW) documenting requirements, commitments, deliverables, and milestones
- Manage complete customer engagement lifecycle from design award through high-volume manufacturing and end-of-life
- Track commitments, action items, and escalations while monitoring risks and dependencies
- Drive resolution of qualification and delivery issues
Communication & Reporting:
- Provide clear, regular status reports to customers and leadership
- Facilitate effective communication between technical and business stakeholders
Core Competencies:
- Strong communication skills
- Ability to navigate both technical and operational discussions effectively
- Strong problem-solving and analytical thinking capabilities
- Talent for explaining complex technical concepts clearly and concisely
Qualifications
The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and/or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:
- Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or in a related field
- 5+ years of experience in one or more of the following: Semiconductor Packaging, Assembly/Test, Backend Manufacturing, Operations, Product Engineering, Field Applications, or customer-facing engineering roles
- 8+ years of Semiconductor experience
Preferred Qualifications:
- Post graduate degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field
- Experience in Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, Power Delivery, and Thermal Management
- Experience with Advanced Package Manufacturing, Bumping, Assembly, and Test processes
- Experience with DOE, FMEA, yield analysis, and failure analysis methodologies
- Project management and customer-facing experience
- Flexibility for travel as needed
Ready to make your mark? Apply today and become integral to Intel's journey toward operational excellence.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, California, Folsom
US, California, Santa Clara
US, Oregon, Hillsboro
US, Texas, Austin
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $160,980.00-311,040.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
See all 1,148+ E-3 Visa Technical Solutions Engineer Jobs
Sign up for free to unlock all listings, filter by visa type, and get alerts for new E-3 Visa Technical Solutions Engineer Jobs.
Get Access To All JobsTips for Finding E-3 Visa Sponsorship as a Technical Solutions Engineer
Frame your degree for specialty occupation
DOL and USCIS require your degree field to align with the Technical Solutions Engineer role. A computer science or engineering degree maps cleanly, but an unrelated degree needs supporting coursework or experience documented in an evaluation letter before your employer files the LCA.
Target employers with active LCA filing history
Search the DOL's Office of Foreign Labor Certification disclosure data to confirm whether a company has filed LCAs for technical or solutions engineering roles. Employers already familiar with the LCA process move faster and create fewer compliance delays.
Clarify your job scope before the LCA is filed
Technical Solutions Engineers often split time across customer sites or multiple states. Each primary worksite beyond your home office may require a separate LCA posting. Confirm your work locations with your employer before filing to avoid amendments or compliance issues later.
Use Migrate Mate's E-3 filing service for your LCA and consulate prep
Once you have an offer, use Migrate Mate's E-3 filing service to handle your LCA submission, DS-160, and consulate preparation end-to-end. This reduces the risk of errors that delay your start date, especially when your role involves third-party client sites.
Address client-site work in your offer letter
Consular officers sometimes question whether a Technical Solutions Engineer role is a genuine employer-employee relationship when the work happens at client offices. Your offer letter should describe the employer's supervision structure and how the role fits within the company's operations.
Prepare a credential evaluation before final-round interviews
Australian three-year bachelor's degrees are generally accepted as equivalent to a U.S. four-year degree, but having a credential evaluation ready before your employer engages USCIS or the consulate removes a common last-minute bottleneck in the sponsorship process.
E-3 Visa Technical Solutions Engineer: Frequently Asked Questions
Where can I find Technical Solutions Engineer jobs that offer E-3 visa sponsorship?
Migrate Mate is built specifically for Australian professionals searching for U.S. roles with E-3 sponsorship. Filtering by job title and visa type surfaces employers who have filed LCAs for technical and solutions engineering positions before, which signals genuine sponsorship willingness rather than an employer encountering the E-3 process for the first time.
How much does it cost to get an E-3 visa?
Migrate Mate's E-3 filing service covers the entire process for $499, including the Labor Condition Application, visa document preparation, and consulate appointment guidance. Traditional immigration lawyers charge $2,000–$5,000+ for the same work. The E-3 has less paperwork than most work visas, so paying thousands for legal help is usually unnecessary.
Does a Technical Solutions Engineer role qualify as a specialty occupation for the E-3?
Yes, provided the role requires at least a bachelor's degree in a specific field such as computer science, engineering, or information technology. Roles that accept any degree regardless of field can face scrutiny. If your job description says 'bachelor's degree in a related field preferred,' ask your employer to revise it to 'required' before filing the LCA with DOL.
How does the E-3 compare to the H-1B for Technical Solutions Engineer roles?
The E-3 has a 10,500 annual cap that has never been reached, so there is no lottery and no waiting period. The H-1B visa runs an oversubscribed lottery each March with roughly a one-in-four selection rate. For Australian nationals in technical roles, the E-3 means you can start within weeks of an offer rather than waiting up to 18 months for an H-1B start date.
Can I switch employers on an E-3 while working as a Technical Solutions Engineer?
Yes, but you need a new LCA and a new E-3 visa for each employer change. The E-3 is employer-specific, so you cannot simply transfer your existing status. Your new employer files a fresh LCA with DOL, and you attend a new consulate appointment in Australia. There is no grace period built into the E-3 for employer transitions, so coordinate your end date and new start date carefully.