Software Engineer Jobs at TE Connectivity with Visa Sponsorship
Software Engineer jobs at TE Connectivity span embedded systems, firmware, and enterprise software supporting hardware used across aerospace, automotive, and industrial sectors. TE Connectivity has a consistent track record of sponsoring international engineers across multiple visa categories, making it a reliable target for candidates who need work authorization.
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Get Access To All JobsMGR II – R& D/Product Development Engineering (High Speed IO)
BU and Function Description
The High Speed IO engineering team within Digital Device Network (DDN) Business Unit is responsible for the development of advanced high-speed interconnect solutions used in hyperscale computing, AI systems, data centers, cloud infrastructure, and next-generation communication platforms.
The team focuses on high-speed connectors, cable assemblies, and system-level interconnect solutions supporting cutting-edge protocols (e.g., PCIe, Ethernet, MSA, etc.), ensuring signal integrity, power integrity, and system performance.
Role Objective
As a Product Development Engineering Manager, you will lead a team responsible for research, design, and development of High Speed IO products aligned with customer requirements and future technology roadmap. You will drive innovation in high-speed signal transmission, ensuring robust product design, system performance, and successful product commercialization.
Job Requirements
- Lead team to research, develop, and sustain High Speed IO products across full lifecycle (concept to mass production)
- Manage performance goals aligned with organization strategy; conduct regular reviews and feedback
- Oversee end-to-end new product development (NPI) including design, simulation, validation, and release
- Coach and develop team members to build a high-performance engineering organization
- Drive continuous improvement of engineering tools, methodologies, and development processes
- Define and execute High Speed IO technology roadmap aligned with industry trends and customer needs
- Work closely with customers, sales, and PM to capture Voice of Customer (VOC), especially system-level SI requirements
- Lead engineering execution following LEANPD/stage-gate processes, ensuring delivery on time, quality, and cost
- Develop and maintain product documentation: specifications, SI reports, design guidelines, test plans, and validation reports
- Collaborate with global manufacturing, procurement, and suppliers to meet technical, quality, and cost targets
- Lead component and technology qualification, especially for high-speed materials and signal-critical structures
- Ensure thorough design verification & validation, including SI/Thermal simulations, high-speed measurements (TDR, VNA, eye diagram, BER)
- Partner with manufacturing teams to ensure smooth product ramp and yield optimization
- Provide strong technical interface to customers on system integration, debugging, and performance optimization
- Conduct competitive analysis and track industry trends in high-speed interconnect technologies
- Build deep understanding of system-level applications (servers, switches, accelerators, etc.)
- Drive innovation through collaboration with global teams and technology centers
- Apply engineering best practices to optimize performance, cost, and manufacturability
What your background should look like
Education and Knowledge
Typically requires:
- Bachelor’s degree with 10+ years experience, OR
- Master’s degree with 6+ years, OR
- PhD with 3+ years
- 3+ years leadership/people management experience
- Strong background in electrical/mechanical engineering with emphasis on high-speed interconnect design
- Deep expertise in High Speed IO technologies, including:
- Signal Integrity (SI) and Thermal
- High-speed protocols (PCIe, Ethernet, MSA, CXL, etc.)
- Channel modeling and link budget analysis
- Experience with product development lifecycle (design, prototyping, testing, qualification)
- Familiarity with simulation and design tools: SI tools (e.g., HFSS)
- 3D CAD and mechanical design tools
- Knowledge of materials for high-speed applications (low-loss dielectric, plating, cable structures)
- Understanding of manufacturing processes (stamping, molding, plating, assembly, etc.)
- Experience with reliability, compliance, and high-speed test methodologies
- Familiarity with quality tools (FMEA, DOE, Six Sigma, 8D)
Competencies
SET: Strategy, Execution, Talent (for managers)
ABOUT TE CONNECTIVITY
TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more.
Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat, Instagram and X (formerly Twitter).
COMPENSATION
- Competitive base salary commensurate with experience: $164,900 – $247,400 (subject to change dependent on physical location)
- Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
- Total Compensation = Base Salary + Incentive(s) + Benefits
BENEFITS
- A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.
EOE, Including Disability/Vets
IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD
TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com. If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities.
Job Locations:
Remote, Pennsylvania #Remote
United States
Posting City: #Remote
Job Country: United States
Travel Required: 10% to 25%
Requisition ID: 153907
Workplace Type: Remote
External Careers Page: Engineering & Technology
MGR II – R& D/Product Development Engineering (High Speed IO)
BU and Function Description
The High Speed IO engineering team within Digital Device Network (DDN) Business Unit is responsible for the development of advanced high-speed interconnect solutions used in hyperscale computing, AI systems, data centers, cloud infrastructure, and next-generation communication platforms.
The team focuses on high-speed connectors, cable assemblies, and system-level interconnect solutions supporting cutting-edge protocols (e.g., PCIe, Ethernet, MSA, etc.), ensuring signal integrity, power integrity, and system performance.
Role Objective
As a Product Development Engineering Manager, you will lead a team responsible for research, design, and development of High Speed IO products aligned with customer requirements and future technology roadmap. You will drive innovation in high-speed signal transmission, ensuring robust product design, system performance, and successful product commercialization.
Job Requirements
- Lead team to research, develop, and sustain High Speed IO products across full lifecycle (concept to mass production)
- Manage performance goals aligned with organization strategy; conduct regular reviews and feedback
- Oversee end-to-end new product development (NPI) including design, simulation, validation, and release
- Coach and develop team members to build a high-performance engineering organization
- Drive continuous improvement of engineering tools, methodologies, and development processes
- Define and execute High Speed IO technology roadmap aligned with industry trends and customer needs
- Work closely with customers, sales, and PM to capture Voice of Customer (VOC), especially system-level SI requirements
- Lead engineering execution following LEANPD/stage-gate processes, ensuring delivery on time, quality, and cost
- Develop and maintain product documentation: specifications, SI reports, design guidelines, test plans, and validation reports
- Collaborate with global manufacturing, procurement, and suppliers to meet technical, quality, and cost targets
- Lead component and technology qualification, especially for high-speed materials and signal-critical structures
- Ensure thorough design verification & validation, including SI/Thermal simulations, high-speed measurements (TDR, VNA, eye diagram, BER)
- Partner with manufacturing teams to ensure smooth product ramp and yield optimization
- Provide strong technical interface to customers on system integration, debugging, and performance optimization
- Conduct competitive analysis and track industry trends in high-speed interconnect technologies
- Build deep understanding of system-level applications (servers, switches, accelerators, etc.)
- Drive innovation through collaboration with global teams and technology centers
- Apply engineering best practices to optimize performance, cost, and manufacturability
What your background should look like
Education and Knowledge
Typically requires:
- Bachelor’s degree with 10+ years experience, OR
- Master’s degree with 6+ years, OR
- PhD with 3+ years
- 3+ years leadership/people management experience
- Strong background in electrical/mechanical engineering with emphasis on high-speed interconnect design
- Deep expertise in High Speed IO technologies, including:
- Signal Integrity (SI) and Thermal
- High-speed protocols (PCIe, Ethernet, MSA, CXL, etc.)
- Channel modeling and link budget analysis
- Experience with product development lifecycle (design, prototyping, testing, qualification)
- Familiarity with simulation and design tools: SI tools (e.g., HFSS)
- 3D CAD and mechanical design tools
- Knowledge of materials for high-speed applications (low-loss dielectric, plating, cable structures)
- Understanding of manufacturing processes (stamping, molding, plating, assembly, etc.)
- Experience with reliability, compliance, and high-speed test methodologies
- Familiarity with quality tools (FMEA, DOE, Six Sigma, 8D)
Competencies
SET: Strategy, Execution, Talent (for managers)
ABOUT TE CONNECTIVITY
TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more.
Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat, Instagram and X (formerly Twitter).
COMPENSATION
- Competitive base salary commensurate with experience: $164,900 – $247,400 (subject to change dependent on physical location)
- Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
- Total Compensation = Base Salary + Incentive(s) + Benefits
BENEFITS
- A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.
EOE, Including Disability/Vets
IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD
TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com. If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities.
Job Locations:
Remote, Pennsylvania #Remote
United States
Posting City: #Remote
Job Country: United States
Travel Required: 10% to 25%
Requisition ID: 153907
Workplace Type: Remote
External Careers Page: Engineering & Technology
See all Software Engineer Jobs at TE Connectivity
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Software Engineer Jobs at TE Connectivity.
Get Access To All JobsTips for Finding Software Engineer Jobs at TE Connectivity
Align your background with embedded software needs
TE Connectivity's Software Engineer roles often sit at the intersection of hardware and software. Highlight experience with firmware, real-time operating systems, or hardware-software integration to match the embedded and connected-device work common across their product lines.
Confirm OPT eligibility before your interview process
If you're on F-1 OPT, verify your STEM extension timeline against TE Connectivity's typical hiring cycle. An offer that arrives late in your initial OPT period may require your university's DSO to authorize STEM OPT before your start date.
Target teams with active hardware product development
TE Connectivity hires Software Engineers across sensors, connectors, and industrial automation products. Applying directly to roles tied to specific product families increases your chances of joining a team that has an established sponsorship workflow for this function.
Ask specifically about H-1B timing during the offer stage
TE Connectivity sponsors H-1B visas, but the USCIS cap registration window opens in March each year for an October 1 start date. Confirm with the recruiter whether an offer is contingent on cap selection so you can plan your authorization gap accordingly.
Prepare documentation for specialty occupation from day one
For H-1B petitions, the DOL Labor Condition Application requires the employer to document that your Software Engineer role qualifies as a specialty occupation. Gather transcripts and job description evidence early so there are no delays when TE Connectivity's legal team begins filing.
Use Migrate Mate to find open Software Engineer roles at TE Connectivity
Filtering by visa type across a large employer's job board is inefficient. Migrate Mate surfaces TE Connectivity Software Engineer openings filtered by sponsorship eligibility, so you spend time on roles where your visa status is already a fit.
Frequently Asked Questions
Does TE Connectivity sponsor H-1B visas for Software Engineers?
Yes, TE Connectivity sponsors H-1B visas for Software Engineers. The company has a consistent history of filing H-1B petitions for technical roles, and their legal and HR infrastructure is set up to handle the process. If you receive an offer, confirm the expected start date against the USCIS cap timeline, since H-1B employment typically begins October 1 following the March registration lottery.
How do I apply for Software Engineer jobs at TE Connectivity?
You can search and apply through TE Connectivity's careers portal directly, or use Migrate Mate to filter Software Engineer openings at TE Connectivity by visa sponsorship type. When applying, tailor your resume to the hardware-software overlap common in their roles, such as embedded systems, connectivity platforms, or industrial automation software, and address your visa status clearly in your application.
Which visa types does TE Connectivity commonly use for Software Engineer roles?
TE Connectivity sponsors H-1B visas as the primary work authorization pathway for Software Engineers. They also support F-1 OPT and CPT for students and recent graduates, TN visas for Canadian and Mexican nationals in qualifying technical roles, and J-1 visa for certain exchange or intern programs. For longer-term pathways, TE Connectivity has sponsored EB-2 and EB-3 Green Card petitions through the PERM labor certification process.
What qualifications does TE Connectivity look for in Software Engineer candidates who need sponsorship?
TE Connectivity's Software Engineer roles typically require a bachelor's degree or higher in Computer Science, Electrical Engineering, or a closely related field. For H-1B purposes, this degree requirement also supports the specialty occupation classification the DOL and USCIS require. Roles tied to hardware products often prioritize experience with embedded systems, C or C++ development, or real-time software, alongside any domain knowledge in automotive, aerospace, or industrial electronics.
How long does the visa sponsorship process typically take after receiving an offer from TE Connectivity?
Timeline depends on the visa type. For H-1B cap cases, expect several months between offer and work authorization, since employment can only begin on October 1 after USCIS lottery selection in March. For F-1 OPT transitions or TN visas, the gap is shorter, often two to six weeks. PERM-based Green Card sponsorship runs on a separate multi-year track and is typically initiated after you're already employed.