Product Software Engineer Jobs at TE Connectivity with Visa Sponsorship
TE Connectivity hires Product Software Engineers to build firmware, embedded systems, and connectivity solutions for industrial and automotive hardware. The company sponsors work visas for this function, making it a realistic target if you're on OPT, H-1B, or another work-authorized status.
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At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Overview
Data communications applications change at an exponential pace and the Digital Data Networks Business Unit is at the heart of a continuously expanding connected life. Accordingly, we provide responsive, iterative and fundamentally agile capabilities to support today's demands. Our customers are building the devices and the infrastructure that is redefining what information technology means. Our products push markets and meet the ever-changing need of the evolving, more connected, data-driven world. We are enhancing the way we do business, focusing on the most important things and staying agile and responsive to the needs of a faster, more connected world. Are you a self-starter, an influencer and have a passion for evolving high-speed data communication technology? At TE Connectivity, you will find a culture that rewards such hands-on engineering spirit. We empower our engineers to work collaboratively supporting our customer’s next generation of high-speed data communication products. This is a great opportunity to join our team that is seeking a like-minded person to develop relationships with key technology individuals at customers to understand technology pain points and direction.
What you will be doing…
As a system architect in our Digital Data Networks Business Unit, this individual will be focused on the computer, storage, artificial intelligence, and networking industry. You will interface with customers in order to understand how their systems function and determine their evolving technology needs. The System Architect is responsible for generating the high-level system architecture requirements and ensuring the TE technology and product roadmaps are in line with customer next-generation product needs. This person is required to follow and help drive strategy both internally and externally at key industry communication standards.
Job Requirements
Technical Leadership & Customer Engagement
- Act as one of the key technical interfaces for hyperscalers, OEMs, and system architects, to gain insights into next-generation compute, AI, storage, and networking challenges.
- Identify and assess technology disruptors, translating emerging trends into strategic R&D initiatives and product development roadmaps to maintain TE’s industry leadership.
- Cultivate and strengthen customer partnerships, fostering co-development opportunities and collaborative innovation to accelerate next-gen infrastructure advancements.
- Support internal stakeholders, including product development, R&D, and sales teams, by providing technical guidance on next-gen interconnect technologies.
System-Level Architecture & Product Strategy
- Define high-level system architecture requirements, ensuring TE’s product roadmap is aligned with next-generation compute, AI, and networking ecosystems.
- Bridge the gap between customer needs and TE’s technology roadmap, ensuring TE delivers future-proof, scalable, and high-performance interconnect solutions tailored to the evolving data infrastructure landscape.
- Drive TE’s technology vision and strategy, ensuring our interconnect solutions support the evolving needs of standards like PCIe, CXL, Ethernet, InfiniBand, and the next-gen AI workloads.
- Lead the evaluation of high-speed electrical, optical, and hybrid interconnect solutions, balancing performance, power, latency, cost, and manufacturability.
- Collaborate with senior architects and internal R&D, product development, and business units to shape product development roadmaps based on real-world customer challenges and market trends.
Standards Development & Industry Influence
- Actively participate in and influence key industry standards groups (e.g., OCP, PCI-SIG, IEEE, Ethernet Alliance, CXL Consortium), ensuring TE’s strategic alignment with the future of data communication.
- Support senior architects in leading and influencing discussions on emerging protocols and interface standards, ensuring TE is at the forefront of next-generation high-speed, low-latency interconnect technologies.
- Actively contribute to the development of next-gen copper and optical interconnect standards, positioning TE as an industry innovator, ensuring our solutions stay ahead of the competition.
- Represent TE at industry forums, conferences, and standards organizations, reinforcing our role as a leader in high-speed interconnect technology and ensuring our strategic perspectives drive industry advancements.
- Develop and present thought leadership content, including technical whitepapers, reference designs, and industry presentations, to amplify TE’s influence within the standards community and the broader industry ecosystem.
Cross-Functional Leadership & Execution
- Work cross-functionally with engineering, product management, sales, and marketing teams to translate technical insights into compelling product offerings.
- Drive the execution of high-impact, innovative technical projects, ensuring seamless alignment between customer needs, business goals, and engineering capabilities.
- Guide TE’s go-to-market strategy for new interconnect solutions, ensuring that our technical differentiation is clearly communicated and leveraged in competitive landscapes.
What Your Background Should Look Like
- Bachelor’s degree in Mechanical Engineering.
- 8+ years of experience in compute, networking, AI, or storage system design and high-speed interconnect technologies.
- Knowledge of compute, AI/ML, networking, and storage architectures.
- Knowledge of hardware and associated signaling environments.
- Technical expertise in high-speed engineering and design.
- Familiarity with industry standards like PCIe, CXL, Ethernet, and InfiniBand.
- Experience with industry-standard design tools (e.g., simulation, modeling, CAD, or signal integrity analysis).
- Strong analytical and problem-solving skills, with experience in design trade-offs for power, latency, and scalability.
- Effective communicator, able to present technical concepts to internal teams, customers, and industry partners.
- Effectively able to build relationships with external customers and industry leaders as well as internally across all levels, disciplines, and geographies.
- Self-motivated with the ability to take the initiative to accomplish tasks with limited directions.
- Ability to spend 10%-25% of your time traveling to customers, conferences, and TE development sites.
Competencies
Values: Integrity, Accountability, Inclusion, Innovation, Teamwork
Compensation
- Competitive base salary commensurate with experience: $141,400 – $212,200 (subject to change dependent on physical location).
- Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
- Total Compensation = Base Salary + Incentive(s) + Benefits.

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Overview
Data communications applications change at an exponential pace and the Digital Data Networks Business Unit is at the heart of a continuously expanding connected life. Accordingly, we provide responsive, iterative and fundamentally agile capabilities to support today's demands. Our customers are building the devices and the infrastructure that is redefining what information technology means. Our products push markets and meet the ever-changing need of the evolving, more connected, data-driven world. We are enhancing the way we do business, focusing on the most important things and staying agile and responsive to the needs of a faster, more connected world. Are you a self-starter, an influencer and have a passion for evolving high-speed data communication technology? At TE Connectivity, you will find a culture that rewards such hands-on engineering spirit. We empower our engineers to work collaboratively supporting our customer’s next generation of high-speed data communication products. This is a great opportunity to join our team that is seeking a like-minded person to develop relationships with key technology individuals at customers to understand technology pain points and direction.
What you will be doing…
As a system architect in our Digital Data Networks Business Unit, this individual will be focused on the computer, storage, artificial intelligence, and networking industry. You will interface with customers in order to understand how their systems function and determine their evolving technology needs. The System Architect is responsible for generating the high-level system architecture requirements and ensuring the TE technology and product roadmaps are in line with customer next-generation product needs. This person is required to follow and help drive strategy both internally and externally at key industry communication standards.
Job Requirements
Technical Leadership & Customer Engagement
- Act as one of the key technical interfaces for hyperscalers, OEMs, and system architects, to gain insights into next-generation compute, AI, storage, and networking challenges.
- Identify and assess technology disruptors, translating emerging trends into strategic R&D initiatives and product development roadmaps to maintain TE’s industry leadership.
- Cultivate and strengthen customer partnerships, fostering co-development opportunities and collaborative innovation to accelerate next-gen infrastructure advancements.
- Support internal stakeholders, including product development, R&D, and sales teams, by providing technical guidance on next-gen interconnect technologies.
System-Level Architecture & Product Strategy
- Define high-level system architecture requirements, ensuring TE’s product roadmap is aligned with next-generation compute, AI, and networking ecosystems.
- Bridge the gap between customer needs and TE’s technology roadmap, ensuring TE delivers future-proof, scalable, and high-performance interconnect solutions tailored to the evolving data infrastructure landscape.
- Drive TE’s technology vision and strategy, ensuring our interconnect solutions support the evolving needs of standards like PCIe, CXL, Ethernet, InfiniBand, and the next-gen AI workloads.
- Lead the evaluation of high-speed electrical, optical, and hybrid interconnect solutions, balancing performance, power, latency, cost, and manufacturability.
- Collaborate with senior architects and internal R&D, product development, and business units to shape product development roadmaps based on real-world customer challenges and market trends.
Standards Development & Industry Influence
- Actively participate in and influence key industry standards groups (e.g., OCP, PCI-SIG, IEEE, Ethernet Alliance, CXL Consortium), ensuring TE’s strategic alignment with the future of data communication.
- Support senior architects in leading and influencing discussions on emerging protocols and interface standards, ensuring TE is at the forefront of next-generation high-speed, low-latency interconnect technologies.
- Actively contribute to the development of next-gen copper and optical interconnect standards, positioning TE as an industry innovator, ensuring our solutions stay ahead of the competition.
- Represent TE at industry forums, conferences, and standards organizations, reinforcing our role as a leader in high-speed interconnect technology and ensuring our strategic perspectives drive industry advancements.
- Develop and present thought leadership content, including technical whitepapers, reference designs, and industry presentations, to amplify TE’s influence within the standards community and the broader industry ecosystem.
Cross-Functional Leadership & Execution
- Work cross-functionally with engineering, product management, sales, and marketing teams to translate technical insights into compelling product offerings.
- Drive the execution of high-impact, innovative technical projects, ensuring seamless alignment between customer needs, business goals, and engineering capabilities.
- Guide TE’s go-to-market strategy for new interconnect solutions, ensuring that our technical differentiation is clearly communicated and leveraged in competitive landscapes.
What Your Background Should Look Like
- Bachelor’s degree in Mechanical Engineering.
- 8+ years of experience in compute, networking, AI, or storage system design and high-speed interconnect technologies.
- Knowledge of compute, AI/ML, networking, and storage architectures.
- Knowledge of hardware and associated signaling environments.
- Technical expertise in high-speed engineering and design.
- Familiarity with industry standards like PCIe, CXL, Ethernet, and InfiniBand.
- Experience with industry-standard design tools (e.g., simulation, modeling, CAD, or signal integrity analysis).
- Strong analytical and problem-solving skills, with experience in design trade-offs for power, latency, and scalability.
- Effective communicator, able to present technical concepts to internal teams, customers, and industry partners.
- Effectively able to build relationships with external customers and industry leaders as well as internally across all levels, disciplines, and geographies.
- Self-motivated with the ability to take the initiative to accomplish tasks with limited directions.
- Ability to spend 10%-25% of your time traveling to customers, conferences, and TE development sites.
Competencies
Values: Integrity, Accountability, Inclusion, Innovation, Teamwork
Compensation
- Competitive base salary commensurate with experience: $141,400 – $212,200 (subject to change dependent on physical location).
- Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
- Total Compensation = Base Salary + Incentive(s) + Benefits.
See all 49+ Product Software Engineer at TE Connectivity jobs
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Get Access To All JobsTips for Finding Product Software Engineer Jobs at TE Connectivity Jobs
Align your resume to embedded systems work
TE Connectivity's Product Software Engineer roles focus on firmware, real-time operating systems, and hardware-software integration. Frame your experience around those specifics, not general full-stack development, so your application maps clearly to their engineering needs.
Target hardware-facing product teams directly
TE Connectivity organizes engineering across connectivity, sensors, and transportation segments. Research which business unit aligns with your background and apply to roles in that segment rather than casting wide across the company.
Prepare documentation for specialty occupation review
H-1B petitions for software roles in hardware companies sometimes face USCIS scrutiny over specialty occupation status. Have transcripts and a degree-to-role analysis ready showing how your computer engineering or software degree directly supports the product work.
Confirm H-1B transfer timing with your offer team
If you're transferring an existing H-1B to TE Connectivity, you can start work once USCIS receives the petition, not after approval. Coordinate the exact portability window with your HR contact so your start date doesn't create a gap in authorized status.
Use Migrate Mate to filter open roles by visa type
Product Software Engineer openings at TE Connectivity vary by location and sponsorship eligibility. Use Migrate Mate to browse current listings filtered by visa type so you're only applying to roles where your specific sponsorship situation is already supported.
Product Software Engineer at TE Connectivity jobs are hiring across the US. Find yours.
Find Product Software Engineer at TE Connectivity JobsFrequently Asked Questions
Does TE Connectivity sponsor H-1B visas for Product Software Engineers?
Yes, TE Connectivity sponsors H-1B visas for Product Software Engineers. The company has a consistent track record of filing H-1B petitions for engineering roles tied to hardware and connectivity product development. If you receive an offer, TE Connectivity's immigration team typically works with outside counsel to prepare and file the petition. Confirm sponsorship availability with your recruiter early, since not every open role carries sponsorship approval.
How do I apply for Product Software Engineer jobs at TE Connectivity?
Apply through TE Connectivity's careers portal or find visa-eligible openings through Migrate Mate, which filters roles by sponsorship type. When applying, tailor your application to the specific hardware segment, such as automotive, industrial, or aerospace, since product software work at TE Connectivity is product-line specific. Highlight embedded systems, firmware, or hardware-software co-design experience, as these map directly to what hiring teams look for.
Which visa types does TE Connectivity commonly use for Product Software Engineers?
TE Connectivity sponsors H-1B, TN, and J-1 visas, and also supports F-1 OPT and CPT for students in qualifying programs. For longer-term employment, the company files EB-2 and EB-3 Green Card petitions through the PERM labor certification process. Canadian and Mexican nationals in software engineering roles are strong candidates for the TN visa, which does not require a lottery and can be issued at the border.
What qualifications does TE Connectivity expect for Product Software Engineers?
TE Connectivity typically expects a bachelor's degree or higher in computer engineering, electrical engineering, or computer science for Product Software Engineer roles. Hands-on experience with embedded C or C++, real-time operating systems, and communication protocols like CAN, I2C, or UART is commonly listed in job descriptions. Roles tied to automotive or industrial segments may also require familiarity with safety standards such as ISO 26262 or IEC 61508.
How do I understand the H-1B filing timeline if I get an offer from TE Connectivity?
The standard H-1B cap lottery opens in March for an October 1 start date, so offers made outside that window may require OPT bridging or a cap-exempt filing strategy. If you're already on H-1B with another employer, TE Connectivity can file an H-1B transfer and you can begin work upon USCIS receipt under portability rules. USCIS processing takes three to six months for standard adjudication, or two to four weeks with premium processing.
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