Electronics Jobs in Arizona with E-3 Sponsorship
Arizona's electronics sector spans semiconductor fabrication, defense electronics, and hardware engineering, with major employers like Intel, Microchip Technology, ON Semiconductor, and Raytheon concentrated in the Phoenix metro and Tucson. Australian nationals pursuing E-3 sponsorship will find the state's manufacturing and engineering base supports a strong range of qualifying specialty occupation roles.
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Job Description:
We're looking for a motivated, passionate, and talented Engineer to join Intel's Advanced Design Customer Enabling (ADCE) group within Assembly Packaging Technology manufacturing organization (APTM) to realize Intel's vision with advanced packaging technologies.
In this position, you will be responsible for defining Package and Disaggregation Architecture across Intel's product portfolios (CPUs, Chipsets, SOC designs and more) as part of the Advanced Design Group. The candidate will be responsible for working with the Si, Package and Board design teams to define and implement a co-design strategy which would optimize product performance and cost at the package and system level.
The job will require the candidate to understand silicon and packaging technology development FMEAs and product packaging requirements - both physical and electrical.
- You will work closely with Intel and external customers on advanced design nodes to establish design flows for advanced package architecture.
- You will be directing technical aspects of the Silicon Bridge/Interposer and Package Architecture process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and supervision of production layouts.
- You will collaborate with EDA partners on advancing design tools and identify most efficient design methods and will serve as the technical expert on advanced package architectures and design tools as well as consult on design and implementation issues. The candidate will have a good technical understanding in the areas of Si - Package - Board interaction.
An ideal candidate would exhibit behavioral traits that indicate:
- Should be a self-motivated engineer who has strong technical background in design and electrical analysis.
- The candidate should be a self-motivated engineer who has strong technical background in both design and electrical analysis.
- They will work with a cross functional team including silicon IP design, package and PCB platform to define and co-optimize package solutions.
- This position determines creative design approaches and solutions based on formal education and judgement, works with the design and layout teams to implement those solutions.
- Strong analytical ability and problem-solving skills like: identifying, isolating, and debugging issues and providing creative solutions.
- Ability to work independently and at various levels of abstraction.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
- Bachelor's with 8+ years or master’s with 6+ years or PhD with 4+ years in electrical engineering or Chemical Engineering or Mechanical Engineering or Material Science.
- 5+ years of experience in semiconductor fabrication and packaging.
- 6+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.
- 5+ years of experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools.
- 3+ years of Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
Preferred Qualifications:
- Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions.
- Ability to work independently and at various levels of abstraction.
- Strong organization, time management, and communication skills, self-motivated.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, Oregon, Hillsboro
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $190,610.00-269,100.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Job Details:
Job Description:
We're looking for a motivated, passionate, and talented Engineer to join Intel's Advanced Design Customer Enabling (ADCE) group within Assembly Packaging Technology manufacturing organization (APTM) to realize Intel's vision with advanced packaging technologies.
In this position, you will be responsible for defining Package and Disaggregation Architecture across Intel's product portfolios (CPUs, Chipsets, SOC designs and more) as part of the Advanced Design Group. The candidate will be responsible for working with the Si, Package and Board design teams to define and implement a co-design strategy which would optimize product performance and cost at the package and system level.
The job will require the candidate to understand silicon and packaging technology development FMEAs and product packaging requirements - both physical and electrical.
- You will work closely with Intel and external customers on advanced design nodes to establish design flows for advanced package architecture.
- You will be directing technical aspects of the Silicon Bridge/Interposer and Package Architecture process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and supervision of production layouts.
- You will collaborate with EDA partners on advancing design tools and identify most efficient design methods and will serve as the technical expert on advanced package architectures and design tools as well as consult on design and implementation issues. The candidate will have a good technical understanding in the areas of Si - Package - Board interaction.
An ideal candidate would exhibit behavioral traits that indicate:
- Should be a self-motivated engineer who has strong technical background in design and electrical analysis.
- The candidate should be a self-motivated engineer who has strong technical background in both design and electrical analysis.
- They will work with a cross functional team including silicon IP design, package and PCB platform to define and co-optimize package solutions.
- This position determines creative design approaches and solutions based on formal education and judgement, works with the design and layout teams to implement those solutions.
- Strong analytical ability and problem-solving skills like: identifying, isolating, and debugging issues and providing creative solutions.
- Ability to work independently and at various levels of abstraction.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
- Bachelor's with 8+ years or master’s with 6+ years or PhD with 4+ years in electrical engineering or Chemical Engineering or Mechanical Engineering or Material Science.
- 5+ years of experience in semiconductor fabrication and packaging.
- 6+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.
- 5+ years of experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools.
- 3+ years of Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
Preferred Qualifications:
- Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions.
- Ability to work independently and at various levels of abstraction.
- Strong organization, time management, and communication skills, self-motivated.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, Oregon, Hillsboro
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $190,610.00-269,100.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Job Roles in Electronics in Arizona
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Get Access To All JobsFrequently Asked Questions
Which electronics companies sponsor E-3 visas in Arizona?
Arizona's electronics industry includes several employers with established histories of sponsoring work visas for specialty occupation roles. Intel operates a major fabrication campus in Chandler, Microchip Technology is headquartered in Chandler, and ON Semiconductor is based in Phoenix. Defense-focused electronics employers like Raytheon and General Dynamics also have significant Arizona operations. Sponsorship practices vary by company, hiring cycle, and role, so confirming sponsorship willingness directly with each employer is always necessary.
Which cities in Arizona have the most electronics E-3 sponsorship jobs?
The Phoenix metropolitan area, including Chandler, Tempe, Scottsdale, and Mesa, concentrates the majority of Arizona's electronics employment. Chandler in particular anchors the so-called Silicon Desert, hosting semiconductor manufacturers and hardware engineering firms. Tucson is a secondary hub, driven by defense electronics and optics companies with ties to the University of Arizona. Smaller pockets of electronics activity exist in Flagstaff and the East Valley.
What types of electronics roles typically qualify for E-3 sponsorship?
E-3 sponsorship requires the position to qualify as a specialty occupation, meaning it normally requires a bachelor's degree or higher in a specific technical field. In Arizona's electronics sector, roles that commonly meet this standard include semiconductor process engineers, electrical engineers, hardware design engineers, embedded systems engineers, RF engineers, and quality assurance engineers. General technician or assembly roles that do not require a relevant degree typically do not qualify.
How do I find electronics E-3 sponsorship jobs in Arizona?
Migrate Mate is built specifically for international job seekers and filters job listings by visa type, including E-3, and by industry, making it straightforward to browse electronics roles in Arizona where employers have indicated sponsorship willingness. Because E-3 eligibility requires both a qualifying role and an employer willing to file the Labor Condition Application, using a platform like Migrate Mate that surfaces sponsorship-relevant listings saves significant time compared to searching general job boards.
Are there any Arizona-specific considerations for electronics E-3 sponsorship?
Arizona's semiconductor industry is expanding following federal investment in domestic chip manufacturing, which has increased engineering hiring in the Phoenix corridor. However, some large employers in this space are government contractors with facility security clearance requirements, and those roles may be restricted to U.S. citizens or permanent residents. Australian nationals on E-3 visas should confirm clearance requirements early in the application process, as these restrictions are set by federal contract terms rather than by the E-3 visa category itself.
What is the prevailing wage for E-3 electronics jobs in Arizona?
U.S. employers sponsoring a visa must pay at least the prevailing wage, which is what workers in the same role, area, and experience level typically earn. The Department of Labor sets this rate to make sure companies aren't hiring foreign workers simply because they'd accept lower pay than a U.S. worker. It varies by job title, location, and experience. You can look up current prevailing wage rates for any occupation and location using the OFLC Wage Search page.
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