Product Engineer Jobs at Google with Visa Sponsorship
Product Engineer jobs at Google sit at the intersection of engineering and product thinking, often requiring full-stack depth, systems design expertise, and cross-functional collaboration. Google has a well-established sponsorship process for this function, working with engineers across H-1B visa, H-1B1 visa, and E-3 visa pathways depending on your nationality and background.
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Get Access To All JobsMinimum qualifications:
- Bachelor’s degree in Electronic Material Science, Polymer Engineering, Electrical engineering, Computer Aided Design, Semiconductor Physics, Manufacturing Statistical Process Control or a related field and 10 years of progressive post-baccalaureate experience in the job offered or in a Silicon Product Engineering-related occupation.
- Alternatively, will accept a Master’s degree in Electronic Material Science, Polymer Engineering, Electrical engineering, Computer Aided Design, Semiconductor Physics, Manufacturing Statistical Process Control or a related field, and 8 years of experience in the job offered or in a Silicon Product Engineering-related occupation.
- Position requires 8 years of experience in the following:
- Advanced Packaging Process Development & HVM Qualification such as for Mobile SOC or SiP (System in Package)
- IC Packaging Failure Mode and Effects Analysis (FMEA), Design of Experiment techniques (DOE) and Statistical Process Control (SPC)
- Chip-Package Interaction(CPI) evaluation, Electromigration (EM) Analysis, Package component & board level reliability testing
- Failure Analysis and Root Cause Corrective Action for IC Packaging
- Technical engagement and program execution with all packaging ecosystem partners including OSATs, substrate manufacturers, and material/machine suppliers.
About the job
Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.
The US base salary range for this full-time position is $176,150 - $237,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
The Platforms and Devices team encompasses Google's various computing software platforms across environments (desktop, mobile, applications), as well as our first party devices and services that combine the best of Google AI, software, and hardware. Teams across this area research, design, and develop new technologies to make our user's interaction with computing faster and more seamless, building innovative experiences for our users around the world.
Responsibilities
- Define, develop, and optimize high-volume manufacturing (HVM) processes for advanced semiconductor packaging technologies for consumer devices, ensuring compliance with electrical, thermal, mechanical, environmental, and cost requirements, especially mobile SOC SIP for on-device AI.
- Drive process optimization and yield improvement using Design of Experiments (DOE) methodology, and establish rigorous process monitoring and control systems to ensure robust manufacturing. Establish and evaluate the effects of package assembly and bumping processes, specifically assessing Chip Package Interaction (CPI) effects such as Silicon ELK stress and impact on board-level reliability.
- Lead Electromigration (EM) evaluations for fine-pitch package solutions, defining material and process requirements to meet long-term package development and reliability roadmaps. Perform comprehensive failure analysis and root cause resolution for manufacturing and field issues encountered during both the technology development and mass production phases.
- Collaborate and manage key suppliers, including OSATs, substrate vendors, and packaging ecosystem partners, to drive technology roadmap execution and establish internal packaging.
- Domestic and International travel required.
Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.
Minimum qualifications:
- Bachelor’s degree in Electronic Material Science, Polymer Engineering, Electrical engineering, Computer Aided Design, Semiconductor Physics, Manufacturing Statistical Process Control or a related field and 10 years of progressive post-baccalaureate experience in the job offered or in a Silicon Product Engineering-related occupation.
- Alternatively, will accept a Master’s degree in Electronic Material Science, Polymer Engineering, Electrical engineering, Computer Aided Design, Semiconductor Physics, Manufacturing Statistical Process Control or a related field, and 8 years of experience in the job offered or in a Silicon Product Engineering-related occupation.
- Position requires 8 years of experience in the following:
- Advanced Packaging Process Development & HVM Qualification such as for Mobile SOC or SiP (System in Package)
- IC Packaging Failure Mode and Effects Analysis (FMEA), Design of Experiment techniques (DOE) and Statistical Process Control (SPC)
- Chip-Package Interaction(CPI) evaluation, Electromigration (EM) Analysis, Package component & board level reliability testing
- Failure Analysis and Root Cause Corrective Action for IC Packaging
- Technical engagement and program execution with all packaging ecosystem partners including OSATs, substrate manufacturers, and material/machine suppliers.
About the job
Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.
The US base salary range for this full-time position is $176,150 - $237,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
The Platforms and Devices team encompasses Google's various computing software platforms across environments (desktop, mobile, applications), as well as our first party devices and services that combine the best of Google AI, software, and hardware. Teams across this area research, design, and develop new technologies to make our user's interaction with computing faster and more seamless, building innovative experiences for our users around the world.
Responsibilities
- Define, develop, and optimize high-volume manufacturing (HVM) processes for advanced semiconductor packaging technologies for consumer devices, ensuring compliance with electrical, thermal, mechanical, environmental, and cost requirements, especially mobile SOC SIP for on-device AI.
- Drive process optimization and yield improvement using Design of Experiments (DOE) methodology, and establish rigorous process monitoring and control systems to ensure robust manufacturing. Establish and evaluate the effects of package assembly and bumping processes, specifically assessing Chip Package Interaction (CPI) effects such as Silicon ELK stress and impact on board-level reliability.
- Lead Electromigration (EM) evaluations for fine-pitch package solutions, defining material and process requirements to meet long-term package development and reliability roadmaps. Perform comprehensive failure analysis and root cause resolution for manufacturing and field issues encountered during both the technology development and mass production phases.
- Collaborate and manage key suppliers, including OSATs, substrate vendors, and packaging ecosystem partners, to drive technology roadmap execution and establish internal packaging.
- Domestic and International travel required.
Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.
See all Product Engineer Jobs at Google
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Product Engineer Jobs at Google.
Get Access To All JobsTips for Finding Product Engineer Jobs at Google
Align your portfolio to Google's scale
Google evaluates Product Engineers on systems design at scale, not just feature work. Before applying, rebuild your portfolio around distributed systems, API design, or platform-level projects that reflect the scope Google operates at.
Target teams that historically sponsor internationally
Google's infrastructure, Search, and Cloud product engineering teams have consistently filed for H-1B and E-3 workers. Focus your applications on teams building developer tools or internal platforms, where specialist hiring across borders is most common.
Understand which visa pathway fits your nationality
Australian citizens should push for the E-3 pathway, which skips the H-1B lottery entirely and allows Google to sponsor year-round. Singaporean nationals may qualify for the H-1B1 visa, another cap-exempt option worth discussing with your recruiter before an offer is drafted.
Ask about sponsorship before the final interview loop
Google's recruiting process moves quickly through multiple interview rounds. Confirm your visa type and Google's willingness to sponsor it before the onsite loop, so legal and HR teams aren't surprised and timelines don't slip after an offer is extended.
Find visa-sponsored Product Engineer openings on Migrate Mate
Filtering for Product Engineer roles that already have a sponsorship track record saves significant time. Migrate Mate lets you browse Google's open roles filtered by visa type, so you apply to positions where sponsorship is already confirmed rather than guessing.
Plan around USCIS processing windows before your start date
If you're subject to the H-1B cap, your earliest possible start date is October 1 of the fiscal year following your lottery selection. Work backward from that date when negotiating your offer to avoid gaps in your current status.
Frequently Asked Questions
Does Google sponsor H-1B visas for Product Engineers?
Yes, Google sponsors H-1B visas for Product Engineers. Google is a registered H-1B employer and files petitions for engineering roles across its product and infrastructure teams. If you're subject to the H-1B cap, your petition enters the annual lottery. Cap-exempt categories like H-1B1 visa and E-3 bypass the lottery and are also supported depending on your nationality.
How do I apply for Product Engineer jobs at Google?
Applications go through Google's careers portal, where Product Engineer roles are posted by team and location. The interview process typically involves a recruiter screen, technical phone interviews covering coding and systems design, and an onsite or virtual loop. You can also browse Google's open Product Engineer roles with confirmed visa sponsorship on Migrate Mate, which filters positions by visa type to match your situation.
Which visa types does Google commonly use for Product Engineers?
Google sponsors H-1B visas for most internationally hired Product Engineers, and also supports the H-1B1 visa for Singaporean and Chilean nationals and the E-3 for Australian citizens. The E-3 and H-1B1 are cap-exempt, meaning Google can file petitions year-round without lottery exposure. Green Card sponsorship through the EB-2 or EB-3 categories is also available for longer-tenured employees.
What qualifications does Google expect for Product Engineer roles?
Google's Product Engineer roles typically require a bachelor's degree or higher in Computer Science, Software Engineering, or a related field, which is the standard USCIS specialty occupation threshold for H-1B eligibility. Beyond the degree, Google screens heavily on systems design, coding proficiency in languages like Go, Java, or Python, and evidence of cross-functional product collaboration at meaningful scale.
How do I time my H-1B sponsorship with Google's hiring process?
USCIS opens H-1B registration each March for the following October 1 start date. If Google extends an offer and you need H-1B sponsorship, your recruiter and Google's immigration counsel will file during that window. If you miss a cycle, you may need to bridge on OPT, a cap-exempt status, or defer your start date by a full year, so timing conversations with your recruiter early matters.