Cloud Software Engineer Jobs at Qualcomm with Visa Sponsorship
Cloud Software Engineer jobs at Qualcomm involve building and scaling infrastructure powering next-generation connected devices and platforms. The company has a well-established process for sponsoring work visas across multiple categories, making it a realistic target for international engineers at various stages of their U.S. career.
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Get Access To All JobsCompany:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
About the role
Qualcomm's Cloud Business Unit is building next-generation AI inference rack scale solutions, anchored by the AI200/AI250 accelerator family. We are seeking a seasoned Senior Director to lead the end-to-end hardware architecture, design, and delivery of full rack-level solutions — from OCP/Open Rack-compliant chassis, power, and thermal systems to high-speed interconnects, management infrastructure, and ODM engagement. This leader will define Qualcomm's rack-scale differentiation strategy and drive execution across cross-functional hardware and systems teams.
Key Responsibilities
Rack Architecture & System Design:
- Define and own end-to-end rack-scale architecture for Qualcomm AI accelerator platforms (AI200/AI250 family and future roadmap), targeting OCP Open Rack and 19" EIA form factors.
- Lead system-level design trade-offs spanning power delivery (48V DC busbar, rack PDU), cooling architecture, signal integrity, and mechanical integration.
Thermal & Cooling Systems:
- Architect and oversee direct liquid cooling (DLC) systems including CDU sizing (e.g., 138+ kW per rack), blind-mate manifolds (UQD/UQDB), cold plates, leak detection, and coolant loop design.
- Ensure rack-level thermal validation and compliance with customer facility requirements (CDU inlet temperature, flow rate, pressure drop).
Power Architecture:
- Define rack power delivery architectures including 48V DC busbars, modular PSU shelves and VR/PMIC integration.
- Drive power budget analysis across full rack configurations (compute blades, switches, storage, CDU) and ensure PUE/efficiency targets are met.
High-Speed Interconnects & Networking:
- Lead rack-scale interconnect strategy encompassing CXL, UALink, PCIe Gen 6, and 800G/1.6T Ethernet switching fabrics (scale-up and scale-out).
- Own signal integrity requirements for high-performance PCB materials and rack-level cabling (copper and optical), including material trade-off analysis.
BMC / RMC & Rack Management:
- Define and drive BMC/RMC architecture for OOB management, Redfish/IPMI compliance, telemetry, and health monitoring.
- Ensure DC-SCM 2.0 integration and multi-generation firmware roadmap aligned with OCP standards.
ODM & Ecosystem Engagement:
- Lead technical engagement with ODM/OEM partners for rack-level NRE, design validation, manufacturing, and qualification.
- Partner with hyperscaler customers and CSPs to align rack-scale hardware solutions to datacenter facility and operational requirements.
Cross-Functional Leadership & Execution:
- Build, mentor, and lead a high-performance team of rack-scale hardware, thermal, power, and mechanical engineers across multiple sites.
- Partner with ASIC, software, product management, and supply chain teams to drive rack-level productization milestones from concept to NPI.
- Own rack-level hardware validation and EVT/DVT/PVT planning, coordinating with QA and customer enablement teams.
- Manage rack-scale program budgets, headcount planning, and delivery schedules in alignment with Cloud BU product roadmap.
Experience
- 20+ years of experience in hardware engineering, with at least 5 years in a senior leadership role (Director or above).
- Proven track record of delivering rack-scale or full-system hardware platforms for cloud/data center markets.
- Deep expertise in OCP Open Rack v3 (ORv3) standards, OCP DC-MHS, DC-SCM, and related specifications.
- Hands-on experience with direct liquid cooling (DLC) system design and thermal architecture at the rack level.
- Strong background in high-speed digital design (PCIe Gen5/6, CXL, UALink, Ethernet 400G/800G) and signal integrity.
- Experience with rack-level power architecture including 48V DC distribution, VR/PMIC design, and efficiency optimization.
- Familiarity with BMC/RMC platforms, Redfish API, IPMI, and OCP management stack.
- Experience managing ODM/OEM partnerships for large-scale hardware development and qualifications.
Minimum Qualifications:
- Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$249,900.00 - $374,900.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
About the role
Qualcomm's Cloud Business Unit is building next-generation AI inference rack scale solutions, anchored by the AI200/AI250 accelerator family. We are seeking a seasoned Senior Director to lead the end-to-end hardware architecture, design, and delivery of full rack-level solutions — from OCP/Open Rack-compliant chassis, power, and thermal systems to high-speed interconnects, management infrastructure, and ODM engagement. This leader will define Qualcomm's rack-scale differentiation strategy and drive execution across cross-functional hardware and systems teams.
Key Responsibilities
Rack Architecture & System Design:
- Define and own end-to-end rack-scale architecture for Qualcomm AI accelerator platforms (AI200/AI250 family and future roadmap), targeting OCP Open Rack and 19" EIA form factors.
- Lead system-level design trade-offs spanning power delivery (48V DC busbar, rack PDU), cooling architecture, signal integrity, and mechanical integration.
Thermal & Cooling Systems:
- Architect and oversee direct liquid cooling (DLC) systems including CDU sizing (e.g., 138+ kW per rack), blind-mate manifolds (UQD/UQDB), cold plates, leak detection, and coolant loop design.
- Ensure rack-level thermal validation and compliance with customer facility requirements (CDU inlet temperature, flow rate, pressure drop).
Power Architecture:
- Define rack power delivery architectures including 48V DC busbars, modular PSU shelves and VR/PMIC integration.
- Drive power budget analysis across full rack configurations (compute blades, switches, storage, CDU) and ensure PUE/efficiency targets are met.
High-Speed Interconnects & Networking:
- Lead rack-scale interconnect strategy encompassing CXL, UALink, PCIe Gen 6, and 800G/1.6T Ethernet switching fabrics (scale-up and scale-out).
- Own signal integrity requirements for high-performance PCB materials and rack-level cabling (copper and optical), including material trade-off analysis.
BMC / RMC & Rack Management:
- Define and drive BMC/RMC architecture for OOB management, Redfish/IPMI compliance, telemetry, and health monitoring.
- Ensure DC-SCM 2.0 integration and multi-generation firmware roadmap aligned with OCP standards.
ODM & Ecosystem Engagement:
- Lead technical engagement with ODM/OEM partners for rack-level NRE, design validation, manufacturing, and qualification.
- Partner with hyperscaler customers and CSPs to align rack-scale hardware solutions to datacenter facility and operational requirements.
Cross-Functional Leadership & Execution:
- Build, mentor, and lead a high-performance team of rack-scale hardware, thermal, power, and mechanical engineers across multiple sites.
- Partner with ASIC, software, product management, and supply chain teams to drive rack-level productization milestones from concept to NPI.
- Own rack-level hardware validation and EVT/DVT/PVT planning, coordinating with QA and customer enablement teams.
- Manage rack-scale program budgets, headcount planning, and delivery schedules in alignment with Cloud BU product roadmap.
Experience
- 20+ years of experience in hardware engineering, with at least 5 years in a senior leadership role (Director or above).
- Proven track record of delivering rack-scale or full-system hardware platforms for cloud/data center markets.
- Deep expertise in OCP Open Rack v3 (ORv3) standards, OCP DC-MHS, DC-SCM, and related specifications.
- Hands-on experience with direct liquid cooling (DLC) system design and thermal architecture at the rack level.
- Strong background in high-speed digital design (PCIe Gen5/6, CXL, UALink, Ethernet 400G/800G) and signal integrity.
- Experience with rack-level power architecture including 48V DC distribution, VR/PMIC design, and efficiency optimization.
- Familiarity with BMC/RMC platforms, Redfish API, IPMI, and OCP management stack.
- Experience managing ODM/OEM partnerships for large-scale hardware development and qualifications.
Minimum Qualifications:
- Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$249,900.00 - $374,900.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
See all 42+ Cloud Software Engineer Jobs at Qualcomm
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Cloud Software Engineer Jobs at Qualcomm.
Get Access To All JobsTips for Finding Cloud Software Engineer Jobs at Qualcomm
Align your skills with Qualcomm's cloud stack
Qualcomm's cloud engineering roles center on distributed systems, Kubernetes, and multi-cloud environments supporting chipset and platform development. Frame your resume around infrastructure at scale and CI/CD pipelines rather than general software development.
Confirm your visa category before applying
Qualcomm sponsors several visa types for this role, including H-1B, TN, and F-1 OPT. Knowing which category applies to you before you apply helps you ask the right questions during recruiter screening and avoids delays later.
Start OPT applications at least 90 days early
USCIS requires F-1 students to file OPT applications up to 90 days before their program end date. Qualcomm's onboarding timelines for engineering roles can be tight, so missing this window can push your start date past what the team will accommodate.
Prepare for a specialty occupation explanation
H-1B approval for Cloud Software Engineer roles requires demonstrating that the position demands a specific bachelor's degree or higher. Document how your degree in computer science, information systems, or a related field directly maps to the responsibilities in Qualcomm's job description.
Search for open roles using Migrate Mate
Filtering for Cloud Software Engineer positions at companies with a strong H-1B sponsorship track record saves significant time. Use Migrate Mate to surface Qualcomm's current openings and sponsorship history before investing in a full application.
Request an offer letter before your grace period expires
If you're in the 60-day grace period after a previous job ends, Qualcomm's hiring timeline for technical roles can stretch several weeks. Confirm the offer and target start date explicitly so your attorney can determine whether a cap-gap or bridge filing is needed.
Frequently Asked Questions
Does Qualcomm sponsor H-1B visas for Cloud Software Engineers?
Yes, Qualcomm sponsors H-1B visas for Cloud Software Engineer roles. The company participates in the annual H-1B lottery each April and files cap-exempt petitions where eligible. Cloud Software Engineer is a recognized specialty occupation, so your application will need to show a direct connection between your degree and the specific technical responsibilities in the role.
How do I apply for Cloud Software Engineer jobs at Qualcomm?
Applications go through Qualcomm's careers portal, where roles are listed by function and location. You can also browse current Cloud Software Engineer openings at Qualcomm filtered by sponsorship eligibility on Migrate Mate. Tailor your resume to Qualcomm's cloud infrastructure work, highlight distributed systems experience, and confirm your visa status early in the recruiter conversation to avoid surprises.
Which visa types does Qualcomm use for Cloud Software Engineer roles?
Qualcomm sponsors multiple visa categories for this role, including H-1B, H-1B1 visa for Chilean and Singaporean nationals, TN visa for Canadian and Mexican professionals, F-1 OPT and CPT for students, J-1 visa for exchange visitors, and EB-2 and EB-3 immigrant visas for permanent residence pathways. The right category depends on your nationality, degree, and where you are in your career.
What qualifications does Qualcomm expect for Cloud Software Engineer roles?
Most Cloud Software Engineer postings at Qualcomm require a bachelor's degree or higher in computer science, electrical engineering, or a closely related field. Hands-on experience with cloud platforms such as AWS, Azure, or Google Cloud, container orchestration, and automation tooling is consistently emphasized. For H-1B purposes, your degree must align specifically with the duties listed in the role, not just the engineering field broadly.
How long does the H-1B sponsorship process take at a company like Qualcomm?
For cap-subject H-1B petitions, USCIS opens registration in March and selects petitions by late March. If selected, the employer files the full petition between April and June, with an October 1 start date. Standard processing takes three to five months after filing. Premium processing, which USCIS currently adjudicates within 15 business days, is an option employers can use to accelerate approval.