Manufacturing Engineer Jobs at Broadcom with Visa Sponsorship
Broadcom hires Manufacturing Engineers across semiconductor and hardware product lines, with roles spanning process engineering, yield optimization, and production scale-up. The company has an established sponsorship track record for this function, supporting candidates through employer-sponsored visa pathways from offer through filing.
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Get Access To All JobsINTRODUCTION
Broadcom OSD is looking for an IC Substrate and Package/Interposer Layout Engineer. In the role, you will have primary responsibility for the layout, routing, and functionality of packages and substrates, including design of high-speed lines. Expertise with design tools, such as Calibre/Klayout and Cadence tools (e.g. Allegro Package Design, Innovus, and Virtuoso) is required.
In this role you will work closely with other core members of the design team, mechanical engineers, electrical engineers, power/signal integrity engineers, and project managers. Peer reviews of substrate/package designs is also an important element of the role. You will work with substrate/package vendors to define layout/panel/stack-up design and other specifications. In addition to the front end layout work, you will also help evaluate the parts when they come back from the fab. This includes visual inspection, electrical functionality, and characterization of the high speed electrical lines.
Responsibilities:
- Design and layout advanced substrates and IC packages
- Develop and utilize a script-based layout tools
- Collaborate with design and verification teams to ensure layout meets specifications and performance requirements
- Perform design rule checking (DRC) and layout vs schematic (LVS) check
- Contribute to the development and improvement of layout methodologies and flows
BASIC QUALIFICATIONS:
- Bachelors degree in Material Science/ Electrical/ Computer/Mechanical Engineering or related science/engineering degree with at least 12 years experience
- Or Masters degree and 10+ years of related experience or PhD and 7+ years of related experience
- Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA) tools
- Broad understanding of multilayer high speed rf-design, package/substrate manufacturing processes and materials, and surface mount technology
- Simulations of designs and improvement suggestions
COMPENSATION AND BENEFITS
The annual base salary range for this position is $141,300 - $226,000.
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
INTRODUCTION
Broadcom OSD is looking for an IC Substrate and Package/Interposer Layout Engineer. In the role, you will have primary responsibility for the layout, routing, and functionality of packages and substrates, including design of high-speed lines. Expertise with design tools, such as Calibre/Klayout and Cadence tools (e.g. Allegro Package Design, Innovus, and Virtuoso) is required.
In this role you will work closely with other core members of the design team, mechanical engineers, electrical engineers, power/signal integrity engineers, and project managers. Peer reviews of substrate/package designs is also an important element of the role. You will work with substrate/package vendors to define layout/panel/stack-up design and other specifications. In addition to the front end layout work, you will also help evaluate the parts when they come back from the fab. This includes visual inspection, electrical functionality, and characterization of the high speed electrical lines.
Responsibilities:
- Design and layout advanced substrates and IC packages
- Develop and utilize a script-based layout tools
- Collaborate with design and verification teams to ensure layout meets specifications and performance requirements
- Perform design rule checking (DRC) and layout vs schematic (LVS) check
- Contribute to the development and improvement of layout methodologies and flows
BASIC QUALIFICATIONS:
- Bachelors degree in Material Science/ Electrical/ Computer/Mechanical Engineering or related science/engineering degree with at least 12 years experience
- Or Masters degree and 10+ years of related experience or PhD and 7+ years of related experience
- Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA) tools
- Broad understanding of multilayer high speed rf-design, package/substrate manufacturing processes and materials, and surface mount technology
- Simulations of designs and improvement suggestions
COMPENSATION AND BENEFITS
The annual base salary range for this position is $141,300 - $226,000.
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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Get Access To All JobsTips for Finding Manufacturing Engineer Jobs at Broadcom Jobs
Align your resume to process engineering outcomes
Broadcom's Manufacturing Engineer roles emphasize yield improvement, process qualification, and failure analysis. Tailor your resume to quantify process changes you've driven, not just responsibilities held. Hiring managers in semiconductor manufacturing respond to measurable production impact.
Target roles in semiconductor fabrication and packaging
Broadcom's manufacturing footprint spans chip fabrication, advanced packaging, and ASIC production. Filter your applications toward these product lines, where visa sponsorship for Manufacturing Engineers has historically been part of the hiring motion, not an exception.
Confirm OPT STEM extension eligibility before applying
Manufacturing Engineering at a semiconductor company like Broadcom typically qualifies under STEM OPT extension, giving F-1 holders up to three years of work authorization. Verify your degree's CIP code meets STEM designation criteria before relying on this timeline in your job search.
Get employer confirmation on H-1B cap timing early
H-1B cap registration opens in March for an October 1 start date. If you're starting the hiring process in summer or fall, ask Broadcom's recruiting team directly whether they'll support a cap-year filing or bridge your authorization another way in the interim.
Understand how PERM affects Green Card timelines
EB-2 and EB-3 Green Card sponsorship for Manufacturing Engineers requires PERM labor certification through DOL, which can take 12 to 18 months before the I-140 petition is even filed. Ask about Broadcom's standard practice for initiating PERM once you're in a permanent role.
Find Broadcom Manufacturing Engineer openings on Migrate Mate
Broadcom posts Manufacturing Engineer roles across multiple locations and product divisions. Use Migrate Mate to filter specifically for openings that support your visa type, so you're applying to positions where sponsorship is already confirmed rather than asking after the fact.
Manufacturing Engineer at Broadcom jobs are hiring across the US. Find yours.
Find Manufacturing Engineer at Broadcom JobsFrequently Asked Questions
Does Broadcom sponsor H-1B visas for Manufacturing Engineers?
Yes, Broadcom sponsors H-1B visas for Manufacturing Engineers. The company has a consistent track record of supporting employer-sponsored visa filings for engineering roles, including this function. If you're on OPT or another nonimmigrant status, raise sponsorship intent early in the recruiting process so both sides can align on cap timing and filing deadlines.
Which visa types does Broadcom commonly use for Manufacturing Engineers?
Broadcom uses H-1B as the primary work visa for Manufacturing Engineers, along with Green Card sponsorship through EB-2 and EB-3 pathways requiring PERM labor certification. F-1 OPT and CPT are also supported for students and recent graduates. TN visa holders from Canada and Mexico in qualifying engineering roles may also be eligible.
What qualifications does Broadcom expect for Manufacturing Engineer roles?
Most Manufacturing Engineer openings at Broadcom require a bachelor's degree or higher in Electrical Engineering, Materials Science, Chemical Engineering, or a related field. Hands-on experience with semiconductor fabrication, process integration, or yield engineering is typically expected. Roles in advanced packaging or ASIC production may require familiarity with specific deposition, etch, or metrology processes.
How do I apply for Manufacturing Engineer jobs at Broadcom?
You can search and apply for Manufacturing Engineer roles at Broadcom through Migrate Mate, which filters openings by visa sponsorship type so you can confirm eligibility before applying. When applying, emphasize process engineering experience tied to specific manufacturing outcomes. Reach out to Broadcom's technical recruiting team early if you need clarity on sponsorship support for your specific visa situation.
How do I manage visa timing when starting a Manufacturing Engineer role at Broadcom?
H-1B cap registration happens once per year in March, with employment starting October 1 at the earliest. If you receive an offer outside that window, Broadcom may bridge your status using OPT STEM extension or another nonimmigrant category if you qualify. Confirm the intended sponsorship pathway during the offer stage, not after signing, so USCIS filing deadlines don't create gaps in your work authorization.
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