Electronics H-1B Sponsorship Jobs in Oregon
Oregon's electronics sector spans semiconductor fabrication, hardware engineering, and advanced manufacturing, with major employers like Intel, Lattice Semiconductor, and Precision Castparts anchoring hiring in the Portland metro and Hillsboro corridor. Many of these companies have established H-1B visa sponsorship programs, making Oregon one of the more active states for electronics visa sponsorship on the West Coast.
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Job Description:
Note: This role is only open to external candidates with industry dry etch experience from leading equipment suppliers or advanced foundries. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance. This role requires regular onsite presence to fulfill essential job responsibilities.
- Drives technology development for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
- Own and drive development of next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.
- Performs pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap.
- Provide technical leadership for cross functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions.
- Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle.
- Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems).
- Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture).
- Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment.
- Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders.
- Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
- Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
Qualifications
Minimum Qualifications
- PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience.
Or
- Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience.
Or
- Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 8+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience.
Relevant recent experience includes, but is not limited to:
- Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization.
- Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.
- Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes at foundry or suppliers.
- Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data-based decisions.
Preferred Qualifications:
- 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies.
- Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.
- Demonstrated ability to manage complex process challenges and provide solutions such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion.
- Strong understanding of logic BEOL interconnects and their etch integration requirements.
- Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation.
- Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving.
- Proven ability to lead technical problem solving across projects, influencing peers and stakeholders without formal people management responsibility.
- Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization.
- Strong collaboration and problem-solving skills to work effectively in cross-disciplinary teams.
- Proven ability to communicate technical data and concepts to both technical and non-technical audiences.
Join Intel's dynamic team and contribute to groundbreaking advancements in technology. Help us shape the future today.
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
- Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION:
Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Job Details
Job Description:
Note: This role is only open to external candidates with industry dry etch experience from leading equipment suppliers or advanced foundries. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance. This role requires regular onsite presence to fulfill essential job responsibilities.
- Drives technology development for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
- Own and drive development of next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.
- Performs pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap.
- Provide technical leadership for cross functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions.
- Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle.
- Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems).
- Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture).
- Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment.
- Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders.
- Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
- Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
Qualifications
Minimum Qualifications
- PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience.
Or
- Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience.
Or
- Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 8+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience.
Relevant recent experience includes, but is not limited to:
- Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization.
- Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.
- Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes at foundry or suppliers.
- Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data-based decisions.
Preferred Qualifications:
- 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies.
- Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.
- Demonstrated ability to manage complex process challenges and provide solutions such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion.
- Strong understanding of logic BEOL interconnects and their etch integration requirements.
- Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation.
- Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving.
- Proven ability to lead technical problem solving across projects, influencing peers and stakeholders without formal people management responsibility.
- Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization.
- Strong collaboration and problem-solving skills to work effectively in cross-disciplinary teams.
- Proven ability to communicate technical data and concepts to both technical and non-technical audiences.
Join Intel's dynamic team and contribute to groundbreaking advancements in technology. Help us shape the future today.
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
- Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION:
Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
H-1B Electronics Job Roles in Oregon
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Search Electronics Jobs in OregonElectronics H-1B Sponsorship Jobs in Oregon: Frequently Asked Questions
Which electronics companies sponsor H-1B visas in Oregon?
Intel is the largest H-1B visa sponsor in Oregon's electronics sector, with significant operations in Hillsboro. Lattice Semiconductor, Daimler Trucks North America (electronics engineering), and Epson Portland also appear in Department of Labor LCA disclosure data for Oregon electronics roles. Smaller semiconductor and hardware design firms in the Portland metro area have also filed H-1B petitions, though sponsorship volume varies by company and year.
Which cities in Oregon have the most electronics H-1B sponsorship jobs?
The Portland metropolitan area, particularly Hillsboro and Beaverton, concentrates the majority of Oregon's electronics H-1B sponsorship activity. Intel's Hillsboro campus alone accounts for a substantial share of the state's semiconductor-related LCA filings. Portland proper also has hardware and electronics engineering employers. Eugene and Corvallis see smaller volumes, often tied to university-adjacent tech firms or manufacturers with regional operations.
What types of electronics roles typically qualify for H-1B sponsorship?
Roles that require at least a bachelor's degree in a directly related field are the baseline for H-1B specialty occupation eligibility. In electronics, this commonly includes hardware design engineers, semiconductor process engineers, embedded systems engineers, PCB layout engineers, and test engineers with degrees in electrical engineering, electronics engineering, or computer engineering. Roles where any general degree satisfies the requirement, regardless of field, are harder to qualify under the specialty occupation standard.
How do I find electronics H-1B sponsorship jobs in Oregon?
Migrate Mate filters job listings specifically by visa type and industry, so you can browse electronics H-1B sponsorship jobs in Oregon without manually screening each posting. This is more efficient than searching general job boards where sponsorship status is rarely disclosed upfront. On Migrate Mate, listings are tagged by visa category, letting you focus your applications on employers actively sponsoring H-1B workers in Oregon's electronics sector.
Are there any Oregon-specific considerations for H-1B sponsorship in electronics?
Oregon's concentration of semiconductor manufacturing, particularly in Washington County, means many H-1B petitions in the state involve production and fabrication environments rather than purely office-based engineering. Employers in fab settings may require specific prevailing wage determinations tied to the Hillsboro or Portland metropolitan statistical area. Oregon also has no state income tax, which some international workers factor into relocation decisions, though this does not affect the H-1B process itself.
What is the prevailing wage for H-1B electronics jobs in Oregon?
U.S. employers sponsoring a visa must pay at least the prevailing wage, which is what workers in the same role, area, and experience level typically earn. The Department of Labor sets this rate to make sure companies aren't hiring foreign workers simply because they'd accept lower pay than a U.S. worker. It varies by job title, location, and experience. You can look up current prevailing wage rates for any occupation and location using the OFLC Wage Search page.