Development Manager Jobs in USA with Visa Sponsorship
Development managers lead software engineering teams and drive product delivery at Google, Amazon, Meta, Microsoft, and hundreds of growth-stage companies, with the role qualifying as one of the strongest H-1B visa specialty occupations because it requires CS or engineering degrees and combines people management with technical architecture decisions. L-1A managerial transfers from international engineering offices provide a second powerful pathway with no lottery and a direct route to EB-1C green card sponsorship.
See All Development Manager JobsOverview
Showing 5 of 26,122+ Development Manager jobs


Have you applied for this role?


Have you applied for this role?


Have you applied for this role?


Have you applied for this role?


Have you applied for this role?
See all 26,122+ Development Manager jobs
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Development Manager roles.
Get Access To All Jobs
Job Details:
Job Description:
The Role and Impact
Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging solutions. This role will drive the development and implementation of dry etch processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB (Embedded Multi-die Interconnect Bridge) technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in plasma physics and etch system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.
Key Responsibilities
- Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
- Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
- Oversee development of production-worthy etch processes for high-volume manufacturing
- Foster talent development for critical technical roles, and drive technical excellence and innovation within the etch team
- Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams
- Drive dry etch module and segment related yield improvement initiatives and defect reduction programs
- Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing
The candidate should exhibit the following behavioral traits:
- Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.
- Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- 10+ years of relevant experience with a master's degree, 8+ years or experience with a PhD degree.
The experience listed above should include a combination of the following qualifications:
- Plasma physics experience and hands-on experience working with various etch platform (ICP, CCP, RIE systems).
- Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.
- Experience in the semiconductor industry.
Preferred Qualifications
- Demonstrated ability to build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.
- Experience with vendor relations, including material quality assessments and performance management.
- Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies.
Join Intel and be a driving force in revolutionizing the future of semiconductor packaging. Apply today to inspire innovation and create a lasting impact.
Job Type: Experienced Hire
Shift: Shift 1 (United States of America)
Primary Location: US, Oregon, Hillsboro
Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Job Details:
Job Description:
The Role and Impact
Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging solutions. This role will drive the development and implementation of dry etch processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB (Embedded Multi-die Interconnect Bridge) technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in plasma physics and etch system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.
Key Responsibilities
- Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
- Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
- Oversee development of production-worthy etch processes for high-volume manufacturing
- Foster talent development for critical technical roles, and drive technical excellence and innovation within the etch team
- Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams
- Drive dry etch module and segment related yield improvement initiatives and defect reduction programs
- Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing
The candidate should exhibit the following behavioral traits:
- Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.
- Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- 10+ years of relevant experience with a master's degree, 8+ years or experience with a PhD degree.
The experience listed above should include a combination of the following qualifications:
- Plasma physics experience and hands-on experience working with various etch platform (ICP, CCP, RIE systems).
- Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.
- Experience in the semiconductor industry.
Preferred Qualifications
- Demonstrated ability to build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.
- Experience with vendor relations, including material quality assessments and performance management.
- Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies.
Join Intel and be a driving force in revolutionizing the future of semiconductor packaging. Apply today to inspire innovation and create a lasting impact.
Job Type: Experienced Hire
Shift: Shift 1 (United States of America)
Primary Location: US, Oregon, Hillsboro
Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
See all 26,122+ Development Manager jobs
Sign up for free to unlock all listings, filter by visa type, and get alerts for new Development Manager roles.
Get Access To All JobsTips for Finding Visa Sponsorship as a Development Manager
FAANG Companies Sponsor Development Managers Routinely
Google, Amazon, Meta, Apple, and Microsoft file thousands of H-1B petitions annually and process development manager sponsorship as standard practice alongside software engineers. Your visa status will not be a differentiating factor in hiring decisions at these companies.
L-1A Provides the Strongest Long-Term Immigration Path
If you manage an engineering team at a multinational tech company's international office, L-1A managerial transfer has no lottery, no cap, and a direct path to EB-1C green card that skips PERM entirely. Google, Amazon, and Microsoft transfer development managers from London, Bangalore, and Dublin through this pathway regularly.
Growth-Stage Startups Sponsor Aggressively
Companies post-Series B like Databricks, Figma, Anthropic, Notion, and Vercel sponsor development managers and offer $150,000 to $220,000 base with significant equity. These companies need engineering leadership to scale their teams and will invest in sponsorship for experienced managers.
Full-Stack and Infrastructure Management Commands the Highest Demand
Development managers overseeing backend, infrastructure, platform, and ML engineering teams are in the most acute shortage. Companies sponsor most aggressively for managers who can hire and lead engineers in distributed systems, cloud infrastructure, and AI/ML disciplines.
Build a Visible Technical Leadership Profile
Patents, open-source contributions, conference talks, and published technical content support O-1 extraordinary ability classification, which bypasses the H-1B lottery. Even if you pursue H-1B, a public technical profile strengthens your candidacy because engineering leaders at top companies actively source candidates with visible contributions.
TN Engineer Category Works for Canadian and Mexican Managers
The Engineer category on the USMCA treaty list covers software development management roles for Canadian and Mexican citizens. TN has no lottery, renews indefinitely in three-year increments, and Canadians can apply at the border for same-day approval.
Development Manager jobs are hiring across the US. Find yours.
Find Development Manager JobsFrequently Asked Questions
Do tech companies sponsor H-1B visas for Development Managers?
Yes, extensively. Google, Amazon, Meta, Apple, Microsoft, Netflix, and Stripe sponsor development managers routinely because the role clearly requires a CS or engineering degree and involves technical leadership. These companies have dedicated immigration teams that handle the process at scale.
What is the typical compensation for sponsored Development Manager roles?
Development managers at major tech companies earn $200,000 to $320,000 in total compensation at the M1/L6 level. Senior development managers earn $300,000 to $420,000. Directors of engineering earn $400,000 to $600,000 with equity at FAANG companies.
What qualifications do Development Manager roles require?
A CS or software engineering degree is the baseline, with most managers having 8 to 12 years of total experience including 2 to 3 years of direct people management. Demonstrated ability to hire, develop, and retain engineers is weighted as heavily as technical depth. Experience scaling teams through rapid growth differentiates senior candidates.
Is L-1A better than H-1B for Development Manager sponsorship?
For managers at multinational companies, often yes. L-1A has no lottery, no annual cap, and provides a direct path to EB-1C green card that skips PERM labor certification. It requires at least one year managing a team at the company's foreign office.
How to find Development Manager jobs with visa sponsorship?
To find Development Manager positions with visa sponsorship, use Migrate Mate, which specializes in connecting international candidates with sponsoring employers. Focus your search on tech companies, software firms, and multinational corporations that commonly sponsor H-1B, L-1, or O-1 visas for development leadership roles. These employers typically have established immigration processes and actively recruit international talent for managerial positions.
What is the career progression for a sponsored Development Manager?
The path moves from development manager to senior manager to director to VP of engineering. Directors at major tech companies earn $400,000 to $600,000 with equity. Some managers transition to CTO roles at startups, principal engineer IC tracks, or venture capital operating partner positions.
See which Development Manager employers are hiring and sponsoring visas right now.
Search Development Manager Jobs